GB974827A - Heat sealing and severing apparatus - Google Patents

Heat sealing and severing apparatus

Info

Publication number
GB974827A
GB974827A GB4086062A GB4086062A GB974827A GB 974827 A GB974827 A GB 974827A GB 4086062 A GB4086062 A GB 4086062A GB 4086062 A GB4086062 A GB 4086062A GB 974827 A GB974827 A GB 974827A
Authority
GB
United Kingdom
Prior art keywords
heating element
sealing
cutting
plies
beneath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4086062A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PAUL MOORE CO Ltd
Original Assignee
PAUL MOORE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PAUL MOORE CO Ltd filed Critical PAUL MOORE CO Ltd
Publication of GB974827A publication Critical patent/GB974827A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10Applying or generating heat or pressure or combinations thereof
    • B65B51/14Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
    • B65B51/148Hand-operated members
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B67/00Apparatus or devices facilitating manual packaging operations; Sack holders
    • B65B67/08Wrapping of articles
    • B65B67/10Wrapping-tables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Package Closures (AREA)
  • Die Bonding (AREA)

Abstract

974,827. Seaming non-metallic sheet material; making bags. PAUL MOORE CO. Ltd. Oct. 29, 1962 [Sept. 28, 1962], No. 40860/62. Headings B5D and B5K. [Also in Division B8] Apparatus for heat sealing at least a pair of laminated plies of material partly coated with a thermoplastic material, including a planar first member having at least one elongate portion terminating, at one end thereof, in at least one extension which is at least in part disposed substantially angularly to the elongate portion; a heating element mounted on said first member; a pair of side plates mounted on said first member and extending substantially throughout the length of said heating element normally to the plane of said first member; a strip of flexible heat-resistant material draped intermediate the side plates, spaced from and covering the heating element; severing means mounted on the first member; and a second member co-operating with the first member and on which the material is placed; a selected one of said members being movable with respect to the other, whereby the heating element seals adjacent coated portions together throughout an area corresponding to the length of the heating element. In the embodiment shown in Fig. 1, the planar first or upper member 2 has a pair of spaced parallel elongate portions 4, 6 interconnected at one end by a curved extension 8 and at the other end by a member 10 provided with hand grip 12. Extending substantially throughout its length is a heating element 14 comprising a metal bar with a resistance wire therein, an outer side plate 17 and inner side plate 18. The plate 17 is formed with a sharpened edge 22 so as to act as a cutting member. Draped between the side plates 17, 18 is a strip 24 of heat resistant material such as tetrafluoroethylene. There is also a layer of tetrafluoroethylene together with a layer of heat insulating material between the element 14 and the member 2. A second member 30 constitutes a pressure pad co-operating with the first member 2 and consisting of a resilient portion covered by a layer of tetrafluoroethylene and a hardened portion, e.g. of steel on the outside thereof and having a V- shaped slot for co-operating with the cutting edge 22. In use (Fig. 4) the first member is hingedly mounted at 42 on a table bed 44, the second member 30 being secured to the bed 44 and located beneath the first member. Laminated material 48 from a reel 46 passes over and under a folding bar 54 to form upper and lower plies 56, 58 and is positioned between the first and second members. Alternatively, the material 46 may have been previously folded in half or it may be in tube form. Matter or article 60 to be packaged is placed between the two plies of material and when the heating element 14 has attained the required temperature the grip 12 is pulled downwardly, thus fusing the two plies 56, 58 beneath the heating element and severing the package from the remainder of the material. Instead of the sealing and cutting taking place simultaneously, separate sealing and cutting elements may be provided on the first member, the material being moved from beneath the sealing element after the sealing operation to beneath the cutting element. In other embodiments, different shaped members are shown for producing other shaped packages and in some the sealing and/or cutting is done in two stages by moving the material. In further embodiments arrangements are provided for forming a gusset at the bottom of the bag or package and another embodiment enables several bags to be formed in one operation. Specification 974,826 is referred to.
GB4086062A 1960-03-24 1962-10-29 Heat sealing and severing apparatus Expired GB974827A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0067712 1960-03-24
CA859031 1962-09-28

Publications (1)

Publication Number Publication Date
GB974827A true GB974827A (en) 1964-11-11

Family

ID=25673420

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1095961A Expired GB975827A (en) 1960-03-24 1961-03-24 A semi-conductor arrangement
GB4086062A Expired GB974827A (en) 1960-03-24 1962-10-29 Heat sealing and severing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1095961A Expired GB975827A (en) 1960-03-24 1961-03-24 A semi-conductor arrangement

Country Status (3)

Country Link
CH (1) CH396215A (en)
DE (1) DE1250562B (en)
GB (2) GB975827A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2214481A (en) * 1988-01-20 1989-09-06 Gerald Lightfoot Package, method of packaging and packaging apparatus
US5177931A (en) * 1989-11-20 1993-01-12 Latter Melvin R Modified sealing machine
WO2007096005A1 (en) * 2006-02-20 2007-08-30 Colibri' System S.P.A. Machine for covering various types of articles

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614640B1 (en) * 1967-10-26 1971-12-02 Siemens Ag RECTIFIER ARRANGEMENT
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE3143335A1 (en) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Semiconductor device
DE102011081687A1 (en) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Semiconductor device with a heat sink
EP3382753A1 (en) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Insulation for a multi-layer electrical circuit and method for producing an insulation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2214481A (en) * 1988-01-20 1989-09-06 Gerald Lightfoot Package, method of packaging and packaging apparatus
US5177931A (en) * 1989-11-20 1993-01-12 Latter Melvin R Modified sealing machine
WO2007096005A1 (en) * 2006-02-20 2007-08-30 Colibri' System S.P.A. Machine for covering various types of articles
US7954303B2 (en) 2006-02-20 2011-06-07 Colibri' System S.P.A. Machine for covering various types of articles

Also Published As

Publication number Publication date
GB975827A (en) 1964-11-18
CH396215A (en) 1965-07-31
DE1250562B (en)

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