GB955018A - Low capacitance semiconductor devices - Google Patents

Low capacitance semiconductor devices

Info

Publication number
GB955018A
GB955018A GB6856/62A GB685662A GB955018A GB 955018 A GB955018 A GB 955018A GB 6856/62 A GB6856/62 A GB 6856/62A GB 685662 A GB685662 A GB 685662A GB 955018 A GB955018 A GB 955018A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
region
contact surface
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6856/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pacific Semiconductors Inc
Original Assignee
Pacific Semiconductors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pacific Semiconductors Inc filed Critical Pacific Semiconductors Inc
Publication of GB955018A publication Critical patent/GB955018A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Weting (AREA)
GB6856/62A 1961-04-03 1962-02-22 Low capacitance semiconductor devices Expired GB955018A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US100427A US3200311A (en) 1961-04-03 1961-04-03 Low capacitance semiconductor devices

Publications (1)

Publication Number Publication Date
GB955018A true GB955018A (en) 1964-04-08

Family

ID=22279726

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6856/62A Expired GB955018A (en) 1961-04-03 1962-02-22 Low capacitance semiconductor devices

Country Status (3)

Country Link
US (1) US3200311A (enExample)
GB (1) GB955018A (enExample)
NL (1) NL276298A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3413527A (en) * 1964-10-02 1968-11-26 Gen Electric Conductive electrode for reducing the electric field in the region of the junction of a junction semiconductor device
US3423255A (en) * 1965-03-31 1969-01-21 Westinghouse Electric Corp Semiconductor integrated circuits and method of making the same
US3430109A (en) * 1965-09-28 1969-02-25 Chou H Li Solid-state device with differentially expanded junction surface
US3573516A (en) * 1969-04-23 1971-04-06 Gen Electric Rectifier bridge for use with an alternator
US3639975A (en) * 1969-07-30 1972-02-08 Gen Electric Glass encapsulated semiconductor device fabrication process
US4098638A (en) * 1977-06-14 1978-07-04 Westinghouse Electric Corp. Methods for making a sloped insulator for solid state devices
US5166098A (en) * 1988-03-05 1992-11-24 Deutsche Itt Industries Gmbh Method of manufacturing an encapsulated semiconductor device with a can type housing
ATE101943T1 (de) * 1988-03-05 1994-03-15 Itt Ind Gmbh Deutsche Halbleiterbauelement mit zwei anschluessen, dessen herstellverfahren und ausfuehrungsvorrichtung dafuer.
US5280194A (en) * 1988-11-21 1994-01-18 Micro Technology Partners Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device
US5403729A (en) * 1992-05-27 1995-04-04 Micro Technology Partners Fabricating a semiconductor with an insulative coating
US5592022A (en) * 1992-05-27 1997-01-07 Chipscale, Inc. Fabricating a semiconductor with an insulative coating
US5656547A (en) * 1994-05-11 1997-08-12 Chipscale, Inc. Method for making a leadless surface mounted device with wrap-around flange interface contacts
GB2302452B (en) * 1994-06-09 1998-11-18 Chipscale Inc Resistor fabrication
US20040144999A1 (en) * 1995-06-07 2004-07-29 Li Chou H. Integrated circuit device
US7118942B1 (en) 2000-09-27 2006-10-10 Li Chou H Method of making atomic integrated circuit device
US20100276733A1 (en) * 2000-09-27 2010-11-04 Li Choa H Solid-state circuit device
TWM422161U (en) * 2011-08-18 2012-02-01 Ks Terminals Inc Improved diode structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2786880A (en) * 1951-06-16 1957-03-26 Bell Telephone Labor Inc Signal translating device
US2802159A (en) * 1953-10-20 1957-08-06 Hughes Aircraft Co Junction-type semiconductor devices
GB849477A (en) * 1957-09-23 1960-09-28 Nat Res Dev Improvements in or relating to semiconductor control devices
US2998558A (en) * 1959-10-19 1961-08-29 Pacific Semiconductors Inc Semiconductor device and method of manufacturing same

Also Published As

Publication number Publication date
NL276298A (enExample) 1900-01-01
US3200311A (en) 1965-08-10

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