GB919549A - Improvements in structural adhesives - Google Patents

Improvements in structural adhesives

Info

Publication number
GB919549A
GB919549A GB789/60A GB78960A GB919549A GB 919549 A GB919549 A GB 919549A GB 789/60 A GB789/60 A GB 789/60A GB 78960 A GB78960 A GB 78960A GB 919549 A GB919549 A GB 919549A
Authority
GB
United Kingdom
Prior art keywords
phenol
polyvinyl
formaldehyde
cresol
specified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB789/60A
Inventor
Jerome Been
Martin Grover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rubber and Asbestos Corp
Original Assignee
Rubber and Asbestos Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rubber and Asbestos Corp filed Critical Rubber and Asbestos Corp
Publication of GB919549A publication Critical patent/GB919549A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
    • B64C13/00—Control systems or transmitting systems for actuating flying-control surfaces, lift-increasing flaps, air brakes, or spoilers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

A process for preparing a polymer comprising reacting together a mixture of a polyepoxide resin containing reactive epoxy groups, a fusible thermosetting phenol-aldehyde resin and a polyvinyl acetal having a residue of from 2 to 25% of alcoholic groups. The epoxy resins may be glycidyl polyethers or glycidyl polyesters, many being specified. Specified polyvinyl acetals are made by condensing aldehydes, e.g. acetaldehyde, formaldehyde, or butyraldehyde with a polyvinyl alcohol made by hydrolysis of a polyvinyl acetate. Specified phenol-aldehyde resins are those derived from phenol, cresol, xylenol, naphthol, resorcinol, cardanol or cashew-nut shell oil and formaldehyde, acetaldehyde or furfural. The reaction mixture may contain inert fillers, e.g. talc, silica, ignited aluminium oxide, zinc dust or aluminium powder; reinforcing fillers, e.g. carbon black; plasticizers, e.g. dibutyl phthalate and polyepoxide hardening agents, e.g. dicyandiamide. The examples describe the formulation of compositions containing an epoxy resin derived from bis-phenol-A and epichlorhydrin and:-(I) polyvinyl acetal, a phenol-formaldehyde or phenol-cardanol condensate, aluminium powder, isopropyl acetate and isopropyl alcohol; (II) a cresol-formaldehyde condensate, polyvinyl formal, and methyl ethyl ketone and (III) polyvinyl butyral, a cresol-formaldehyde condensate and ethanol, the compositions which may be used as adhesives in the preparation of laminates, being hardened by the application of heat. Specifications 680,997, 681,001 and 681,008 are referred to.
GB789/60A 1960-01-12 1960-01-08 Improvements in structural adhesives Expired GB919549A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER0027092 1960-01-12

Publications (1)

Publication Number Publication Date
GB919549A true GB919549A (en) 1963-02-27

Family

ID=7402368

Family Applications (1)

Application Number Title Priority Date Filing Date
GB789/60A Expired GB919549A (en) 1960-01-12 1960-01-08 Improvements in structural adhesives

Country Status (2)

Country Link
DE (1) DE1594236A1 (en)
GB (1) GB919549A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
EP0729814A1 (en) * 1995-03-03 1996-09-04 National Research Development Corporation A process for producing composite particle board from rice husk
EP3778821A4 (en) * 2018-03-28 2022-01-12 Sekisui Chemical Co., Ltd. Epoxy adhesive composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
DE3800891A1 (en) * 1987-01-14 1988-07-28 Kollmorgen Corp ADHESIVE MEDIUM MIXTURE FOR THE PRODUCTION OF CIRCUIT BOARDS BY THE ADDITIVE PROCESS
GB2200122B (en) * 1987-01-14 1990-10-17 Kollmorgen Corp Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
EP0729814A1 (en) * 1995-03-03 1996-09-04 National Research Development Corporation A process for producing composite particle board from rice husk
EP3778821A4 (en) * 2018-03-28 2022-01-12 Sekisui Chemical Co., Ltd. Epoxy adhesive composition
US11932785B2 (en) 2018-03-28 2024-03-19 Sekisui Chemical Co., Ltd. Epoxy adhesive composition

Also Published As

Publication number Publication date
DE1594236A1 (en) 1969-05-22

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