GB954891A - Improvements in or relating to semiconductor devices and methods of making such devices - Google Patents

Improvements in or relating to semiconductor devices and methods of making such devices

Info

Publication number
GB954891A
GB954891A GB2277960A GB2277960A GB954891A GB 954891 A GB954891 A GB 954891A GB 2277960 A GB2277960 A GB 2277960A GB 2277960 A GB2277960 A GB 2277960A GB 954891 A GB954891 A GB 954891A
Authority
GB
United Kingdom
Prior art keywords
leads
semi
pellet
wafer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2277960A
Inventor
Dennis Quintrell Fuller
John Brian Haggis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pye Electronic Products Ltd
Original Assignee
Pye Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pye Ltd filed Critical Pye Ltd
Publication of GB954891A publication Critical patent/GB954891A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01B—SOIL WORKING IN AGRICULTURE OR FORESTRY; PARTS, DETAILS, OR ACCESSORIES OF AGRICULTURAL MACHINES OR IMPLEMENTS, IN GENERAL
    • A01B63/00—Lifting or adjusting devices or arrangements for agricultural machines or implements
    • A01B63/02—Lifting or adjusting devices or arrangements for agricultural machines or implements for implements mounted on tractors
    • A01B63/10—Lifting or adjusting devices or arrangements for agricultural machines or implements for implements mounted on tractors operated by hydraulic or pneumatic means
    • A01B63/111—Lifting or adjusting devices or arrangements for agricultural machines or implements for implements mounted on tractors operated by hydraulic or pneumatic means regulating working depth of implements
    • A01B63/114—Lifting or adjusting devices or arrangements for agricultural machines or implements for implements mounted on tractors operated by hydraulic or pneumatic means regulating working depth of implements to achieve a constant working depth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Soil Sciences (AREA)
  • Environmental Sciences (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Lifting Devices For Agricultural Implements (AREA)

Abstract

954,891. Semi-conductor devices. PYE Ltd. June 28, 1961 [June 29, 1960; May 8, 1961], Nos. 22779/60 and 16614/61. Heading H1K. In a method of making a semi-conductor device such as a diode or transistor, each of one or more leads having enlarged integral head portions is used as a punch for punching out a pellet from a strip of suitable material, which pellet covers the surface of the head portion and is applied to the surface of a semiconductor body during the continuation of the punching stroke, so that subsequent heat treatment secures the lead to the body and forms an ohmic or rectifying contact. As shown, the head 3a of a lead 3 having its end face coated with aluminium 4, punches a pellet 7 from an indium tape 1 on to a germanium wafer 5. During the subsequent alloying step, Al from coating 4 improves the emitter injection efficiency. To form a transistor, the wafer is inverted and the process repeated, or a similar punching operation is effected from below the wafer. The leads may be made of nickel, gold or "Kovar" (Registered Trade Mark); to produce an ohmic contact, the head portion may be covered with gold or an appropriate alloy, such as Pb-Sb. The semi-conductor body may be of silicon. The second Provisional Specification describes the application of significant material to headed leads by evaporation, plating, and dipping, followed by alloying while the leads are held in a jig, or permanently mounted in a glass or ceramic support. The heads of the leads may be cylindrical, partconical, or of D-shaped cross-section.
GB2277960A 1961-05-08 1960-06-29 Improvements in or relating to semiconductor devices and methods of making such devices Expired GB954891A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1661461 1961-05-08

Publications (1)

Publication Number Publication Date
GB954891A true GB954891A (en) 1964-04-08

Family

ID=10080498

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1954060A Expired GB954491A (en) 1961-05-08 1960-06-02 Device for regulating the working depth of an implement connected to a tractor
GB2277960A Expired GB954891A (en) 1961-05-08 1960-06-29 Improvements in or relating to semiconductor devices and methods of making such devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB1954060A Expired GB954491A (en) 1961-05-08 1960-06-02 Device for regulating the working depth of an implement connected to a tractor

Country Status (4)

Country Link
ES (2) ES268636A1 (en)
FR (1) FR292731A (en)
GB (2) GB954491A (en)
NL (1) NL266510A (en)

Also Published As

Publication number Publication date
NL266510A (en)
GB954491A (en) 1964-04-08
ES272070A1 (en) 1962-07-01
ES268636A1 (en) 1962-02-16
FR292731A (en)

Similar Documents

Publication Publication Date Title
GB1356323A (en) Semiconductor devices
GB957910A (en) Improvements in or relating to semi-conductor arrangements
GB1002725A (en) Semiconductor device
GB1201718A (en) Semiconductor device
GB954891A (en) Improvements in or relating to semiconductor devices and methods of making such devices
GB1181336A (en) Strip Mounted Semiconductor Device
GB934185A (en) Method of mounting electrical semiconductor elements on a base plate
US2962639A (en) Semiconductor devices and mounting means therefor
GB1239882A (en) Process for handling and mounting semiconductor dice
GB1037187A (en) A process for the production of a highly doped p-conducting zone in a semiconductor body
GB1076654A (en) Improvements in and relating to methods of applying ohmic contacts to silicon
JPS5541755A (en) Wire-bonding apparatus
JPS55140238A (en) Tape carrier type semiconductor device
GB1139746A (en) Improvements in and relating to semiconductive devices
JPS57118681A (en) Manufacture of semiconductor light emitting diode
GB1024727A (en) Method of fabricating semiconductor devices
JPS56112736A (en) Semiconductor assembling apparatus
GB703879A (en) Improvements in crystal diodes and methods of manufacture thereof
GB816170A (en) Improvements relating to the forming of p-n junctions
GB1276542A (en) Process for forming metal contacts on semiconductor devices
JPS57208152A (en) Semiconductor wafer
GB1073673A (en) Semiconductor device
JPS5469961A (en) Production of semiconductor device
GB1101568A (en) Improvements in or relating to semiconductor devices
JPS5745250A (en) Manufacture of semiconductor device