GB918543A - Improvements relating to electric rectifiers embodying semi-conductor material - Google Patents

Improvements relating to electric rectifiers embodying semi-conductor material

Info

Publication number
GB918543A
GB918543A GB12235/60A GB1223560A GB918543A GB 918543 A GB918543 A GB 918543A GB 12235/60 A GB12235/60 A GB 12235/60A GB 1223560 A GB1223560 A GB 1223560A GB 918543 A GB918543 A GB 918543A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor material
improvements relating
rim
embodying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12235/60A
Inventor
Robert Guy Hibberd
Peter Frank Castle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB35427/58A priority Critical patent/GB915676A/en
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB12235/60A priority patent/GB918543A/en
Publication of GB918543A publication Critical patent/GB918543A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

918,543. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. April 6, 1960, No. 12235/60. Addition to 915,676. Class 37. In an hermetically-sealed semi-conductor device of the type claimed in the parent Specification, in which the lead 5 to the exposed side of the wafer 2 is taken through the side of the housing, the lid 7 is welded at 9 to a rim 8 brazed on a seating on the top of the housing wall 3. Base 1 and wall 3 are integral and are of copper, the bottom of the base being lapped for good heat-conduction to the support. Rim and lid are of a ferrous alloy.
GB12235/60A 1958-11-04 1960-04-06 Improvements relating to electric rectifiers embodying semi-conductor material Expired GB918543A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB35427/58A GB915676A (en) 1958-11-04 1958-11-04 Improvements relating to electric rectifiers embodying semi-conductor material
GB12235/60A GB918543A (en) 1958-11-04 1960-04-06 Improvements relating to electric rectifiers embodying semi-conductor material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB35427/58A GB915676A (en) 1958-11-04 1958-11-04 Improvements relating to electric rectifiers embodying semi-conductor material
GB12235/60A GB918543A (en) 1958-11-04 1960-04-06 Improvements relating to electric rectifiers embodying semi-conductor material

Publications (1)

Publication Number Publication Date
GB918543A true GB918543A (en) 1963-02-13

Family

ID=62527905

Family Applications (2)

Application Number Title Priority Date Filing Date
GB35427/58A Expired GB915676A (en) 1958-11-04 1958-11-04 Improvements relating to electric rectifiers embodying semi-conductor material
GB12235/60A Expired GB918543A (en) 1958-11-04 1960-04-06 Improvements relating to electric rectifiers embodying semi-conductor material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB35427/58A Expired GB915676A (en) 1958-11-04 1958-11-04 Improvements relating to electric rectifiers embodying semi-conductor material

Country Status (1)

Country Link
GB (2) GB915676A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1670056A2 (en) * 2004-12-08 2006-06-14 Semikron Elektronik GmbH & Co. KG Patentabteilung Power semiconductor module with auxiliary connector
WO2009097941A1 (en) * 2008-02-04 2009-08-13 Robert Bosch Gmbh Metal housing part and method for producing the housing part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1670056A2 (en) * 2004-12-08 2006-06-14 Semikron Elektronik GmbH & Co. KG Patentabteilung Power semiconductor module with auxiliary connector
EP1670056A3 (en) * 2004-12-08 2009-03-11 Semikron Elektronik GmbH & Co. KG Patentabteilung Power semiconductor module with auxiliary connector
WO2009097941A1 (en) * 2008-02-04 2009-08-13 Robert Bosch Gmbh Metal housing part and method for producing the housing part
US8881935B2 (en) 2008-02-04 2014-11-11 Robert Bosch Gmbh Metal housing part and method for maufacturing the housing part
US9009961B2 (en) 2008-02-04 2015-04-21 Robert Bosch Gmbh Method of manufacturing a metal housing part

Also Published As

Publication number Publication date
GB915676A (en) 1963-01-16

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