GB881646A - Improvements in and relating to transistors - Google Patents

Improvements in and relating to transistors

Info

Publication number
GB881646A
GB881646A GB15433/59A GB1543359A GB881646A GB 881646 A GB881646 A GB 881646A GB 15433/59 A GB15433/59 A GB 15433/59A GB 1543359 A GB1543359 A GB 1543359A GB 881646 A GB881646 A GB 881646A
Authority
GB
United Kingdom
Prior art keywords
conductors
cap
wafer
eyelet
anodized aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15433/59A
Other languages
English (en)
Inventor
Paul Martin Shearman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL251229D priority Critical patent/NL251229A/xx
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB15433/59A priority patent/GB881646A/en
Priority to US26159A priority patent/US3030560A/en
Priority to FR826061A priority patent/FR1255878A/fr
Priority to DEA34560A priority patent/DE1208006B/de
Publication of GB881646A publication Critical patent/GB881646A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB15433/59A 1959-05-05 1959-05-05 Improvements in and relating to transistors Expired GB881646A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
NL251229D NL251229A (de) 1959-05-05
GB15433/59A GB881646A (en) 1959-05-05 1959-05-05 Improvements in and relating to transistors
US26159A US3030560A (en) 1959-05-05 1960-05-02 Transistors
FR826061A FR1255878A (fr) 1959-05-05 1960-05-03 Perfectionnements apportés aux transistors
DEA34560A DE1208006B (de) 1959-05-05 1960-05-04 Transistor in einer metallischen Kapsel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB15433/59A GB881646A (en) 1959-05-05 1959-05-05 Improvements in and relating to transistors

Publications (1)

Publication Number Publication Date
GB881646A true GB881646A (en) 1961-11-08

Family

ID=10059047

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15433/59A Expired GB881646A (en) 1959-05-05 1959-05-05 Improvements in and relating to transistors

Country Status (4)

Country Link
US (1) US3030560A (de)
DE (1) DE1208006B (de)
GB (1) GB881646A (de)
NL (1) NL251229A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266885B (de) * 1961-12-28 1968-04-25 Rca Corp Bauelement mit einer Halbleiteranordnung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462654A (en) * 1966-10-05 1969-08-19 Int Rectifier Corp Electrically insulating-heat conductive mass for semiconductor wafers
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE539483A (de) *
DE968515C (de) * 1950-09-22 1958-02-27 Siemens Ag Trockengleichrichter
US2788474A (en) * 1953-09-10 1957-04-09 Westinghouse Electric Corp Rectifier assembly
NL183243C (nl) * 1953-11-30 Metallgesellschaft Ag Werkwijze voor het op metaaloppervlakken aanbrengen van fosfaatbekledingen.
US2900584A (en) * 1954-06-16 1959-08-18 Motorola Inc Transistor method and product
US2822512A (en) * 1955-05-17 1958-02-04 Westinghouse Brake & Signal Rectifier assemblies
DE1048358B (de) * 1955-08-12 1959-01-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266885B (de) * 1961-12-28 1968-04-25 Rca Corp Bauelement mit einer Halbleiteranordnung

Also Published As

Publication number Publication date
US3030560A (en) 1962-04-17
DE1208006B (de) 1965-12-30
NL251229A (de)

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