GB902130A - Apparatus for use in applying laminar electrodes to semi-conductor members - Google Patents

Apparatus for use in applying laminar electrodes to semi-conductor members

Info

Publication number
GB902130A
GB902130A GB3737460A GB3737460A GB902130A GB 902130 A GB902130 A GB 902130A GB 3737460 A GB3737460 A GB 3737460A GB 3737460 A GB3737460 A GB 3737460A GB 902130 A GB902130 A GB 902130A
Authority
GB
United Kingdom
Prior art keywords
frame
quartz tube
semi
metal layers
moulds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3737460A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB902130A publication Critical patent/GB902130A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
    • E05D13/00—Accessories for sliding or lifting wings, e.g. pulleys, safety catches
    • E05D13/10—Counterbalance devices
    • E05D13/12—Counterbalance devices with springs
    • E05D13/1253—Counterbalance devices with springs with canted-coil torsion springs
    • E05D13/1261—Counterbalance devices with springs with canted-coil torsion springs specially adapted for overhead wings
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
    • E05Y2900/106—Application of doors, windows, wings or fittings thereof for buildings or parts thereof for garages
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/50—Application of doors, windows, wings or fittings thereof for vehicles
    • E05Y2900/53—Type of wing
    • E05Y2900/531—Doors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Furnace Details (AREA)
  • Farming Of Fish And Shellfish (AREA)
  • Silicon Compounds (AREA)

Abstract

902,130. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. Oct. 31, 1960 [Nov. 24, 1959], No. 37374/60. Addition to 902,129. Class 37. [Also in Group XII] The invention relates to apparatus as described in the parent Specification in which metal layers are alloyed to the surfaces of semiconductor bodies by placing the bodies and metal layers in moulds in a freely suspended frame which is surrounded by a quartz tube in which alloying takes place. According to the invention, a tubular container coaxial with the quartz tube is provided into which the mould assembly may be lifted out of the furnace region. In the Figure, frame 17 carries moulds 18 containing the semi-conductor members and associated metal layers which are to undergo alloying treatment. The frame 17 is suspended from a band 21, whereby it may be lowered through hollow member 3, which is connected to an evacuating pump, into quartz tube 2 lying in a furnace. An eccentric 33 enables container 14 to be lifted away from hollow member 3 and then rotated around a pivot formed by tube 31 so that the frame may be lowered away from quartz tube 2 and recharged.
GB3737460A 1959-10-10 1960-10-31 Apparatus for use in applying laminar electrodes to semi-conductor members Expired GB902130A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES65390A DE1104073B (en) 1959-10-10 1959-10-10 Device for alloying surface electrodes on semiconductor bodies
DES65944A DE1108332B (en) 1959-10-10 1959-11-24 Alloy device for attaching surface electrodes to semiconductor bodies

Publications (1)

Publication Number Publication Date
GB902130A true GB902130A (en) 1962-07-25

Family

ID=25995874

Family Applications (2)

Application Number Title Priority Date Filing Date
GB3217760A Expired GB902129A (en) 1959-10-10 1960-09-19 Apparatus for use in applying laminar electrodes to semi-conductor members
GB3737460A Expired GB902130A (en) 1959-10-10 1960-10-31 Apparatus for use in applying laminar electrodes to semi-conductor members

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB3217760A Expired GB902129A (en) 1959-10-10 1960-09-19 Apparatus for use in applying laminar electrodes to semi-conductor members

Country Status (4)

Country Link
CH (2) CH379002A (en)
DE (2) DE1104073B (en)
GB (2) GB902129A (en)
NL (2) NL256703A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1201492B (en) * 1962-05-04 1965-09-23 Siemens Ag Process for the production of alloy electrodes for semiconductor components according to the type of press powder alloy process
NL302915A (en) * 1963-01-16
CN107543411B (en) * 2017-05-04 2019-05-10 山东中琦环保设备制造有限公司 A kind of superelevation enamel pipe tunnel oven

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1044617A (en) * 1951-03-09 1953-11-19 Materiel Telephonique Improvements in the preparation of semiconductor pellets intended for the manufacture of elements with asymmetric conductivity

Also Published As

Publication number Publication date
CH388457A (en) 1965-02-28
NL256703A (en)
GB902129A (en) 1962-07-25
DE1104073B (en) 1961-04-06
DE1108332B (en) 1961-06-08
CH379002A (en) 1964-06-30
NL255713A (en)

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