GB600873A - Improvements in or relating to the manufacture of thin copper articles - Google Patents

Improvements in or relating to the manufacture of thin copper articles

Info

Publication number
GB600873A
GB600873A GB27542/45A GB2754245A GB600873A GB 600873 A GB600873 A GB 600873A GB 27542/45 A GB27542/45 A GB 27542/45A GB 2754245 A GB2754245 A GB 2754245A GB 600873 A GB600873 A GB 600873A
Authority
GB
United Kingdom
Prior art keywords
copper
base
deposit
metal
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB27542/45A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB600873A publication Critical patent/GB600873A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B3/00—Electrolytic production of organic compounds
    • C25B3/20—Processes
    • C25B3/25—Reduction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012—Constructional arrangements
    • H01J2893/0019—Chemical composition and manufacture
    • H01J2893/0022—Manufacture

Abstract

600,873. Electrodeposition of copper. STANDARD TELEPHONES & CABLES, Ltd., WOLFSON, H., and THOMSON, B. Oct. 19, 1945, No. 27542. Drawings to Specification. [Class 41] Patterned articles of copper such as control grids for electron discharge devices are manufactured by depositing an easily detachable layer upon a base in the desired pattern from a bath containing in solution copper pyrophosphate and an alkali metal pyrophosphate, and maintained at a pH between 8.8 and 10, and then stripping the copper from the base plate. The base plate 1 may be of any metal, preferably having a polished surface of nickel, chromium or rhodium ; or it may be a non- metal having a surface rendered conductive by metallizing or graphiting. In either case it is covered with insulating material in which the pattern is formed, e.g. by a photographic process, and from which the patterned part is removed prior to the depositing step. The deposit may be removed by agitation of the base, or by cutting a portion of the deposit perimeter, allowance being made in the design accordingly. The deposit may be clad with a further metal or alloy prior to or subsequent upon removal from the base by, for example, further electrodeposition. The bath may contain citric, oxalic, tartaric, formic, or malic acid or an alkali metal salt thereof. The concentration of copper pyrophosphate is equivalent to between 5 and 25 grams copper per litre. The pH value of the bath is brought within the desired range by addition of sodium or ammonium hydroxide. The cathode current density may be 0. 9 to 5 amps per square dcm, the voltage 0.9 to 1.3, preferably 1.05 to 1. 2 and the temperature 55‹ to 80‹ C. Stirring of the electrolyte, or movement of the cathode, or both, is advantageous, and is essential at the higher current densities. Specification 509,650 is referred to.
GB27542/45A 1967-04-06 1945-10-19 Improvements in or relating to the manufacture of thin copper articles Expired GB600873A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62883167A 1967-04-06 1967-04-06

Publications (1)

Publication Number Publication Date
GB600873A true GB600873A (en) 1948-04-21

Family

ID=24520487

Family Applications (2)

Application Number Title Priority Date Filing Date
GB27542/45A Expired GB600873A (en) 1967-04-06 1945-10-19 Improvements in or relating to the manufacture of thin copper articles
GB7807/68A Expired GB1188064A (en) 1967-04-06 1968-02-16 Process for the Electrolytic Reduction of Aromatic Nitro Compounds

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB7807/68A Expired GB1188064A (en) 1967-04-06 1968-02-16 Process for the Electrolytic Reduction of Aromatic Nitro Compounds

Country Status (4)

Country Link
US (1) US3475299A (en)
BE (1) BE712713A (en)
FR (2) FR948632A (en)
GB (2) GB600873A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001087A1 (en) * 1990-07-06 1992-01-23 Tube Technology Pty. Ltd. Fabrication process

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125445A (en) * 1977-05-20 1978-11-14 Hercules Incorporated Electroreduction of nitrate esters
JPS59222592A (en) * 1983-05-31 1984-12-14 Takeda Chem Ind Ltd Production of p-aminobenzoyl glutamic acid
US4584070A (en) * 1985-03-29 1986-04-22 Ppg Industries, Inc. Process for preparing para-aminophenol
US4609439A (en) * 1985-10-07 1986-09-02 Texaco Inc. Means and method for the electrochemical reduction of a nitroaromatic to provide a dye
US4764263A (en) * 1987-05-18 1988-08-16 The Dow Chemical Company Electrochemical synthesis of substituted aromatic amines in basic media
RU2621699C2 (en) * 2012-10-17 2017-06-07 3М Инновейтив Пропертиз Компани Method for producing alpha, omega-dyiodides of perfluoro
US11439950B2 (en) 2018-07-02 2022-09-13 Universiity of Kentucky Research Foundation Electrochemical cell, method and apparatus for capturing carbon dioxide from flue gas and decomposing nitrosamine compounds

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103473A (en) * 1963-09-10 Method for the electrochemical reduction of compounds
US1239822A (en) * 1916-10-27 1917-09-11 Chem Ind Basel Process for the manufacture of aromatic amino-oxy-compounds.
US3338806A (en) * 1961-08-21 1967-08-29 Continental Oil Co Process of preparing p-aminophenol by electrolytically reducing nitrobenzene

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001087A1 (en) * 1990-07-06 1992-01-23 Tube Technology Pty. Ltd. Fabrication process
AU627597B2 (en) * 1990-07-06 1992-08-27 Tube Technology Pty Ltd Contouring of copper sheet
US5417838A (en) * 1990-07-06 1995-05-23 Tube Technology Pty. Ltd. Formation of contoured building panels by direct electrodeposition from leachates of copper ores

Also Published As

Publication number Publication date
US3475299A (en) 1969-10-28
BE712713A (en) 1968-07-31
FR1559987A (en) 1969-03-14
FR948632A (en) 1949-08-05
GB1188064A (en) 1970-04-15

Similar Documents

Publication Publication Date Title
US2243429A (en) Electroplating of nonconductive surfaces
GB600873A (en) Improvements in or relating to the manufacture of thin copper articles
GB578389A (en) Improvements in and relating to the electrodeposition of metals and alloys
US2793178A (en) Method of providing insulator with multiplicity of conducting elements
US3006821A (en) Manufacture of silver chloride electrodes
US4100039A (en) Method for plating palladium-nickel alloy
GB1299850A (en) Repair of chromium plated surfaces
DE827280C (en) Generation of firmly adhering, electrolytic nickel deposits on nickel surfaces
GB1122795A (en) Improvements in corrosion-resisting decorative chromium electrolytic deposits
US2431947A (en) Formation of a strong bond between a ferrous metal surface and an electrodeposit of silver
US4297178A (en) Ruthenium electroplating and baths and compositions therefor
US1779457A (en) Electrodeposition of platinum metals
US2599178A (en) Electrodeposition of alloys of molybdenum with cobalt, nickel, and iron
US4297179A (en) Palladium electroplating bath and process
US2409983A (en) Electrodeposition of indium
GB1215617A (en) Method for the formation of local metal coatings on electrically insulating articles
JPS585983B2 (en) Method and apparatus for stably producing metal complexes for electroless metal deposition
US1787139A (en) Process of forming iron foils
GB1203038A (en) Improved method for the production of embossing surfaces
US3397127A (en) Method and bath for electroplating gold
US2594933A (en) Process for electrodepositing hard nickel plate
US3376206A (en) Electrolyte for the electrodeposition of palladium
US2067534A (en) Method of and electrolyte for
KR930010328B1 (en) Palladium alloy electroplating process
GB1039798A (en) Electro-deposition of quaternary magnetic alloy of iron, nickel, antimony and phosphorous