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DE29620595U1 - Socket for an integrated circuit - Google Patents

Socket for an integrated circuit

Info

Publication number
DE29620595U1
DE29620595U1 DE1996220595 DE29620595U DE29620595U1 DE 29620595 U1 DE29620595 U1 DE 29620595U1 DE 1996220595 DE1996220595 DE 1996220595 DE 29620595 U DE29620595 U DE 29620595U DE 29620595 U1 DE29620595 U1 DE 29620595U1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1996220595
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00-H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/32Holders for supporting the complete device in operation, i.e. detachable fixtures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4087Mounting accessories, interposers, clamping or screwing parts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RLINE CONNECTORS; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
DE1996220595 1996-11-26 1996-11-26 Socket for an integrated circuit Expired - Lifetime DE29620595U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1996220595 DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996220595 DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit
PCT/DE1997/002757 WO1998024124A1 (en) 1996-11-26 1997-11-25 Base for integrated circuit

Publications (1)

Publication Number Publication Date
DE29620595U1 true DE29620595U1 (en) 1998-01-02

Family

ID=8032496

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1996220595 Expired - Lifetime DE29620595U1 (en) 1996-11-26 1996-11-26 Socket for an integrated circuit

Country Status (2)

Country Link
DE (1) DE29620595U1 (en)
WO (1) WO1998024124A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6580613B2 (en) * 2001-07-17 2003-06-17 Infineon Technologies Ag Solder-free PCB assembly

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (en) * 1979-05-10 1980-11-20 Siemens Ag Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block
DE3509734A1 (en) * 1984-03-19 1985-09-19 Tektronix Inc Method and apparatus for making an electrical connection between a system of an integrated circuit and an etched circuit board
DE3439556A1 (en) * 1984-08-07 1986-02-20 Aavid Eng Inc A waermesenke visual cover for an electronic chip receiving traeger
EP0255244A1 (en) * 1986-07-31 1988-02-03 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
DE3629567A1 (en) * 1986-08-30 1988-03-03 Bbc Brown Boveri & Cie Semiconductor block
US4906194A (en) * 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
EP0398506A2 (en) * 1989-05-17 1990-11-22 The Whitaker Corporation Electrical socket for tab IC's
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
DE4326207A1 (en) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanically floating multi-chip substrate
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
DE4310446C1 (en) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements
GB2272580A (en) * 1992-11-16 1994-05-18 Toshiba Kk Shield structure for use in microwave circuit device
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink assembly with a thermally conductive plate for a plurality of integrated circuits on a substrate
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK231287D0 (en) * 1986-05-07 1987-05-06 Digital Equipment Corp System for detachable mounting of semiconductors on ledersubstrater
US4899208A (en) * 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
JPH0652762B2 (en) * 1991-01-22 1994-07-06 日本航空電子工業株式会社 socket
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (en) * 1979-05-10 1980-11-20 Siemens Ag Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block
DE3509734A1 (en) * 1984-03-19 1985-09-19 Tektronix Inc Method and apparatus for making an electrical connection between a system of an integrated circuit and an etched circuit board
DE3439556A1 (en) * 1984-08-07 1986-02-20 Aavid Eng Inc A waermesenke visual cover for an electronic chip receiving traeger
EP0255244A1 (en) * 1986-07-31 1988-02-03 Amp Incorporated Connector having contact modules for a substrate such as an IC chip carrier
DE3629567A1 (en) * 1986-08-30 1988-03-03 Bbc Brown Boveri & Cie Semiconductor block
US4906194A (en) * 1989-04-13 1990-03-06 Amp Incorporated High density connector for an IC chip carrier
EP0398506A2 (en) * 1989-05-17 1990-11-22 The Whitaker Corporation Electrical socket for tab IC's
US5058265A (en) * 1990-05-10 1991-10-22 Rockwell International Corporation Method for packaging a board of electronic components
US5357404A (en) * 1991-11-18 1994-10-18 The Whitaker Corporation EMI shield, and assembly using same
DE4326207A1 (en) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanically floating multi-chip substrate
GB2272580A (en) * 1992-11-16 1994-05-18 Toshiba Kk Shield structure for use in microwave circuit device
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
DE4310446C1 (en) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements
DE4410467A1 (en) * 1993-07-06 1995-01-19 Hewlett Packard Co Heat sink assembly with a thermally conductive plate for a plurality of integrated circuits on a substrate
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same

Also Published As

Publication number Publication date Type
WO1998024124A1 (en) 1998-06-04 application

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Legal Events

Date Code Title Description
R163 Identified publications notified
R207 Utility model specification

Effective date: 19980212

R156 Lapse of ip right after 3 years

Effective date: 20000901