GB948450A - Improvements in or relating to methods of assembling component parts of semiconductor devices - Google Patents
Improvements in or relating to methods of assembling component parts of semiconductor devicesInfo
- Publication number
- GB948450A GB948450A GB16804/60A GB1680460A GB948450A GB 948450 A GB948450 A GB 948450A GB 16804/60 A GB16804/60 A GB 16804/60A GB 1680460 A GB1680460 A GB 1680460A GB 948450 A GB948450 A GB 948450A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pin
- wire
- tube
- glass
- pict
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011521 glass Substances 0.000 abstract 5
- 238000001816 cooling Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Motors, Generators (AREA)
- Joining Of Glass To Other Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL239126 | 1959-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB948450A true GB948450A (en) | 1964-02-05 |
Family
ID=19751725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB16804/60A Expired GB948450A (en) | 1959-05-12 | 1960-05-12 | Improvements in or relating to methods of assembling component parts of semiconductor devices |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3120693A (enExample) |
| CH (1) | CH382856A (enExample) |
| DE (1) | DE1149459B (enExample) |
| GB (1) | GB948450A (enExample) |
| NL (2) | NL239126A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4544318A (en) * | 1979-07-27 | 1985-10-01 | Hitachi, Ltd. | Manufacturing system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101409636B1 (ko) | 2006-10-10 | 2014-06-18 | 위스콘신 얼럼나이 리서어치 화운데이션 | 유방내 유두 봉합제 및 숙성된 치즈에서 시각적 결함을 감소 또는 저하시키기 위해 이를 사용하는 방법 |
| MX2011010603A (es) | 2009-04-08 | 2011-12-08 | Wisconsin Alumni Res Found | Formulacion de sellador de pezon intra-mamario y metodo para usar la misma para reducir o eliminar defectos visuales en quesos añejados. |
| JP2022541291A (ja) | 2019-07-19 | 2022-09-22 | エヴァテック・アーゲー | 圧電コーティングおよび堆積プロセス |
| CN113955413B (zh) * | 2021-11-11 | 2022-09-02 | 安徽耐科装备科技股份有限公司 | 塑封料饼自动排布装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2595058A (en) * | 1949-09-30 | 1952-04-29 | Rca Corp | Loading stop for electron tube making machines |
| US2693555A (en) * | 1951-04-04 | 1954-11-02 | Hughes Aircraft Co | Method and apparatus for welding germanium diodes |
| BE527478A (enExample) * | 1953-05-13 | |||
| DE1020121B (de) * | 1955-02-19 | 1957-11-28 | Kieler Howaldtswerke Ag | Verfahren zur Herstellung von Halbleitergeraeten kleinster Abmessungen und Vorrichtung zur Ausuebung des Verfahrens |
| US2961800A (en) * | 1955-06-28 | 1960-11-29 | Sylvania Electric Prod | Apparatus for forming glass envelopes and mounting operative elements therein |
| FR1167971A (fr) * | 1956-10-19 | 1958-12-03 | Thomson Houston Comp Francaise | Nouveau procédé de fabrication des diodes à semi-conducteurs sous enveloppe scellée |
-
0
- NL NL103467D patent/NL103467C/xx active
- NL NL239126D patent/NL239126A/xx unknown
-
1960
- 1960-05-09 DE DEN18305A patent/DE1149459B/de active Pending
- 1960-05-09 CH CH531560A patent/CH382856A/de unknown
- 1960-05-12 GB GB16804/60A patent/GB948450A/en not_active Expired
- 1960-05-12 US US28737A patent/US3120693A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4544318A (en) * | 1979-07-27 | 1985-10-01 | Hitachi, Ltd. | Manufacturing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CH382856A (de) | 1964-10-15 |
| DE1149459B (de) | 1963-05-30 |
| US3120693A (en) | 1964-02-11 |
| NL103467C (enExample) | |
| NL239126A (enExample) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2554013A (en) | Lead wire positioner | |
| CN108406128A (zh) | 一种全自动激光打标修复设备 | |
| GB995853A (en) | Apparatus for bonding wire-like elements to articles | |
| GB948450A (en) | Improvements in or relating to methods of assembling component parts of semiconductor devices | |
| GB542399A (en) | Improvements relating to machines for manufacturing electric lamps and similar devices | |
| US3178796A (en) | Method and device for the machine assembling of crystal diodes | |
| US3604108A (en) | Method for handling, testing and bonding of beam-leaded devices | |
| US3003051A (en) | Welding apparatus | |
| GB575946A (en) | Improvements in and relating to methods of and apparatus for basing glass envelopes for electric lamps and similar electric devices | |
| US2441353A (en) | Method of disassembling articles | |
| US3661316A (en) | Aiming device for semiconductor bonding apparatus | |
| US3025978A (en) | Turnover mechanism | |
| US2569616A (en) | Chuck | |
| US3042792A (en) | Method and device for the machine soldering of a crystal to the cathode portion of crystal diodes | |
| US3128529A (en) | Machine for assembling electrical components | |
| JPS63116335A (ja) | 陰極線管にマウントを封入する方法および装置 | |
| US3419372A (en) | Work holder for aligning and sealing a beaded wire element into a glass tube | |
| US1423957A (en) | Stem-making machine | |
| US1585913A (en) | Method of and apparatus for sealing mounts in electric lamps | |
| US1834655A (en) | Electric welding shield | |
| US2896064A (en) | Tubulation apparatus | |
| US3337934A (en) | Lamp capping machine | |
| US2401362A (en) | Method of working an article | |
| US2726917A (en) | Lamp sealing and exhausting machine with precision focusing apparatus | |
| US2080140A (en) | Method of preparing pen points |