FR1181721A - Improvements made to acid baths for the manufacture of copper coatings - Google Patents
Improvements made to acid baths for the manufacture of copper coatingsInfo
- Publication number
- FR1181721A FR1181721A FR1181721DA FR1181721A FR 1181721 A FR1181721 A FR 1181721A FR 1181721D A FR1181721D A FR 1181721DA FR 1181721 A FR1181721 A FR 1181721A
- Authority
- FR
- France
- Prior art keywords
- manufacture
- improvements made
- acid baths
- copper coatings
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DER20796A DE1152863B (en) | 1957-03-16 | 1957-03-16 | Acid baths for the production of leveling copper coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1181721A true FR1181721A (en) | 1959-06-18 |
Family
ID=7400753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1181721D Expired FR1181721A (en) | 1957-03-16 | 1957-08-28 | Improvements made to acid baths for the manufacture of copper coatings |
Country Status (4)
Country | Link |
---|---|
US (1) | US3101305A (en) |
DE (1) | DE1152863B (en) |
FR (1) | FR1181721A (en) |
GB (1) | GB873753A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1224111B (en) * | 1961-08-10 | 1966-09-01 | Dehydag Gmbh | Acid galvanic copper and nickel baths and process for depositing the coatings |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1184172B (en) * | 1961-08-31 | 1964-12-23 | Dehydag Gmbh | Process for the galvanic deposition of firmly adhering and high-gloss copper coatings |
DE1180140B (en) * | 1962-07-20 | 1964-10-22 | Dehydag Gmbh | Process for the separation of fine-grained deposits in the refining and reduction electrolysis of nickel, zinc, silver, tin, lead and especially copper |
US3414493A (en) * | 1965-10-19 | 1968-12-03 | Lea Ronal Inc | Electrodeposition of copper |
DE1496982B1 (en) * | 1966-08-02 | 1970-10-15 | Riedel & Co | Cyanidic bright copper bath |
DE1496723B1 (en) * | 1966-12-12 | 1971-11-25 | Dayton Bright Copper Co | ACID GALVANIC SHINY COPPER BATH |
FR2085243A1 (en) * | 1970-04-01 | 1971-12-24 | Peugeot & Renault | |
US3725220A (en) * | 1972-04-27 | 1973-04-03 | Lea Ronal Inc | Electrodeposition of copper from acidic baths |
US4134803A (en) * | 1977-12-21 | 1979-01-16 | R. O. Hull & Company, Inc. | Nitrogen and sulfur compositions and acid copper plating baths |
US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
US6709568B2 (en) | 2002-06-13 | 2004-03-23 | Advanced Technology Materials, Inc. | Method for determining concentrations of additives in acid copper electrochemical deposition baths |
DE10261852B3 (en) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
US20050109624A1 (en) * | 2003-11-25 | 2005-05-26 | Mackenzie King | On-wafer electrochemical deposition plating metrology process and apparatus |
US20050224370A1 (en) * | 2004-04-07 | 2005-10-13 | Jun Liu | Electrochemical deposition analysis system including high-stability electrode |
US6984299B2 (en) * | 2004-04-27 | 2006-01-10 | Advanced Technology Material, Inc. | Methods for determining organic component concentrations in an electrolytic solution |
US7435320B2 (en) | 2004-04-30 | 2008-10-14 | Advanced Technology Materials, Inc. | Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
US7427346B2 (en) * | 2004-05-04 | 2008-09-23 | Advanced Technology Materials, Inc. | Electrochemical drive circuitry and method |
DE102005011708B3 (en) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate |
US9243339B2 (en) * | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE888493C (en) * | 1951-11-03 | 1953-09-03 | Hydrierwerke A G Deutsche | Process for the production of firmly adhering and shiny galvanic copper coatings |
BE528448A (en) * | 1953-04-28 | |||
DE924489C (en) * | 1953-04-28 | 1955-03-03 | Degussa | Bath for the galvanic deposition of metals |
DE1001078B (en) * | 1953-08-13 | 1957-01-17 | Dehydag Gmbh | Galvanic baths for the production of metal coatings |
-
1957
- 1957-03-16 DE DER20796A patent/DE1152863B/en active Pending
- 1957-08-28 FR FR1181721D patent/FR1181721A/en not_active Expired
- 1957-09-03 GB GB27741/57A patent/GB873753A/en not_active Expired
-
1958
- 1958-03-12 US US720824A patent/US3101305A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1224111B (en) * | 1961-08-10 | 1966-09-01 | Dehydag Gmbh | Acid galvanic copper and nickel baths and process for depositing the coatings |
Also Published As
Publication number | Publication date |
---|---|
GB873753A (en) | 1961-07-26 |
US3101305A (en) | 1963-08-20 |
DE1152863B (en) | 1963-08-14 |
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