GB2522441B - An apparatus and a method for cooling electronic devices - Google Patents

An apparatus and a method for cooling electronic devices

Info

Publication number
GB2522441B
GB2522441B GB1401175.3A GB201401175A GB2522441B GB 2522441 B GB2522441 B GB 2522441B GB 201401175 A GB201401175 A GB 201401175A GB 2522441 B GB2522441 B GB 2522441B
Authority
GB
United Kingdom
Prior art keywords
electronic devices
cooling electronic
cooling
devices
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1401175.3A
Other versions
GB201401175D0 (en
GB2522441A (en
Inventor
A Harvilchuck Laurence
Michael Davis David
Carl Worrall Alexander
Jeapes Stephen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Systems UK Ltd
Original Assignee
Xyratex Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xyratex Technology Ltd filed Critical Xyratex Technology Ltd
Priority to GB1401175.3A priority Critical patent/GB2522441B/en
Publication of GB201401175D0 publication Critical patent/GB201401175D0/en
Publication of GB2522441A publication Critical patent/GB2522441A/en
Application granted granted Critical
Publication of GB2522441B publication Critical patent/GB2522441B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1401175.3A 2014-01-23 2014-01-23 An apparatus and a method for cooling electronic devices Expired - Fee Related GB2522441B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1401175.3A GB2522441B (en) 2014-01-23 2014-01-23 An apparatus and a method for cooling electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1401175.3A GB2522441B (en) 2014-01-23 2014-01-23 An apparatus and a method for cooling electronic devices

Publications (3)

Publication Number Publication Date
GB201401175D0 GB201401175D0 (en) 2014-03-12
GB2522441A GB2522441A (en) 2015-07-29
GB2522441B true GB2522441B (en) 2017-11-15

Family

ID=50287476

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1401175.3A Expired - Fee Related GB2522441B (en) 2014-01-23 2014-01-23 An apparatus and a method for cooling electronic devices

Country Status (1)

Country Link
GB (1) GB2522441B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060221578A1 (en) * 2005-03-30 2006-10-05 International Business Machines Corporation Interposable heat sink for adjacent memory modules
CN201063339Y (en) * 2007-04-19 2008-05-21 彭凌锋 Clamper type cooling device
TW200937175A (en) * 2008-02-25 2009-09-01 Gigazone Int Co Ltd Electronic device and heat-dissipating module thereof
CN101752265A (en) * 2008-12-22 2010-06-23 亚毅精密股份有限公司 Assembling method and assembling tool for memory and radiating plate
US20110051353A1 (en) * 2009-08-25 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
US20110286179A1 (en) * 2010-05-24 2011-11-24 International Business Machines Corporation Memory module connector having memory module cooling structures
US20130163176A1 (en) * 2011-12-22 2013-06-27 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060221578A1 (en) * 2005-03-30 2006-10-05 International Business Machines Corporation Interposable heat sink for adjacent memory modules
CN201063339Y (en) * 2007-04-19 2008-05-21 彭凌锋 Clamper type cooling device
TW200937175A (en) * 2008-02-25 2009-09-01 Gigazone Int Co Ltd Electronic device and heat-dissipating module thereof
CN101752265A (en) * 2008-12-22 2010-06-23 亚毅精密股份有限公司 Assembling method and assembling tool for memory and radiating plate
US20110051353A1 (en) * 2009-08-25 2011-03-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
US20110286179A1 (en) * 2010-05-24 2011-11-24 International Business Machines Corporation Memory module connector having memory module cooling structures
US20130163176A1 (en) * 2011-12-22 2013-06-27 Hon Hai Precision Industry Co., Ltd. Electronic device with heat dissipation apparatus

Also Published As

Publication number Publication date
GB201401175D0 (en) 2014-03-12
GB2522441A (en) 2015-07-29

Similar Documents

Publication Publication Date Title
GB201713122D0 (en) Method and apparatus for power transfer for a portalbe electronic device
EP3221768C0 (en) Electronic device for identifying peripheral apparatus and method thereof
EP3229103A4 (en) Electronic apparatus cooling device
SG10201706446VA (en) An Apparatus and Method for Transferring Electronic Devices
EP3050135A4 (en) Apparatus and techniques for electronic device encapsulation
GB2545043B (en) Method and apparatus for in-purse detection by an electronic device
HK1219359A1 (en) Method for providing device identifier and apparatus thereof
HK1222014A1 (en) Method and device for presenting information and electronic device
SG11201609273UA (en) Electronic device and method
EP2988197A4 (en) Icon moving method and apparatus and electronic device
EP3228150A4 (en) Apparatus and method for executing task of electronic device
SG11201607363TA (en) Methods and apparatus for rapidly cooling a substrate
PL3160219T3 (en) Method and device for placing electronic components
EP3210100A4 (en) Providing method for inputting and electronic device
PL3100457T3 (en) Method and apparatus for synchronizing playbacks at two electronic devices
GB201513532D0 (en) A method and an apparatus
SG10201504081PA (en) Method and apparatus for resin-sealing electronic components
GB2536830B (en) Apparatus for image contrast enhancement and method, electronic equipment
HK1219357A1 (en) Electronic apparatus and manufacturing method therefor
GB201406921D0 (en) Apparatus and method for vibration mitigation
EP3158620A4 (en) Methods and apparatus for electronic device power
HK1222011A1 (en) Method and device for searching infomation and electronic device
SG11201610343RA (en) Method for manufacturing electronic device apparatus
EP2916282A4 (en) Advertisement method for electronic device and electronic device thereof
GB2528034B (en) Apparatus and method for device configuration

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20230123