GB710474A - Improvements in or relating to electro plating - Google Patents

Improvements in or relating to electro plating

Info

Publication number
GB710474A
GB710474A GB15423/52A GB1542352A GB710474A GB 710474 A GB710474 A GB 710474A GB 15423/52 A GB15423/52 A GB 15423/52A GB 1542352 A GB1542352 A GB 1542352A GB 710474 A GB710474 A GB 710474A
Authority
GB
United Kingdom
Prior art keywords
thiohydantoin
bath
copper
per
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB15423/52A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric International Co
Original Assignee
Westinghouse Electric International Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric International Co filed Critical Westinghouse Electric International Co
Publication of GB710474A publication Critical patent/GB710474A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

710,474. Electrodeposition of copper. WESTINGHOUSE ELECTRIC INTERNATIONAL CO. June 19, 1952, [July 5, 1951.] No. 15423/52. Drawings to Specification. Class 41. Copper is deposited from a bath comprising essentially copper sulphate and sulphuric acid to which is added 0.0005-0.05 ounce per U.S.A. gallon of 2-thiohydantoin or a derivative thereof having at least one organic substituent in any one of the 1, 3 and 5 positions. The preferred additions have a carbonyl group attached at any one of the 1, 3 and 5 positions and an organic radical attached to the carbonyl group. Examples of specific additions are 1-acetyl-2-thiohydantoin, 5 (2-hydroxylbenzal)-2-thiohydantoin, 5-furfural- 2-thiohydantoin, 1 benzoyl-2-thiohydantoin, 5- benzal-2-hydantoin, 1 methyl-2-thiohydantoin and 3-acetyl-2-hydantoin. The bath preferably contains 26-33 oz. crystallized copper sulphate and 1.3-13 oz. sulphuric acid per U.S.A. gallon. The bath may contain a further addition of up to 3 oz. per U.S.A. gallon of one or more watersoluble organic carboxylic acids e.g. citric, tartaric, oxalic, propionic, succinic, maleic, glycollic, adipic, phthalic, malic, linoleic, pimelic and aconitic acids. Dextrin may also be present. A small proportion of cadmium sulphate may be included in the bath. Known addition agents such as phenol sulphonic acid, glue and thiourea, may also be present. Examples of specific bath compositions are given. Suitable mixtures of the prescribed addition agents may be made up into a composition for addition as required to the plating bath; such a mixture may comprise at least 0.1 per cent by weight of the 2-thiohydantoin compound and up to 80 per cent of an organic carboxylic acid and/or dextrin. A composition may also be prepared including some of the primary plating constituents; such a composition may comprise about 118 parts by weight of a 2-thiohydantoin derivative, 1,475 parts of citric acid and 13,170 parts of powdered copper sulphate crystals. The current may be periodically reversed, the plating period being from 0.1-100 sec. and the deplating period such as to pass 8-90 per cent of the quantity of electricity passing during the plating period. The anodes may be of copper or lead or separate anodes of copper and lead may be employed. Specifications 630,165 and 642,101 are referred to.
GB15423/52A 1951-07-05 1952-06-19 Improvements in or relating to electro plating Expired GB710474A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US235135A US2700019A (en) 1951-07-05 1951-07-05 Acid copper plating

Publications (1)

Publication Number Publication Date
GB710474A true GB710474A (en) 1954-06-16

Family

ID=22884234

Family Applications (1)

Application Number Title Priority Date Filing Date
GB15423/52A Expired GB710474A (en) 1951-07-05 1952-06-19 Improvements in or relating to electro plating

Country Status (2)

Country Link
US (1) US2700019A (en)
GB (1) GB710474A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097231B (en) * 1957-09-11 1961-01-12 Westinghouse Electric Corp Acid galvanic copper bath

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2799634A (en) * 1954-02-26 1957-07-16 Westinghouse Electric Corp Combined addition agents for acid copper plating
US2853443A (en) * 1956-04-25 1958-09-23 Westinghouse Electric Corp Addition agent for acid copper electrolytes
GB1235101A (en) * 1967-05-01 1971-06-09 Albright & Wilson Mfg Ltd Improvements relating to electrodeposition of copper
US3959109A (en) * 1972-11-17 1976-05-25 Xerox Corporation Method and apparatus for electroforming
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
BR9105776A (en) * 1990-05-30 1992-08-04 Gould Inc ELECTRODEPOSITED COPPER FILM AND PROCESS TO PRODUCE ELECTRODEPOSITED COPPER FILM
US6344129B1 (en) * 1999-10-13 2002-02-05 International Business Machines Corporation Method for plating copper conductors and devices formed
US20040074775A1 (en) * 2002-10-21 2004-04-22 Herdman Roderick Dennis Pulse reverse electrolysis of acidic copper electroplating solutions
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
DE102008033174B3 (en) 2008-07-15 2009-09-17 Enthone Inc., West Haven Cyanide-free electrolyte composition for the electrodeposition of a copper layer and method for the deposition of a copper-containing layer
CN104711648B (en) * 2013-12-17 2019-08-16 Ykk株式会社 Flash copper plating solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA461186A (en) * 1949-11-22 John Franklin Beaver, Jr. Bright copper plating
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
US2411674A (en) * 1943-03-04 1946-11-26 Little Inc A Art of electrodeposition of copper
NL69965C (en) * 1945-08-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097231B (en) * 1957-09-11 1961-01-12 Westinghouse Electric Corp Acid galvanic copper bath

Also Published As

Publication number Publication date
US2700019A (en) 1955-01-18

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