GB970428A - Improvements in or relating to methods of manufacturing semi-conductor devices - Google Patents

Improvements in or relating to methods of manufacturing semi-conductor devices

Info

Publication number
GB970428A
GB970428A GB3663/62A GB366362A GB970428A GB 970428 A GB970428 A GB 970428A GB 3663/62 A GB3663/62 A GB 3663/62A GB 366362 A GB366362 A GB 366362A GB 970428 A GB970428 A GB 970428A
Authority
GB
United Kingdom
Prior art keywords
conductor
electrode
semi
jig
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3663/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB970428A publication Critical patent/GB970428A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Processing (AREA)
GB3663/62A 1961-02-03 1962-01-31 Improvements in or relating to methods of manufacturing semi-conductor devices Expired GB970428A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL260810 1961-02-03

Publications (1)

Publication Number Publication Date
GB970428A true GB970428A (en) 1964-09-23

Family

ID=19752856

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3663/62A Expired GB970428A (en) 1961-02-03 1962-01-31 Improvements in or relating to methods of manufacturing semi-conductor devices

Country Status (5)

Country Link
US (1) US3136032A (enExample)
DE (1) DE1180851B (enExample)
ES (1) ES274223A1 (enExample)
GB (1) GB970428A (enExample)
NL (1) NL260810A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE627126A (enExample) * 1962-01-15 1900-01-01
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3409977A (en) * 1963-10-28 1968-11-12 Texas Instruments Inc Hot gas thermo-compression bonding
US3286340A (en) * 1964-02-28 1966-11-22 Philco Corp Fabrication of semiconductor units
US3451122A (en) * 1964-06-11 1969-06-24 Western Electric Co Methods of making soldered connections
US3296577A (en) * 1964-10-21 1967-01-03 Westinghouse Electric Corp Electrical connector assembly and method
US3257707A (en) * 1965-02-01 1966-06-28 Gen Dynamics Corp Electrical interconnection process
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3524247A (en) * 1969-02-11 1970-08-18 Burroughs Corp Soldering method
US3665589A (en) * 1969-10-23 1972-05-30 Nasa Lead attachment to high temperature devices
US3665590A (en) * 1970-01-19 1972-05-30 Ncr Co Semiconductor flip-chip soldering method
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
BE794970A (fr) * 1972-02-11 1973-08-06 Glaverbel Procede et dispositif de fabrication d'une unite vitree
BE794969A (fr) * 1972-02-11 1973-08-06 Glaverbel Procede et dispositif de fabrication d'une unite vitree
DE2622000A1 (de) * 1976-05-18 1977-12-01 Bosch Gmbh Robert Verfahren und vorrichtung zum anloeten eines drahtes
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4993622A (en) * 1987-04-28 1991-02-19 Texas Instruments Incorporated Semiconductor integrated circuit chip interconnections and methods
EP0292596B1 (en) * 1987-05-27 1992-09-30 Siemens-Elema AB Method of electrically connecting conductors and electrodes of an implantable electrode lead

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2877396A (en) * 1954-01-25 1959-03-10 Rca Corp Semi-conductor devices
NL199836A (enExample) * 1954-08-23 1900-01-01
NL216979A (enExample) * 1956-05-18
NL224227A (enExample) * 1957-01-29
NL112688C (enExample) * 1957-04-18 1900-01-01

Also Published As

Publication number Publication date
US3136032A (en) 1964-06-09
DE1180851B (de) 1964-11-05
NL260810A (enExample)
ES274223A1 (es) 1962-06-16

Similar Documents

Publication Publication Date Title
GB970428A (en) Improvements in or relating to methods of manufacturing semi-conductor devices
US2905873A (en) Semiconductor power devices and method of manufacture
US2784300A (en) Method of fabricating an electrical connection
GB1031436A (en) Improvements in and relating to methods of soft-soldering
US2939058A (en) Semiconductor device
US2939205A (en) Semi-conductor devices
US3197608A (en) Method of manufacture of semiconductor devices
US3297855A (en) Method of bonding
GB786281A (en) Improvements in or relating to methods of manufacturing semiconductor systems
US3666913A (en) Method of bonding a component lead to a copper etched circuit board lead
GB950849A (en) A semi-conductor device
GB878811A (en) Improvements in or relating to semi-conductor devices
GB1018873A (en) Improvements in or relating to methods of resistance welding for use, for example, in the manufacture of electronic assemblies
US2820135A (en) Method for producing electrical contact to semiconductor devices
GB1198884A (en) Silicon Semiconductor with Metal-Silicide Heterojunction
US3089067A (en) Semiconductor device
GB1098534A (en) Improvements in or relating to the manufacture of electrical components
US2874340A (en) Rectifying contact
US2629803A (en) Titanium electrode
GB855381A (en) Semiconductor device
US3030693A (en) Method of producing transistor devices
GB1168345A (en) Header for a Semiconductor Device
US2987597A (en) Electrical component assembly
GB776085A (en) Improvements in or relating to semi-conductor devices
GB930352A (en) Improvements in or relating to semi-conductor arrangements