GB8614398D0 - Calibration apparatus - Google Patents

Calibration apparatus

Info

Publication number
GB8614398D0
GB8614398D0 GB868614398A GB8614398A GB8614398D0 GB 8614398 D0 GB8614398 D0 GB 8614398D0 GB 868614398 A GB868614398 A GB 868614398A GB 8614398 A GB8614398 A GB 8614398A GB 8614398 D0 GB8614398 D0 GB 8614398D0
Authority
GB
United Kingdom
Prior art keywords
calibration apparatus
calibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB868614398A
Other versions
GB2184849A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Publication of GB8614398D0 publication Critical patent/GB8614398D0/en
Publication of GB2184849A publication Critical patent/GB2184849A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB08614398A 1985-06-13 1986-06-13 Calibrating microwave integrated circuit test systems Withdrawn GB2184849A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858515025A GB8515025D0 (en) 1985-06-13 1985-06-13 Calibration apparatus

Publications (2)

Publication Number Publication Date
GB8614398D0 true GB8614398D0 (en) 1986-07-16
GB2184849A GB2184849A (en) 1987-07-01

Family

ID=10580709

Family Applications (2)

Application Number Title Priority Date Filing Date
GB858515025A Pending GB8515025D0 (en) 1985-06-13 1985-06-13 Calibration apparatus
GB08614398A Withdrawn GB2184849A (en) 1985-06-13 1986-06-13 Calibrating microwave integrated circuit test systems

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB858515025A Pending GB8515025D0 (en) 1985-06-13 1985-06-13 Calibration apparatus

Country Status (4)

Country Link
EP (1) EP0224582A1 (en)
JP (1) JPS63500907A (en)
GB (2) GB8515025D0 (en)
WO (1) WO1986007493A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
JP4183859B2 (en) * 1999-09-02 2008-11-19 株式会社アドバンテスト Semiconductor substrate testing equipment
DE10056882C2 (en) 2000-11-16 2003-06-05 Infineon Technologies Ag Method for calibrating a test system for semiconductor components and test substrate
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) * 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
CN103954927B (en) * 2014-05-21 2016-03-23 常州天合光能有限公司 Volume resistance and square resistance change calibrating installation and calibration steps thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349792A (en) * 1978-07-14 1982-09-14 Kings Electronics Co., Inc. Pi pad attenuator
US4272739A (en) * 1979-10-18 1981-06-09 Morton Nesses High-precision electrical signal attenuator structures
DE3382183D1 (en) * 1982-12-23 1991-04-04 Sumitomo Electric Industries MONOLITHIC INTEGRATED MICROWAVE CIRCUIT AND METHOD FOR SELECTING THE SAME.

Also Published As

Publication number Publication date
GB8515025D0 (en) 1985-07-17
JPS63500907A (en) 1988-03-31
EP0224582A1 (en) 1987-06-10
GB2184849A (en) 1987-07-01
WO1986007493A1 (en) 1986-12-18

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)