GB967246A - Etching liquid for semi-conductor elements - Google Patents

Etching liquid for semi-conductor elements

Info

Publication number
GB967246A
GB967246A GB4200961A GB4200961A GB967246A GB 967246 A GB967246 A GB 967246A GB 4200961 A GB4200961 A GB 4200961A GB 4200961 A GB4200961 A GB 4200961A GB 967246 A GB967246 A GB 967246A
Authority
GB
United Kingdom
Prior art keywords
etching liquid
semi
added
magnesium fluoride
magnesium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4200961A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB967246A publication Critical patent/GB967246A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
GB4200961A 1960-11-26 1961-11-23 Etching liquid for semi-conductor elements Expired GB967246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1960S0071426 DE1246353B (de) 1960-11-26 1960-11-26 Verwendung eines die Viskositaet erhoehenden Mittels in einer AEtzfluessigkeit

Publications (1)

Publication Number Publication Date
GB967246A true GB967246A (en) 1964-08-19

Family

ID=7502457

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4200961A Expired GB967246A (en) 1960-11-26 1961-11-23 Etching liquid for semi-conductor elements

Country Status (3)

Country Link
CH (1) CH408587A (de)
DE (1) DE1246353B (de)
GB (1) GB967246A (de)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1993920A (en) * 1933-09-18 1935-03-12 Costa Frank Etching compound
US2687345A (en) * 1950-11-22 1954-08-24 Printing Dev Inc Etching composition for lithographic plates
FR1105508A (fr) * 1953-05-20 1955-12-05 Dow Chemical Co Perfectionnements à un procédé de gravure sur métaux et à un bain de gravure utilisé dans ce procédé

Also Published As

Publication number Publication date
DE1246353B (de) 1967-08-03
CH408587A (de) 1966-02-28

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