GB9815579D0 - High performance heatsink - Google Patents

High performance heatsink

Info

Publication number
GB9815579D0
GB9815579D0 GB9815579A GB9815579A GB9815579D0 GB 9815579 D0 GB9815579 D0 GB 9815579D0 GB 9815579 A GB9815579 A GB 9815579A GB 9815579 A GB9815579 A GB 9815579A GB 9815579 D0 GB9815579 D0 GB 9815579D0
Authority
GB
United Kingdom
Prior art keywords
high performance
heatsink
performance heatsink
performance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9815579A
Other versions
GB2339897A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9815579A priority Critical patent/GB2339897A/en
Publication of GB9815579D0 publication Critical patent/GB9815579D0/en
Publication of GB2339897A publication Critical patent/GB2339897A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9815579A 1998-07-20 1998-07-20 A Heat sink Withdrawn GB2339897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9815579A GB2339897A (en) 1998-07-20 1998-07-20 A Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9815579A GB2339897A (en) 1998-07-20 1998-07-20 A Heat sink

Publications (2)

Publication Number Publication Date
GB9815579D0 true GB9815579D0 (en) 1998-09-16
GB2339897A GB2339897A (en) 2000-02-09

Family

ID=10835698

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9815579A Withdrawn GB2339897A (en) 1998-07-20 1998-07-20 A Heat sink

Country Status (1)

Country Link
GB (1) GB2339897A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6912128B2 (en) 2001-08-09 2005-06-28 Celestica International Inc. Electronics cooling subassembly
WO2003014633A2 (en) * 2001-08-09 2003-02-20 Celestica International Inc. Heat removal system
DE10321549A1 (en) * 2003-05-14 2004-12-02 Adam Opel Ag Arrangement for cooling a thyristor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2460631C3 (en) * 1974-12-20 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Heat sink for external cooling of thyristors
US4365665A (en) * 1978-11-17 1982-12-28 Sumitomo Precision Products Company, Ltd. Heat sink
WO1988000393A1 (en) * 1986-06-30 1988-01-14 Unisys Corporation Reduced-stress heat sink device
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules

Also Published As

Publication number Publication date
GB2339897A (en) 2000-02-09

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)