GB975827A - A semi-conductor arrangement - Google Patents
A semi-conductor arrangementInfo
- Publication number
- GB975827A GB975827A GB1095961A GB1095961A GB975827A GB 975827 A GB975827 A GB 975827A GB 1095961 A GB1095961 A GB 1095961A GB 1095961 A GB1095961 A GB 1095961A GB 975827 A GB975827 A GB 975827A
- Authority
- GB
- United Kingdom
- Prior art keywords
- soldered
- semi
- alloyed
- electrodes
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
- B65B51/148—Hand-operated members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B67/00—Apparatus or devices facilitating manual packaging operations; Sack holders
- B65B67/08—Wrapping of articles
- B65B67/10—Wrapping-tables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Package Closures (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0067712 | 1960-03-24 | ||
CA859031 | 1962-09-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB975827A true GB975827A (en) | 1964-11-18 |
Family
ID=25673420
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1095961A Expired GB975827A (en) | 1960-03-24 | 1961-03-24 | A semi-conductor arrangement |
GB4086062A Expired GB974827A (en) | 1960-03-24 | 1962-10-29 | Heat sealing and severing apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4086062A Expired GB974827A (en) | 1960-03-24 | 1962-10-29 | Heat sealing and severing apparatus |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH396215A (de) |
DE (1) | DE1250562B (de) |
GB (2) | GB975827A (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2004776A1 (de) * | 1969-02-03 | 1970-09-03 | Gen Electric | Halbleiterbauelement |
DE3143335A1 (de) * | 1981-10-31 | 1983-05-11 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitervorrichtung |
WO2013030001A1 (de) * | 2011-08-26 | 2013-03-07 | Robert Bosch Gmbh | Halbleiterbauelement mit einem kühlkörper |
EP3382753A1 (de) * | 2017-03-30 | 2018-10-03 | Siemens Aktiengesellschaft | Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1614640B1 (de) * | 1967-10-26 | 1971-12-02 | Siemens Ag | Gleichrichteranordnung |
GB8801245D0 (en) * | 1988-01-20 | 1988-02-17 | Lightfoot G | Packaging apparatus & method |
US5177931A (en) * | 1989-11-20 | 1993-01-12 | Latter Melvin R | Modified sealing machine |
ITMI20060303A1 (it) | 2006-02-20 | 2007-08-21 | Colibri System Spa | Macchina per ricoprire articoli di vario tipo |
-
0
- DE DES67712A patent/DE1250562B/de active Pending
-
1961
- 1961-03-21 CH CH333661A patent/CH396215A/de unknown
- 1961-03-24 GB GB1095961A patent/GB975827A/en not_active Expired
-
1962
- 1962-10-29 GB GB4086062A patent/GB974827A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2004776A1 (de) * | 1969-02-03 | 1970-09-03 | Gen Electric | Halbleiterbauelement |
DE3143335A1 (de) * | 1981-10-31 | 1983-05-11 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleitervorrichtung |
WO2013030001A1 (de) * | 2011-08-26 | 2013-03-07 | Robert Bosch Gmbh | Halbleiterbauelement mit einem kühlkörper |
EP3382753A1 (de) * | 2017-03-30 | 2018-10-03 | Siemens Aktiengesellschaft | Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation |
Also Published As
Publication number | Publication date |
---|---|
GB974827A (en) | 1964-11-11 |
CH396215A (de) | 1965-07-31 |
DE1250562B (de) |
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