GB873753A - Improvements in or relating to acid baths for producing brilliant electrolytic copper levelling coatings - Google Patents

Improvements in or relating to acid baths for producing brilliant electrolytic copper levelling coatings

Info

Publication number
GB873753A
GB873753A GB27741/57A GB2774157A GB873753A GB 873753 A GB873753 A GB 873753A GB 27741/57 A GB27741/57 A GB 27741/57A GB 2774157 A GB2774157 A GB 2774157A GB 873753 A GB873753 A GB 873753A
Authority
GB
United Kingdom
Prior art keywords
acid
groups
electrolytic copper
riedel
thiourea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27741/57A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB873753A publication Critical patent/GB873753A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

873,753. Electrodeposition of bright copper. RIEDEL, A., and BACHMANN, F., [trading as RIEDEL & CO.]. Sept. 3, 1957 [March 16, 1957; June 14, 1957], No. 27741/57. Class 41. Bright level electrolytic copper deposits are obtained from acid baths to which are added as brightening agents dithiocarbamic acid derivatives having one or more groups or heterocyclic nitrogen compounds in which one or more of the hydrogen atoms linked to carbon atoms are replaced by the radical -S-(CH2)n-X where X is -OH, -COOH, or a water-solubilizing group other than -SO3H and n is 1 to 10; and as levelling agents water-soluble condensation products of thiourea and formaldehyde where n is 1 to 12, or condensation products of thiourea with formaldehyde and a compound with not less than two -NH2 groups of formula where R is benzene, naphthalene, diphenyl, anthracene, phenanthrene, pyrene, triazine, or other heterocyclic, aliphatic or cycloaliphatic residue and n is 1 to 10. The compound having at least two -NH2 groups may be urea; guanidine; phenylenediamines; 2 : 4<1>-diaminodiphenyl; melamine; the 4 : 4<1>-diamino derivatives of azobenzene, diphenylamine or diphenylurea; 4 : 4<1> - diaminostilbene benzidene, naphthalene diamines and their disulphonic acids; o-dianisidine; parafuchsin, or congo red. Brighteners specifically mentioned are N : N - diethyl - dithiocarbamic acid - S - propyl ester-# carboxylic acid, pyrazine-3 : 6- bis-thioglycolic acid, and pyrazine-3 : 6-di- (mercapto-#-hydroxypropane). An alkyl polyglycol wetting agent, e.g. an alkylphenol polyglycol ether, may also be included in the bath.
GB27741/57A 1957-03-16 1957-09-03 Improvements in or relating to acid baths for producing brilliant electrolytic copper levelling coatings Expired GB873753A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DER20796A DE1152863B (en) 1957-03-16 1957-03-16 Acid baths for the production of leveling copper coatings

Publications (1)

Publication Number Publication Date
GB873753A true GB873753A (en) 1961-07-26

Family

ID=7400753

Family Applications (1)

Application Number Title Priority Date Filing Date
GB27741/57A Expired GB873753A (en) 1957-03-16 1957-09-03 Improvements in or relating to acid baths for producing brilliant electrolytic copper levelling coatings

Country Status (4)

Country Link
US (1) US3101305A (en)
DE (1) DE1152863B (en)
FR (1) FR1181721A (en)
GB (1) GB873753A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276979A (en) * 1961-08-31 1966-10-04 Dehydag Gmbh Baths and processes for the production of metal electroplates

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE621297A (en) * 1961-08-10
DE1180140B (en) * 1962-07-20 1964-10-22 Dehydag Gmbh Process for the separation of fine-grained deposits in the refining and reduction electrolysis of nickel, zinc, silver, tin, lead and especially copper
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
DE1496982B1 (en) * 1966-08-02 1970-10-15 Riedel & Co Cyanidic bright copper bath
DE1496723B1 (en) * 1966-12-12 1971-11-25 Dayton Bright Copper Co ACID GALVANIC SHINY COPPER BATH
FR2085243A1 (en) * 1970-04-01 1971-12-24 Peugeot & Renault
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
DE102005011708B3 (en) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
US9243339B2 (en) * 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE888493C (en) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Process for the production of firmly adhering and shiny galvanic copper coatings
NL90899C (en) * 1953-04-28
DE924489C (en) * 1953-04-28 1955-03-03 Degussa Bath for the galvanic deposition of metals
DE1001078B (en) * 1953-08-13 1957-01-17 Dehydag Gmbh Galvanic baths for the production of metal coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3276979A (en) * 1961-08-31 1966-10-04 Dehydag Gmbh Baths and processes for the production of metal electroplates

Also Published As

Publication number Publication date
US3101305A (en) 1963-08-20
FR1181721A (en) 1959-06-18
DE1152863B (en) 1963-08-14

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