GB8516441D0 - Electrical interconnection arrangement - Google Patents

Electrical interconnection arrangement

Info

Publication number
GB8516441D0
GB8516441D0 GB858516441A GB8516441A GB8516441D0 GB 8516441 D0 GB8516441 D0 GB 8516441D0 GB 858516441 A GB858516441 A GB 858516441A GB 8516441 A GB8516441 A GB 8516441A GB 8516441 D0 GB8516441 D0 GB 8516441D0
Authority
GB
United Kingdom
Prior art keywords
electrical interconnection
interconnection arrangement
arrangement
electrical
interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858516441A
Other versions
GB2177253A (en
GB2177253B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB08516441A priority Critical patent/GB2177253B/en
Publication of GB8516441D0 publication Critical patent/GB8516441D0/en
Publication of GB2177253A publication Critical patent/GB2177253A/en
Application granted granted Critical
Publication of GB2177253B publication Critical patent/GB2177253B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB08516441A 1985-06-28 1985-06-28 An electrical interconnecting arrangement for a semiconductor device Expired GB2177253B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08516441A GB2177253B (en) 1985-06-28 1985-06-28 An electrical interconnecting arrangement for a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08516441A GB2177253B (en) 1985-06-28 1985-06-28 An electrical interconnecting arrangement for a semiconductor device

Publications (3)

Publication Number Publication Date
GB8516441D0 true GB8516441D0 (en) 1985-07-31
GB2177253A GB2177253A (en) 1987-01-14
GB2177253B GB2177253B (en) 1988-11-09

Family

ID=10581497

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08516441A Expired GB2177253B (en) 1985-06-28 1985-06-28 An electrical interconnecting arrangement for a semiconductor device

Country Status (1)

Country Link
GB (1) GB2177253B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384599A1 (en) * 1989-02-03 1990-08-29 General Electric Company Integrated circuit test structure and test process
US5038100A (en) * 1989-05-25 1991-08-06 Massachusetts Institute Of Technology Microwave test fixture
JPH0439950A (en) * 1990-06-05 1992-02-10 Alps Electric Co Ltd Semiconductor device
US5166605A (en) * 1991-08-02 1992-11-24 General Electric Company Controlled impedance test fixture for planar electronic device
GB2263980B (en) * 1992-02-07 1996-04-10 Marconi Gec Ltd Apparatus and method for testing bare dies
GB2279805B (en) * 1993-07-02 1997-09-17 Plessey Semiconductors Ltd Bare die testing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1411220A (en) * 1971-10-09 1975-10-22 Lucas Industries Ltd Method of securing electrical components to members

Also Published As

Publication number Publication date
GB2177253A (en) 1987-01-14
GB2177253B (en) 1988-11-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee