GB2177253B - An electrical interconnecting arrangement for a semiconductor device - Google Patents
An electrical interconnecting arrangement for a semiconductor deviceInfo
- Publication number
- GB2177253B GB2177253B GB08516441A GB8516441A GB2177253B GB 2177253 B GB2177253 B GB 2177253B GB 08516441 A GB08516441 A GB 08516441A GB 8516441 A GB8516441 A GB 8516441A GB 2177253 B GB2177253 B GB 2177253B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- electrical interconnecting
- interconnecting arrangement
- arrangement
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08516441A GB2177253B (en) | 1985-06-28 | 1985-06-28 | An electrical interconnecting arrangement for a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08516441A GB2177253B (en) | 1985-06-28 | 1985-06-28 | An electrical interconnecting arrangement for a semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8516441D0 GB8516441D0 (en) | 1985-07-31 |
GB2177253A GB2177253A (en) | 1987-01-14 |
GB2177253B true GB2177253B (en) | 1988-11-09 |
Family
ID=10581497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08516441A Expired GB2177253B (en) | 1985-06-28 | 1985-06-28 | An electrical interconnecting arrangement for a semiconductor device |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2177253B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0384599A1 (en) * | 1989-02-03 | 1990-08-29 | General Electric Company | Integrated circuit test structure and test process |
US5038100A (en) * | 1989-05-25 | 1991-08-06 | Massachusetts Institute Of Technology | Microwave test fixture |
JPH0439950A (en) * | 1990-06-05 | 1992-02-10 | Alps Electric Co Ltd | Semiconductor device |
US5166605A (en) * | 1991-08-02 | 1992-11-24 | General Electric Company | Controlled impedance test fixture for planar electronic device |
GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
GB2279805B (en) * | 1993-07-02 | 1997-09-17 | Plessey Semiconductors Ltd | Bare die testing |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1411220A (en) * | 1971-10-09 | 1975-10-22 | Lucas Industries Ltd | Method of securing electrical components to members |
-
1985
- 1985-06-28 GB GB08516441A patent/GB2177253B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2177253A (en) | 1987-01-14 |
GB8516441D0 (en) | 1985-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |