GB992963A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB992963A
GB992963A GB29585/61A GB2958561A GB992963A GB 992963 A GB992963 A GB 992963A GB 29585/61 A GB29585/61 A GB 29585/61A GB 2958561 A GB2958561 A GB 2958561A GB 992963 A GB992963 A GB 992963A
Authority
GB
United Kingdom
Prior art keywords
mesa
junction
semi
further embodiment
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB29585/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB992963A publication Critical patent/GB992963A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
GB29585/61A 1961-01-16 1961-08-16 Semiconductor devices Expired GB992963A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82895A US3116443A (en) 1961-01-16 1961-01-16 Semiconductor device

Publications (1)

Publication Number Publication Date
GB992963A true GB992963A (en) 1965-05-26

Family

ID=22174140

Family Applications (1)

Application Number Title Priority Date Filing Date
GB29585/61A Expired GB992963A (en) 1961-01-16 1961-08-16 Semiconductor devices

Country Status (8)

Country Link
US (1) US3116443A (enExample)
BE (1) BE612543A (enExample)
CH (1) CH389785A (enExample)
DE (1) DE1300165B (enExample)
ES (1) ES273893A1 (enExample)
FR (1) FR1307591A (enExample)
GB (1) GB992963A (enExample)
NL (2) NL270369A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141135A (en) 1975-10-14 1979-02-27 Thomson-Csf Semiconductor process using lapped substrate and lapped low resistivity semiconductor carrier
WO1980001334A1 (fr) * 1978-12-23 1980-06-26 Semikron Gleichrichterbau Dispositif semiconducteur

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE636317A (enExample) * 1962-08-23 1900-01-01
US3331995A (en) * 1964-02-25 1967-07-18 Hughes Aircraft Co Housed semiconductor device with thermally matched elements
US3388301A (en) * 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3297921A (en) * 1965-04-15 1967-01-10 Int Rectifier Corp Controlled rectifier having shunted emitter formed by a nickel layer underneath an aluminum layer
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
GB2096564A (en) * 1981-04-10 1982-10-20 Shionogi Seiyaku Kk Vial
US5416354A (en) * 1989-01-06 1995-05-16 Unitrode Corporation Inverted epitaxial process semiconductor devices
DE69318640T2 (de) * 1992-01-27 1998-09-10 Harris Corp Halbleitervorrichtung mit einem halbleitersubstrat und einer keramischen scheibe als decke

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874340A (en) * 1953-06-26 1959-02-17 Sprague Electric Co Rectifying contact
US2789258A (en) * 1955-06-29 1957-04-16 Raytheon Mfg Co Intrinsic coatings for semiconductor junctions
NL101253C (enExample) * 1955-09-12
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
US3110080A (en) * 1958-01-20 1963-11-12 Westinghouse Electric Corp Rectifier fabrication
US2921245A (en) * 1958-10-08 1960-01-12 Int Rectifier Corp Hermetically sealed junction means
BE584431A (enExample) * 1959-02-09
NL254726A (enExample) * 1959-08-11
NL256633A (enExample) * 1959-10-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141135A (en) 1975-10-14 1979-02-27 Thomson-Csf Semiconductor process using lapped substrate and lapped low resistivity semiconductor carrier
WO1980001334A1 (fr) * 1978-12-23 1980-06-26 Semikron Gleichrichterbau Dispositif semiconducteur
US4525924A (en) * 1978-12-23 1985-07-02 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik Method for producing a plurality of semiconductor circuits

Also Published As

Publication number Publication date
CH389785A (de) 1965-03-31
NL270369A (enExample)
FR1307591A (fr) 1962-10-26
ES273893A1 (es) 1962-06-01
US3116443A (en) 1963-12-31
BE612543A (fr) 1962-05-02
DE1300165B (de) 1969-07-31
NL125803C (enExample)

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