GB891409A - Improvements in or relating to lapping or polishing machines - Google Patents

Improvements in or relating to lapping or polishing machines

Info

Publication number
GB891409A
GB891409A GB2201059A GB2201059A GB891409A GB 891409 A GB891409 A GB 891409A GB 2201059 A GB2201059 A GB 2201059A GB 2201059 A GB2201059 A GB 2201059A GB 891409 A GB891409 A GB 891409A
Authority
GB
United Kingdom
Prior art keywords
plates
axis
lap
polishing
rotate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2201059A
Inventor
Stanley Rofe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB2201059A priority Critical patent/GB891409A/en
Publication of GB891409A publication Critical patent/GB891409A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Abstract

891,409. Lapping. GENERAL ELECTRIC CO. Ltd. June 24, 1960 [June 26, 1959], No. 22010/59. Class 60. A lapping or polishing machine comprises two lap or polishing plates adapted for rotation about a first axis and a seeond axis respectively and a relatively thin member arranged to be located between the plates as a work-holder for workpieces positioned for engagement by the opposing surfaces of the plates and which member is also capable of rotation about a third axis perpendicular to the planes of said opposing surfaces, all three axes being parallel to one another and being positioned so that said third axis is nearer to said first axis than is said second axis, and the arrangement being such that on operation of the machine to lap or polish simultaneously opposite faces of the workpiece the relatively thin member and the plates rotate each about its respective axis so that there is continuous sliding engagement between the said opposing surfaces of the plates and the said opposite faces of the workpieces. A lapping machine has lap plates 1, 2 of metal, e.g. cast-iron. Lap plate 1 is attached to a platform 7 having a shaft 12 through which it is driven to rotate at 250-500 r.p.m. about axis 8. Lap plate 2 is engaged by a cover plate 9 mounted at its centre on a spindle 11 so as to be free to rotate about axis 10. A thin plastic or metal disc 13 has a central boss 20 mounted on a spindle 14 so as to be free to rotate about axis 15. Spindles 11, 14 are formed from a single fixed crank shaft. The disc 13 has apertures arranged in a circle to receive workpieces 3 which are plates of hard material, e.g. quartz vibrator plates employed in telecommunication systems. Axes 8, 10, 15 are parallel to one another, perpendicular to the surfaces of the lap plates and lie in the same vertical plane. Axes 8, 10 are equally spaced from axis 15. Abrasive in a suitable medium, e.g. emery or carborundum powder in paraffin, is applied to the surfaces of the lap plates. For polishing, the lap plates 1, 2 are replaced by polishing plates comprising a metal plate with a covering of pitch or a disc of plastic material with a metal backing member, and a polishing medium, e.g. rouge, is used.
GB2201059A 1959-06-26 1959-06-26 Improvements in or relating to lapping or polishing machines Expired GB891409A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2201059A GB891409A (en) 1959-06-26 1959-06-26 Improvements in or relating to lapping or polishing machines

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2201059A GB891409A (en) 1959-06-26 1959-06-26 Improvements in or relating to lapping or polishing machines

Publications (1)

Publication Number Publication Date
GB891409A true GB891409A (en) 1962-03-14

Family

ID=10172476

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2201059A Expired GB891409A (en) 1959-06-26 1959-06-26 Improvements in or relating to lapping or polishing machines

Country Status (1)

Country Link
GB (1) GB891409A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8113913B2 (en) 2007-03-19 2012-02-14 Siltronic Ag Method for the simultaneous grinding of a plurality of semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8113913B2 (en) 2007-03-19 2012-02-14 Siltronic Ag Method for the simultaneous grinding of a plurality of semiconductor wafers
DE102007056627B4 (en) 2007-03-19 2023-12-21 Lapmaster Wolters Gmbh Method for grinding several semiconductor wafers simultaneously

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