GB975827A - A semi-conductor arrangement - Google Patents

A semi-conductor arrangement

Info

Publication number
GB975827A
GB975827A GB10959/61A GB1095961A GB975827A GB 975827 A GB975827 A GB 975827A GB 10959/61 A GB10959/61 A GB 10959/61A GB 1095961 A GB1095961 A GB 1095961A GB 975827 A GB975827 A GB 975827A
Authority
GB
United Kingdom
Prior art keywords
soldered
semi
alloyed
electrodes
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB10959/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB975827A publication Critical patent/GB975827A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10Applying or generating heat or pressure or combinations thereof
    • B65B51/14Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
    • B65B51/148Hand-operated members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B67/00Apparatus or devices facilitating manual packaging operations; Sack holders
    • B65B67/08Wrapping of articles
    • B65B67/10Wrapping-tables
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/138Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Package Closures (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
GB10959/61A 1960-03-24 1961-03-24 A semi-conductor arrangement Expired GB975827A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0067712 1960-03-24
CA859031 1962-09-28

Publications (1)

Publication Number Publication Date
GB975827A true GB975827A (en) 1964-11-18

Family

ID=25673420

Family Applications (2)

Application Number Title Priority Date Filing Date
GB10959/61A Expired GB975827A (en) 1960-03-24 1961-03-24 A semi-conductor arrangement
GB40860/62A Expired GB974827A (en) 1960-03-24 1962-10-29 Heat sealing and severing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB40860/62A Expired GB974827A (en) 1960-03-24 1962-10-29 Heat sealing and severing apparatus

Country Status (3)

Country Link
CH (1) CH396215A (enExample)
DE (1) DE1250562B (enExample)
GB (2) GB975827A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004776A1 (de) * 1969-02-03 1970-09-03 Gen Electric Halbleiterbauelement
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
WO2013030001A1 (de) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Halbleiterbauelement mit einem kühlkörper
EP3382753A1 (de) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614640B1 (de) * 1967-10-26 1971-12-02 Siemens Ag Gleichrichteranordnung
GB8801245D0 (en) * 1988-01-20 1988-02-17 Lightfoot G Packaging apparatus & method
US5177931A (en) * 1989-11-20 1993-01-12 Latter Melvin R Modified sealing machine
ITMI20060303A1 (it) 2006-02-20 2007-08-21 Colibri System Spa Macchina per ricoprire articoli di vario tipo

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2004776A1 (de) * 1969-02-03 1970-09-03 Gen Electric Halbleiterbauelement
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
WO2013030001A1 (de) * 2011-08-26 2013-03-07 Robert Bosch Gmbh Halbleiterbauelement mit einem kühlkörper
EP3382753A1 (de) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation

Also Published As

Publication number Publication date
DE1250562B (enExample)
CH396215A (de) 1965-07-31
GB974827A (en) 1964-11-11

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