GB9204460D0 - Noise suppression in integrated circuit device - Google Patents

Noise suppression in integrated circuit device

Info

Publication number
GB9204460D0
GB9204460D0 GB929204460A GB9204460A GB9204460D0 GB 9204460 D0 GB9204460 D0 GB 9204460D0 GB 929204460 A GB929204460 A GB 929204460A GB 9204460 A GB9204460 A GB 9204460A GB 9204460 D0 GB9204460 D0 GB 9204460D0
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit device
noise suppression
suppression
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB929204460A
Other versions
GB2258943A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9204460D0 publication Critical patent/GB9204460D0/en
Publication of GB2258943A publication Critical patent/GB2258943A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B29/00—Generation of noise currents and voltages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B15/00—Suppression or limitation of noise or interference
    • H04B15/005—Reducing noise, e.g. humm, from the supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/1901—Structure
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    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/30107—Inductance
GB9204460A 1991-08-19 1992-03-02 Noise suppression in integrated circuit device Withdrawn GB2258943A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910014266A KR930005334A (en) 1991-08-19 1991-08-19 Integrated Circuit for Suppressing Supply Noise

Publications (2)

Publication Number Publication Date
GB9204460D0 true GB9204460D0 (en) 1992-04-15
GB2258943A GB2258943A (en) 1993-02-24

Family

ID=19318748

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9204460A Withdrawn GB2258943A (en) 1991-08-19 1992-03-02 Noise suppression in integrated circuit device

Country Status (7)

Country Link
JP (1) JPH0547808A (en)
KR (1) KR930005334A (en)
DE (1) DE4206278A1 (en)
FR (1) FR2680602A1 (en)
GB (1) GB2258943A (en)
IT (1) IT1254810B (en)
TW (1) TW200631B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6900096A (en) * 1995-09-29 1997-04-17 Analog Devices, Inc. Integrated circuit and supply decoupling capacitor therefor
JP2007173339A (en) 2005-12-20 2007-07-05 Nec Electronics Corp Semiconductor circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1816023A1 (en) * 1968-12-20 1970-06-25 Philips Patentverwaltung Module with electronic circuit
JPS58164246A (en) * 1982-03-24 1983-09-29 Nec Corp Semiconductor device
US4516123A (en) * 1982-12-27 1985-05-07 At&T Bell Laboratories Integrated circuit including logic array with distributed ground connections
JPS6167231A (en) * 1984-09-10 1986-04-07 Matsushita Electric Ind Co Ltd Semiconductor device
JPS61108160A (en) * 1984-11-01 1986-05-26 Nec Corp Semiconductor device with built-in capacitor and manufacture thereof
US4737830A (en) * 1986-01-08 1988-04-12 Advanced Micro Devices, Inc. Integrated circuit structure having compensating means for self-inductance effects
JP2674073B2 (en) * 1988-03-17 1997-11-05 松下電器産業株式会社 Integrated circuit device
JPH01305543A (en) * 1988-06-03 1989-12-08 New Japan Radio Co Ltd Semiconductor device
JPH02224367A (en) * 1989-02-27 1990-09-06 Ricoh Co Ltd Semiconductor device provided with capacitor

Also Published As

Publication number Publication date
KR930005334A (en) 1993-03-23
FR2680602A1 (en) 1993-02-26
ITMI920375A1 (en) 1993-08-20
DE4206278A1 (en) 1993-02-25
GB2258943A (en) 1993-02-24
IT1254810B (en) 1995-10-11
TW200631B (en) 1993-02-21
JPH0547808A (en) 1993-02-26
ITMI920375A0 (en) 1992-02-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)