ES260823A1 - Alloy device for the application of surface electrodes on semiconductor bodies (Machine-translation by Google Translate, not legally binding)
- Google Patents
Alloy device for the application of surface electrodes on semiconductor bodies (Machine-translation by Google Translate, not legally binding)
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AGfiledCriticalSiemens Schuckertwerke AG
Publication of ES260823A1publicationCriticalpatent/ES260823A1/en
Alloy device for the application of surface electrodes on semi-conductor bodies, by alloying metallic layers, with the help of alloy molds, in which the semi-conductor bodies are arranged horizontally of the alloy surfaces and layers of metal, characterized, because the alloy molds are housed in a frame that is pendulously suspended in an alloy furnace. (Machine-translation by Google Translate, not legally binding)
ES0260823A1959-10-101960-09-06Alloy device for the application of surface electrodes on semiconductor bodies (Machine-translation by Google Translate, not legally binding)
ExpiredES260823A1
(en)