GB816458A - Printed circuit - Google Patents

Printed circuit

Info

Publication number
GB816458A
GB816458A GB15092/57A GB1509257A GB816458A GB 816458 A GB816458 A GB 816458A GB 15092/57 A GB15092/57 A GB 15092/57A GB 1509257 A GB1509257 A GB 1509257A GB 816458 A GB816458 A GB 816458A
Authority
GB
United Kingdom
Prior art keywords
foil
panel
printed
die
moulding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15092/57A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Erie Resistor Corp
Original Assignee
Erie Resistor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erie Resistor Corp filed Critical Erie Resistor Corp
Publication of GB816458A publication Critical patent/GB816458A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

816,458. Moulding printed circuits. ERIE RESISTOR CORPORATION. May 13, 1957 [May 28, 1956], No. 15092/57. Addition to 725,115. Class 87(2). [Also in Groups VIII and XXXVI] In a method of making printed circuits as described in the parent Specification wherein a metal foil sheet 9 is bonded to the surface of a body 7 comprising a plurality of fibre sheets impregnated with an uncured thermosetting resin by compressing them between heated platens 8, 11, the upper one of which carries a die 12 provided with projections 13 so that the surface of the resulting cured foil-clad laminate is covered with depressions in the form of the desired circuit pattern, the die 12 is also provided with tubular projections 14 so that the form of the printed wiring panel at the end of the moulding operation is as shown in Fig. 4. By subsequently sanding away the upper and lower surfaces of the panel to the lines 20 and 21, there results a printed-circuit panel bearing the desired circuit configuration and having apertures therethrough at predetermined positions with respect to the circuit pattern and provided with foil-clad walls. A layer 10 of adhesive is placed between the foil 9 and the fibre sheets 7 before the moulding operation is carried out.
GB15092/57A 1956-05-28 1957-05-13 Printed circuit Expired GB816458A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US816458XA 1956-05-28 1956-05-28

Publications (1)

Publication Number Publication Date
GB816458A true GB816458A (en) 1959-07-15

Family

ID=22165465

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15092/57A Expired GB816458A (en) 1956-05-28 1957-05-13 Printed circuit

Country Status (1)

Country Link
GB (1) GB816458A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143766A (en) * 1983-07-23 1985-02-20 Fothergill & Harvey Plc Surface preparation of fibre-reinforced thermoplastics
EP0271163A2 (en) * 1986-12-09 1988-06-15 Philips Patentverwaltung GmbH Manufacturing method of electrical circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143766A (en) * 1983-07-23 1985-02-20 Fothergill & Harvey Plc Surface preparation of fibre-reinforced thermoplastics
EP0271163A2 (en) * 1986-12-09 1988-06-15 Philips Patentverwaltung GmbH Manufacturing method of electrical circuit boards
EP0271163A3 (en) * 1986-12-09 1988-12-28 Philips Patentverwaltung Gmbh Manufacturing method of electrical circuit boards

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