GB9928115D0 - Multichip module - Google Patents

Multichip module

Info

Publication number
GB9928115D0
GB9928115D0 GBGB9928115.6A GB9928115A GB9928115D0 GB 9928115 D0 GB9928115 D0 GB 9928115D0 GB 9928115 A GB9928115 A GB 9928115A GB 9928115 D0 GB9928115 D0 GB 9928115D0
Authority
GB
United Kingdom
Prior art keywords
multichip module
multichip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9928115.6A
Other versions
GB2344217A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9928115D0 publication Critical patent/GB9928115D0/en
Publication of GB2344217A publication Critical patent/GB2344217A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
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    • H01L2224/05554—Shape in top view being square
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Wire Bonding (AREA)
GB9928115A 1998-11-27 1999-11-26 Multichip module comprising stacked semiconductor chips Withdrawn GB2344217A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10337271A JP2000164796A (en) 1998-11-27 1998-11-27 Multichip module

Publications (2)

Publication Number Publication Date
GB9928115D0 true GB9928115D0 (en) 2000-01-26
GB2344217A GB2344217A (en) 2000-05-31

Family

ID=18307049

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9928115A Withdrawn GB2344217A (en) 1998-11-27 1999-11-26 Multichip module comprising stacked semiconductor chips

Country Status (2)

Country Link
JP (1) JP2000164796A (en)
GB (1) GB2344217A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100946831B1 (en) 2001-01-31 2010-03-09 가부시키가이샤 히타치세이사쿠쇼 Data processing system and data processor
DE10136655C1 (en) * 2001-07-20 2002-08-01 Optosys Technologies Gmbh Multichip module in COB design, in particular CompactFlash card with high storage capacity and method for producing the same
JP4538830B2 (en) * 2004-03-30 2010-09-08 ルネサスエレクトロニクス株式会社 Semiconductor device
GB2416917A (en) * 2004-07-30 2006-02-08 Univ Kent Canterbury Multiple chip semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61274332A (en) * 1985-05-29 1986-12-04 Toshiba Corp Semiconductor device
JPH09186289A (en) * 1995-12-28 1997-07-15 Lucent Technol Inc Multilayer laminated integrated circuit chip assembly
WO1997037374A2 (en) * 1996-03-26 1997-10-09 Advanced Micro Devices, Inc. Method of packaging multiple integrated circuit chips in a standard semiconductor device package

Also Published As

Publication number Publication date
JP2000164796A (en) 2000-06-16
GB2344217A (en) 2000-05-31

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