GB8427262D0 - Electronic chip-carrier heat sinks - Google Patents

Electronic chip-carrier heat sinks

Info

Publication number
GB8427262D0
GB8427262D0 GB8427262A GB8427262A GB8427262D0 GB 8427262 D0 GB8427262 D0 GB 8427262D0 GB 8427262 A GB8427262 A GB 8427262A GB 8427262 A GB8427262 A GB 8427262A GB 8427262 D0 GB8427262 D0 GB 8427262D0
Authority
GB
United Kingdom
Prior art keywords
heat sinks
electronic chip
carrier heat
carrier
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8427262A
Other versions
GB2163287B (en
GB2163287A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermal Products Inc
Original Assignee
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc filed Critical Aavid Engineering Inc
Publication of GB8427262D0 publication Critical patent/GB8427262D0/en
Publication of GB2163287A publication Critical patent/GB2163287A/en
Application granted granted Critical
Publication of GB2163287B publication Critical patent/GB2163287B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8427262A 1984-08-07 1984-10-29 Electronic chip-carrier heat sinks Expired GB2163287B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63841584A 1984-08-07 1984-08-07

Publications (3)

Publication Number Publication Date
GB8427262D0 true GB8427262D0 (en) 1984-12-05
GB2163287A GB2163287A (en) 1986-02-19
GB2163287B GB2163287B (en) 1988-06-08

Family

ID=24559931

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8427262A Expired GB2163287B (en) 1984-08-07 1984-10-29 Electronic chip-carrier heat sinks

Country Status (3)

Country Link
JP (1) JPS6143454A (en)
DE (1) DE3439556A1 (en)
GB (1) GB2163287B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112888156A (en) * 2021-01-15 2021-06-01 新余市木林森线路板有限公司 High-thermal-conductivity aluminum-based circuit board and preparation process thereof

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US5282111A (en) * 1989-06-09 1994-01-25 Labinal Components And Systems, Inc. Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
US5485351A (en) * 1989-06-09 1996-01-16 Labinal Components And Systems, Inc. Socket assembly for integrated circuit chip package
EP0449150B1 (en) * 1990-03-26 1999-03-03 Labinal Components And Systems, Inc. Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
DE29620593U1 (en) * 1996-11-26 1998-01-02 Siemens AG, 80333 München Socket for an integrated circuit
DE29620596U1 (en) * 1996-11-26 1998-01-22 Siemens AG, 80333 München Socket for an integrated circuit
DE29620595U1 (en) * 1996-11-26 1998-01-02 Siemens AG, 80333 München Socket for an integrated circuit
EP0948047A3 (en) * 1998-03-20 1999-12-22 Caesar Technology Inc. Electronic component cooling arrangement
US6949822B2 (en) * 2000-03-17 2005-09-27 International Rectifier Corporation Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
ES2295737T3 (en) * 2004-07-02 2008-04-16 F. Hoffmann-La Roche Ag DEVICE FOR A RELIABLE ANALYSIS.
US7280360B2 (en) * 2005-01-28 2007-10-09 Hewlett-Packard Development Company, L.P. Socket adapted for compressive loading
US7932532B2 (en) * 2009-08-04 2011-04-26 Cree, Inc. Solid state lighting device with improved heatsink
TWI783209B (en) * 2020-02-06 2022-11-11 搏盟科技股份有限公司 Structure and processing method of heat sink of memory module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2216162A1 (en) * 1972-04-04 1973-10-11 Staver Co HEAT SINK FOR A SEMI-CONDUCTOR DEVICE
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112888156A (en) * 2021-01-15 2021-06-01 新余市木林森线路板有限公司 High-thermal-conductivity aluminum-based circuit board and preparation process thereof

Also Published As

Publication number Publication date
GB2163287B (en) 1988-06-08
JPS6143454A (en) 1986-03-03
DE3439556A1 (en) 1986-02-20
GB2163287A (en) 1986-02-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee