GB922583A - Fabricating semiconductor devices - Google Patents

Fabricating semiconductor devices

Info

Publication number
GB922583A
GB922583A GB24388/59A GB2438859A GB922583A GB 922583 A GB922583 A GB 922583A GB 24388/59 A GB24388/59 A GB 24388/59A GB 2438859 A GB2438859 A GB 2438859A GB 922583 A GB922583 A GB 922583A
Authority
GB
United Kingdom
Prior art keywords
slice
silicon
areas
resist
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24388/59A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of GB922583A publication Critical patent/GB922583A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/051—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/106—Masks, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Dicing (AREA)
  • Weting (AREA)
GB24388/59A 1958-07-25 1959-07-15 Fabricating semiconductor devices Expired GB922583A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US751046A US3046176A (en) 1958-07-25 1958-07-25 Fabricating semiconductor devices

Publications (1)

Publication Number Publication Date
GB922583A true GB922583A (en) 1963-04-03

Family

ID=25020244

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24388/59A Expired GB922583A (en) 1958-07-25 1959-07-15 Fabricating semiconductor devices

Country Status (5)

Country Link
US (1) US3046176A (https=)
DE (1) DE1092132B (https=)
FR (1) FR1230860A (https=)
GB (1) GB922583A (https=)
NL (2) NL122283C (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL252383A (https=) * 1960-06-07
US3260634A (en) * 1961-02-17 1966-07-12 Motorola Inc Method of etching a semiconductor wafer to provide tapered dice
US3180751A (en) * 1961-05-26 1965-04-27 Bausch & Lomb Method of forming a composite article
US3226255A (en) * 1961-10-31 1965-12-28 Western Electric Co Masking method for semiconductor
US3245794A (en) * 1962-10-29 1966-04-12 Ihilco Corp Sequential registration scheme
GB1064290A (en) * 1963-01-14 1967-04-05 Motorola Inc Method of making semiconductor devices
US3165430A (en) * 1963-01-21 1965-01-12 Siliconix Inc Method of ultra-fine semiconductor manufacture
US3265546A (en) * 1963-04-01 1966-08-09 North American Aviation Inc Chemical drilling of circuit boards
NL294370A (https=) * 1963-06-20
US3288662A (en) * 1963-07-18 1966-11-29 Rca Corp Method of etching to dice a semiconductor slice
GB1065192A (en) * 1963-09-03 1967-04-12 Rosemount Eng Co Ltd Pressure gauge
US3349476A (en) * 1963-11-26 1967-10-31 Ibm Formation of large area contacts to semiconductor devices
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
DE1221363B (de) * 1964-04-25 1966-07-21 Telefunken Patent Verfahren zum Verringern des Bahnwiderstands von Halbleiterbauelementen
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact
US3421962A (en) * 1965-04-05 1969-01-14 Int Rectifier Corp Apparatus for dicing semiconductor wafers
DE1275646B (de) * 1965-05-10 1968-08-22 Siemens Ag Verfahren zur Herstellung einer thermoelektrischen Anordnung
US3418226A (en) * 1965-05-18 1968-12-24 Ibm Method of electrolytically etching a semiconductor having a single impurity gradient
US3447984A (en) * 1965-06-24 1969-06-03 Ibm Method for forming sharply defined apertures in an insulating layer
US3372071A (en) * 1965-06-30 1968-03-05 Texas Instruments Inc Method of forming a small area junction semiconductor
US3237272A (en) * 1965-07-06 1966-03-01 Motorola Inc Method of making semiconductor device
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
GB1189582A (en) * 1967-07-26 1970-04-29 Licentia Gmbh Method of Dividing Semiconductor Wafers.
GB1263626A (en) * 1968-06-17 1972-02-16 Texas Instruments Inc Epitaxial method for fabricating an avalanche diode and product
US3597839A (en) * 1969-03-10 1971-08-10 Bell Telephone Labor Inc Circuit interconnection method for microelectronic circuitry
US3772100A (en) * 1971-06-30 1973-11-13 Denki Onkyo Co Ltd Method for forming strips on semiconductor device
US4037306A (en) * 1975-10-02 1977-07-26 Motorola, Inc. Integrated circuit and method
US4451972A (en) * 1980-01-21 1984-06-05 National Semiconductor Corporation Method of making electronic chip with metalized back including a surface stratum of solder
JPS5784135A (en) * 1980-11-14 1982-05-26 Toshiba Corp Manufacture of semiconductor element
DE3211391A1 (de) * 1982-03-27 1983-09-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer halbleiteranordnung
JP2004168584A (ja) * 2002-11-19 2004-06-17 Thk Co Ltd ガラス基板材の切断方法
CN102921666B (zh) * 2012-11-21 2014-12-17 南京熊猫电子股份有限公司 消除电容式触摸屏蚀刻残留溶液的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE467188A (https=) * 1939-05-26
US2321523A (en) * 1942-06-27 1943-06-08 Standard Telephones Cables Ltd Method of reclaiming selenium elements
US2536383A (en) * 1943-10-13 1951-01-02 Buckbee Mears Co Process for making reticles and other precision articles by etching from both sides of the blank
NL153395B (nl) * 1949-02-10 Contraves Ag Verbetering van een bistabiele trekkerschakeling.
GB699050A (en) * 1950-09-09 1953-10-28 Sylvania Electric Prod Transistors, and their method of manufacture
US2743506A (en) * 1952-02-23 1956-05-01 Int Resistance Co Method of manufacturing rectifier cells
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
US2758074A (en) * 1953-08-26 1956-08-07 Rca Corp Printed circuits
US2829460A (en) * 1953-12-22 1958-04-08 Marcel J E Golay Etching method and etching plate
BE557842A (https=) * 1956-06-01

Also Published As

Publication number Publication date
NL122283C (https=)
US3046176A (en) 1962-07-24
NL241641A (https=)
FR1230860A (fr) 1960-09-20
DE1092132B (de) 1960-11-03

Similar Documents

Publication Publication Date Title
GB922583A (en) Fabricating semiconductor devices
US3288662A (en) Method of etching to dice a semiconductor slice
US4206540A (en) Schottky device and method of manufacture using palladium and platinum intermetallic alloys and titanium barrier
US4205099A (en) Method for making terminal bumps on semiconductor wafers
US3756872A (en) Method of making non-planar semiconductor devices
US2861229A (en) Semi-conductor devices and methods of making same
US3046324A (en) Alloyed photovoltaic cell and method of making the same
US3728784A (en) Fabrication of semiconductor devices
US3409809A (en) Semiconductor or write tri-layered metal contact
US3716429A (en) Method of making semiconductor devices
US3214654A (en) Ohmic contacts to iii-v semiconductive compound bodies
GB878544A (en) Improvements in or relating to processes of manufacturing semi-conductor devices
ES349652A1 (es) Un metodo de proporcionar una conexion electrica sobre una superficie de un dispositivo electronico.
US3562040A (en) Method of uniformally and rapidly etching nichrome
US3188251A (en) Method for making semiconductor junction devices
US2916806A (en) Plating method
US3711325A (en) Activation process for electroless nickel plating
GB930503A (en) Semiconductor devices and preparation thereof
US3640782A (en) Diffusion masking in semiconductor preparation
US3669734A (en) Method of making electrical connections to a glass-encapsulated semiconductor device
US2930949A (en) Semiconductive device and method of fabrication thereof
US3947304A (en) Etching of group III-V semiconductors
US2964431A (en) Jig alloying of semiconductor devices
US3523038A (en) Process for making ohmic contact to planar germanium semiconductor devices
US3324015A (en) Electroplating process for semiconductor devices