GB948450A - Improvements in or relating to methods of assembling component parts of semiconductor devices - Google Patents

Improvements in or relating to methods of assembling component parts of semiconductor devices

Info

Publication number
GB948450A
GB948450A GB16804/60A GB1680460A GB948450A GB 948450 A GB948450 A GB 948450A GB 16804/60 A GB16804/60 A GB 16804/60A GB 1680460 A GB1680460 A GB 1680460A GB 948450 A GB948450 A GB 948450A
Authority
GB
United Kingdom
Prior art keywords
pin
wire
tube
glass
pict
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB16804/60A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB948450A publication Critical patent/GB948450A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Manufacture Of Motors, Generators (AREA)
GB16804/60A 1959-05-12 1960-05-12 Improvements in or relating to methods of assembling component parts of semiconductor devices Expired GB948450A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL239126 1959-05-12

Publications (1)

Publication Number Publication Date
GB948450A true GB948450A (en) 1964-02-05

Family

ID=19751725

Family Applications (1)

Application Number Title Priority Date Filing Date
GB16804/60A Expired GB948450A (en) 1959-05-12 1960-05-12 Improvements in or relating to methods of assembling component parts of semiconductor devices

Country Status (5)

Country Link
US (1) US3120693A (enExample)
CH (1) CH382856A (enExample)
DE (1) DE1149459B (enExample)
GB (1) GB948450A (enExample)
NL (2) NL239126A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544318A (en) * 1979-07-27 1985-10-01 Hitachi, Ltd. Manufacturing system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101547698B (zh) 2006-10-10 2014-01-08 威斯康星旧生研究基金会 乳房内乳头密封剂和使用该制剂降低或消除成熟干酪中视觉缺陷的方法
JP5773983B2 (ja) 2009-04-08 2015-09-02 ウィスコンシン アルムニ リサーチ ファンデイション 乳房内乳頭シール剤及びその熟成チーズの外観上の欠陥を減少又は除去のための使用
US12426506B2 (en) 2019-07-19 2025-09-23 Evatec Ag Piezoelectric coating and deposition process
CN113955413B (zh) * 2021-11-11 2022-09-02 安徽耐科装备科技股份有限公司 塑封料饼自动排布装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2595058A (en) * 1949-09-30 1952-04-29 Rca Corp Loading stop for electron tube making machines
US2693555A (en) * 1951-04-04 1954-11-02 Hughes Aircraft Co Method and apparatus for welding germanium diodes
BE527478A (enExample) * 1953-05-13
DE1020121B (de) * 1955-02-19 1957-11-28 Kieler Howaldtswerke Ag Verfahren zur Herstellung von Halbleitergeraeten kleinster Abmessungen und Vorrichtung zur Ausuebung des Verfahrens
US2961800A (en) * 1955-06-28 1960-11-29 Sylvania Electric Prod Apparatus for forming glass envelopes and mounting operative elements therein
FR1167971A (fr) * 1956-10-19 1958-12-03 Thomson Houston Comp Francaise Nouveau procédé de fabrication des diodes à semi-conducteurs sous enveloppe scellée

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544318A (en) * 1979-07-27 1985-10-01 Hitachi, Ltd. Manufacturing system

Also Published As

Publication number Publication date
NL103467C (enExample)
US3120693A (en) 1964-02-11
DE1149459B (de) 1963-05-30
NL239126A (enExample)
CH382856A (de) 1964-10-15

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