GB2494955A - Flexible heat exchanger - Google Patents

Flexible heat exchanger Download PDF

Info

Publication number
GB2494955A
GB2494955A GB1214378.0A GB201214378A GB2494955A GB 2494955 A GB2494955 A GB 2494955A GB 201214378 A GB201214378 A GB 201214378A GB 2494955 A GB2494955 A GB 2494955A
Authority
GB
United Kingdom
Prior art keywords
sheet
tcn
contact member
interior side
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1214378.0A
Other versions
GB2494955B (en
GB201214378D0 (en
Inventor
Eric Vance Kline
Maurice Francis Holahan
Michael Robert Rasmussen
Paul Krystek
Stephen Zins
Arvind Kumar Sinha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB201214378D0 publication Critical patent/GB201214378D0/en
Publication of GB2494955A publication Critical patent/GB2494955A/en
Application granted granted Critical
Publication of GB2494955B publication Critical patent/GB2494955B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/02—Flexible elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Abstract

A method for constructing a heat exchanger for cooling one or more semiconductor components comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
GB1214378.0A 2010-06-11 2011-06-02 Flexible heat exchanger Expired - Fee Related GB2494955B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/814,175 US20110303403A1 (en) 2010-06-11 2010-06-11 Flexible Heat Exchanger
PCT/EP2011/059175 WO2011154316A1 (en) 2010-06-11 2011-06-02 Flexible heat exchanger

Publications (3)

Publication Number Publication Date
GB201214378D0 GB201214378D0 (en) 2012-09-26
GB2494955A true GB2494955A (en) 2013-03-27
GB2494955B GB2494955B (en) 2014-04-16

Family

ID=44352204

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1214378.0A Expired - Fee Related GB2494955B (en) 2010-06-11 2011-06-02 Flexible heat exchanger

Country Status (7)

Country Link
US (1) US20110303403A1 (en)
JP (1) JP6041801B2 (en)
CN (1) CN103053022B (en)
DE (1) DE112011101941B4 (en)
GB (1) GB2494955B (en)
TW (1) TW201221043A (en)
WO (1) WO2011154316A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10385298B2 (en) * 2012-06-22 2019-08-20 Steven Dee Wayne Webber Fermentation temperature management
US9305860B2 (en) * 2013-07-18 2016-04-05 Acer Incorporated Cycling heat dissipation module
DE102016103213A1 (en) * 2016-02-24 2017-08-24 Semikron Elektronik Gmbh & Co. Kg Device, method and system for the inhomogeneous cooling of a flat object
US9894801B1 (en) * 2016-10-31 2018-02-13 International Business Machines Corporation Cold plate
US20190234691A1 (en) * 2018-01-26 2019-08-01 Taiwan Microloops Corp. Thermal module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6118159A (en) * 1984-07-04 1986-01-27 Hitachi Ltd Semiconductor device
JPS6366954A (en) * 1986-09-06 1988-03-25 Fujitsu Ltd High-density packaging module
WO2006041210A1 (en) * 2004-10-13 2006-04-20 Showa Denko K.K. Method of manufacturing a hollow circuit substrate
EP1705550A2 (en) * 2005-03-24 2006-09-27 Delphi Technologies, Inc. Integral liquid cooling unit for a computer
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (en) * 1970-03-05 1972-11-06 Asea Ab
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
JPH01245550A (en) * 1988-03-28 1989-09-29 Hitachi Ltd Cooling structure for semiconductor device
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
JP4055323B2 (en) * 1999-12-13 2008-03-05 松下電器産業株式会社 Radiator, cooling device using the same, and electronic device equipped with the cooling device
DE10011568C1 (en) * 2000-03-09 2001-06-13 Gea Canzler Gmbh Heat exchanger element; has at least two welded plates of reactive transition metal with flow channels formed between plates for heat exchange medium, and joined by electron beam welding under vacuum
JP2003240461A (en) * 2002-02-19 2003-08-27 Furukawa Electric Co Ltd:The Plate type heat pipe and mounting structure of the heat pipe
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
CN100353537C (en) * 2004-12-30 2007-12-05 财团法人工业技术研究院 Heat elimination / cooling set of ultrasonic spray
US7265977B2 (en) * 2005-01-18 2007-09-04 International Business Machines Corporation Active liquid metal thermal spreader
CN102056467A (en) * 2006-01-24 2011-05-11 日本电气株式会社 Liquid-cooled heat radiator
US8720531B2 (en) * 2006-01-30 2014-05-13 Nec Corporation Electronic device cooling apparatus
JP4234722B2 (en) * 2006-02-28 2009-03-04 株式会社東芝 Cooling device and electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6118159A (en) * 1984-07-04 1986-01-27 Hitachi Ltd Semiconductor device
JPS6366954A (en) * 1986-09-06 1988-03-25 Fujitsu Ltd High-density packaging module
WO2006041210A1 (en) * 2004-10-13 2006-04-20 Showa Denko K.K. Method of manufacturing a hollow circuit substrate
EP1705550A2 (en) * 2005-03-24 2006-09-27 Delphi Technologies, Inc. Integral liquid cooling unit for a computer
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Also Published As

Publication number Publication date
DE112011101941T5 (en) 2013-03-28
JP6041801B2 (en) 2016-12-14
JP2013534048A (en) 2013-08-29
DE112011101941B4 (en) 2016-03-24
US20110303403A1 (en) 2011-12-15
TW201221043A (en) 2012-05-16
CN103053022A (en) 2013-04-17
GB2494955B (en) 2014-04-16
WO2011154316A1 (en) 2011-12-15
GB201214378D0 (en) 2012-09-26
CN103053022B (en) 2016-02-17

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20140428

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20190602