GB914034A - A semi-conductor device - Google Patents

A semi-conductor device

Info

Publication number
GB914034A
GB914034A GB12915/61A GB1291561A GB914034A GB 914034 A GB914034 A GB 914034A GB 12915/61 A GB12915/61 A GB 12915/61A GB 1291561 A GB1291561 A GB 1291561A GB 914034 A GB914034 A GB 914034A
Authority
GB
United Kingdom
Prior art keywords
semi
liquid
conductor device
potassium
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12915/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB914034A publication Critical patent/GB914034A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Fuses (AREA)
GB12915/61A 1960-04-08 1961-04-10 A semi-conductor device Expired GB914034A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES67967A DE1166383B (de) 1960-04-08 1960-04-08 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
GB914034A true GB914034A (en) 1962-12-28

Family

ID=7499943

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12915/61A Expired GB914034A (en) 1960-04-08 1961-04-10 A semi-conductor device

Country Status (3)

Country Link
DE (1) DE1166383B (cg-RX-API-DMAC7.html)
GB (1) GB914034A (cg-RX-API-DMAC7.html)
NL (1) NL262292A (cg-RX-API-DMAC7.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US3800190A (en) * 1970-11-02 1974-03-26 Bbc Brown Boveri & Cie Cooling system for power semiconductor devices
US4258383A (en) * 1978-12-22 1981-03-24 Rca Corporation Minimum pressure drop liquid cooled structure for a semiconductor device
WO2006020332A1 (en) * 2004-08-13 2006-02-23 Intel Corporation Liquid metal thermal interface for an integrated circuit device
EP4376074A1 (en) * 2022-11-25 2024-05-29 Infineon Technologies AG Conductor rail, and power semiconductor module arrangement comprising a conductor rail

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1041600B (de) * 1956-10-02 1958-10-23 Siemens Ag In einem metallischen Gehaeuse eingebautes, waermeempfindliches, elektrisches Halbleiterbauelement, wie Leistungstransistor oder Richtleiter
DE1030462B (de) * 1956-11-10 1958-05-22 Bosch Gmbh Robert Halbleitergleichrichter fuer hohe Stromstaerken

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US3800190A (en) * 1970-11-02 1974-03-26 Bbc Brown Boveri & Cie Cooling system for power semiconductor devices
US4258383A (en) * 1978-12-22 1981-03-24 Rca Corporation Minimum pressure drop liquid cooled structure for a semiconductor device
WO2006020332A1 (en) * 2004-08-13 2006-02-23 Intel Corporation Liquid metal thermal interface for an integrated circuit device
US7348665B2 (en) 2004-08-13 2008-03-25 Intel Corporation Liquid metal thermal interface for an integrated circuit device
EP4376074A1 (en) * 2022-11-25 2024-05-29 Infineon Technologies AG Conductor rail, and power semiconductor module arrangement comprising a conductor rail

Also Published As

Publication number Publication date
DE1166383B (de) 1964-03-26
NL262292A (cg-RX-API-DMAC7.html)

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