GB918483A - Improvements in or relating to printed circuits - Google Patents

Improvements in or relating to printed circuits

Info

Publication number
GB918483A
GB918483A GB3652957A GB3652957A GB918483A GB 918483 A GB918483 A GB 918483A GB 3652957 A GB3652957 A GB 3652957A GB 3652957 A GB3652957 A GB 3652957A GB 918483 A GB918483 A GB 918483A
Authority
GB
United Kingdom
Prior art keywords
web
adhesive
powder
layer
tacky
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3652957A
Inventor
Lawrence John Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOUNG RES LAB Ltd
Original Assignee
YOUNG RES LAB Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOUNG RES LAB Ltd filed Critical YOUNG RES LAB Ltd
Priority to GB3652957A priority Critical patent/GB918483A/en
Publication of GB918483A publication Critical patent/GB918483A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

918,483. Sheets bearing metallic pattern. YOUNG RESEARCH LABORATORIES Ltd. Feb. 20, 1959 [Nov. 22, 1957], No. 36529/57. Class 93. [Also in Group XXXVI] A method for the continuous production of printed circuits comprises feeding a web of non- tacky curable adhesive coated flexible electrically insulating supporting material through a press stepwise under tension, the supporting material having a layer of finely divided metal upon the adhesive coating. At each step whilst the web is stationary, pressure is applied over areas corresponding to the desired circuit pattern in order to compact the metal and consolidate it with the adhesive. Uncompacted metal is subsequently removed and the printed circuit finally cured. In a preferred embodiment a web of cellulosic tissue 0.002 inch thick is drawn off from a roll and passed through a bath containing a phenolformaldehyde heat hardenable adhesive over and between rollers to coat the web on both sides with a layer of hardenable resinous adhesive about 0.001 inch thick. The web is then subject to heat for about 20 minutes during passage through a chamber in order to partially cure the adhesive to render it non-tacky. The coated web is next passed beneath a vibrating hopper which deposits a layer of a silver-coated copper powder of 0.1 inch thick on the top surface of the web, the thickness of the powder being controlled by a doctor knife which co-operates with a wall disposed at each edge of the web. The web next passes between the platens of a press where, whilst the web is stationary, a die having its pressing surface figured to correspond to the desired circuit pattern is applied to the powder. After pressing the web is moved on and brushed to remove uncompacted powder and the printed circuit element being subsequently severed from the web. Each circuit element is then placed in register face upwards on a resinous impregnated laminated base of insulating material having a non-tacky adhesive coating on its surface which is in contact with the adhesive layer on the bottom of the element. Pressure is then applied to consolidate the assembly after which it is subjected to heat to cure the adhesive. Alternatively, the travelling web may be passed through a second heating chamber, or the base may be attached in the initial pressing process.
GB3652957A 1957-11-22 1957-11-22 Improvements in or relating to printed circuits Expired GB918483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3652957A GB918483A (en) 1957-11-22 1957-11-22 Improvements in or relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3652957A GB918483A (en) 1957-11-22 1957-11-22 Improvements in or relating to printed circuits

Publications (1)

Publication Number Publication Date
GB918483A true GB918483A (en) 1963-02-13

Family

ID=10388984

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3652957A Expired GB918483A (en) 1957-11-22 1957-11-22 Improvements in or relating to printed circuits

Country Status (1)

Country Link
GB (1) GB918483A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2246476B (en) * 1990-04-17 1993-11-17 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board

Similar Documents

Publication Publication Date Title
US2963748A (en) Printed circuits
GB792920A (en) Improvements in or relating to methods of manufacturing an electrically conductive pattern on an insulating support
US2320513A (en) Machine for coating absorbent surfaces
GB918483A (en) Improvements in or relating to printed circuits
ES447461A1 (en) Methods of and apparatus for manufacturing laminated reinforced plastics sheet form material
DE1243746B (en) Process for the production of a printed circuit on a carrier plate, the surface of which deviates from a plane
US2893150A (en) Wiring board and method of construction
JPH02500730A (en) Method of forming an engraved surface panel coating with a sheet of heat deformable material and apparatus for carrying out the method
DE2549602A1 (en) METHOD AND APPARATUS FOR THE PRODUCTION OF METAL FOILS FROM A METAL HAVING A LOW MELTING POINT, AND PRODUCTS THAT CAN BE OBTAINED WITH THIS PROCESS
DE4437035A1 (en) Method and appts. for producing thin, metallic structures on insulating carrier materials
US2252776A (en) Metal sheet and process of making and using the same
JPS56123819A (en) Shaping method for cover pad for sheet
US3523813A (en) Application of a printed impression of metal powder onto articles
JPS6416617A (en) Method and device for continuously manufacturing beltlike base material
JPH0755065Y2 (en) Hot stamping transfer plate
DK0528774T3 (en) Process and apparatus for offset coating
JPH03272848A (en) Continuous manufacture of laminate for electrical use
JPS5743820A (en) Manufacture of moldform panel
JPS57117925A (en) Method and apparatus for impregnating resin into base material for laminated plate
GB825495A (en) Improvements in or relating to printed electric circuits
JPS5796825A (en) Manufacture of laminated sheet
JPS57108858A (en) Photosensitive resin plate material superior in adhesion of original film
JPS57109928A (en) Flash device
JPS55134673A (en) Surface treatment
JPS55101433A (en) Apparatus for preparing sandwiched board