GB8517231D0 - Ultrasonic wire bonder - Google Patents

Ultrasonic wire bonder

Info

Publication number
GB8517231D0
GB8517231D0 GB858517231A GB8517231A GB8517231D0 GB 8517231 D0 GB8517231 D0 GB 8517231D0 GB 858517231 A GB858517231 A GB 858517231A GB 8517231 A GB8517231 A GB 8517231A GB 8517231 D0 GB8517231 D0 GB 8517231D0
Authority
GB
United Kingdom
Prior art keywords
bonding
wires
contact area
triac
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858517231A
Other versions
GB2177639A (en
GB2177639B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Priority to GB08517231A priority Critical patent/GB2177639B/en
Publication of GB8517231D0 publication Critical patent/GB8517231D0/en
Publication of GB2177639A publication Critical patent/GB2177639A/en
Application granted granted Critical
Publication of GB2177639B publication Critical patent/GB2177639B/en
Expired legal-status Critical Current

Links

Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The bonder is provided with a single bonding head 10 which has two bonding wedges and grooves for location of wires W1, W2 under the wedges and two guides through a tongue 10A at the rear of the bonding head. It is used to perform the simultaneous bonding of two connecting wires on the contact area 2 of a semiconductor device 3 and on a conductor 5 associated with the contact area. The bonding time required for two wires of a given diameter is the same as that required to bond a single wire of the same diameter, thus twin connecting wires may be provided in half the bonding cycle time and the wire spacing is accurately determined without operator intervention. The bonder is of particular use in the manufacture of triac devices where the wires can be accurately spaced one over a first sector, the other over a second sector of the triac structure, on a contact area common to both sectors of the triac. <IMAGE>
GB08517231A 1985-07-08 1985-07-08 Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith Expired GB2177639B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08517231A GB2177639B (en) 1985-07-08 1985-07-08 Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08517231A GB2177639B (en) 1985-07-08 1985-07-08 Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith

Publications (3)

Publication Number Publication Date
GB8517231D0 true GB8517231D0 (en) 1985-08-14
GB2177639A GB2177639A (en) 1987-01-28
GB2177639B GB2177639B (en) 1988-12-29

Family

ID=10581963

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08517231A Expired GB2177639B (en) 1985-07-08 1985-07-08 Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith

Country Status (1)

Country Link
GB (1) GB2177639B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114566456A (en) * 2022-04-29 2022-05-31 深圳市铨天科技有限公司 Packaging equipment for multilayer stacked storage chips

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69305633T2 (en) * 1993-06-30 1997-03-06 Cons Ric Microelettronica Method and device for connecting wires between a semiconductor chip and the associated lead frame
EP1109214A1 (en) 1999-12-16 2001-06-20 Infineon Technologies AG Device and method to contact circuit components
JP2001267355A (en) * 2000-03-17 2001-09-28 Murata Mfg Co Ltd Method for wire bonding and surface acoustic wave device using the method for wire bonding
US7216794B2 (en) * 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
GB2514087B (en) * 2013-03-11 2018-01-24 Kuka Systems Uk Ltd Linear friction welding

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1096486A (en) * 1965-12-22 1967-12-29 Tetra Pak Ab A method of producing a thermo-couple
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3625783A (en) * 1969-05-07 1971-12-07 Western Electric Co Simultaneous bonding of multiple workpieces
US3747198A (en) * 1971-08-19 1973-07-24 Gen Electric Tailless wedge bonding of gold wire to palladium-silver cermets
AU507497B2 (en) * 1975-06-26 1980-02-14 Kollmorgen Corp. Coupling continuous conductive filaments toan element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114566456A (en) * 2022-04-29 2022-05-31 深圳市铨天科技有限公司 Packaging equipment for multilayer stacked storage chips
CN114566456B (en) * 2022-04-29 2022-08-23 深圳市铨天科技有限公司 Packaging equipment for multilayer stacked storage chips

Also Published As

Publication number Publication date
GB2177639A (en) 1987-01-28
GB2177639B (en) 1988-12-29

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