GB2439837A - Method for packaging an electronic component using resin - Google Patents

Method for packaging an electronic component using resin Download PDF

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Publication number
GB2439837A
GB2439837A GB0712834A GB0712834A GB2439837A GB 2439837 A GB2439837 A GB 2439837A GB 0712834 A GB0712834 A GB 0712834A GB 0712834 A GB0712834 A GB 0712834A GB 2439837 A GB2439837 A GB 2439837A
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United Kingdom
Prior art keywords
resin
packaging
substrate
independent
components
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Granted
Application number
GB0712834A
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GB2439837B (en
GB0712834D0 (en
Inventor
Yuejun Yan
Yuepeng Yan
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Publication of GB2439837B publication Critical patent/GB2439837B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A method for packaging electronic components using resin comprises mounting a plurality of bare components 2 on a common substrate 1 separated by a gap d, individually encapsulating each component 2 with a resin packaging material, solidifying the resin and then cutting the substrate in the gaps to form separate resin encapsulated components. Holes 4 may be formed in the gaps to facilitate cutting. The invention relieves the problem of the resin splitting from the substrate due to different thermal expansions between the resin and substrate materials. This makes it possible to tightly attach the resin to the substrate, and is especially suitable for packaging of large scale bare chips.

Description

<p>METHOD FOR PACKAGING USING RESIN</p>
<p>The invention relates to a method, and more particularly to a method for packaging using resin.</p>
<p>Conventionally, resin is used to package electronic components on a substrate.</p>
<p>However, during a high-temperature molding process, the resin is prone to split or deviate from the substrate, which will severely decrease quality of the electronic components, and may ultimately obsolesce the electronic components.</p>
<p>It is a general object of the present invention to provide a method for packaging using resin, so as to tightly attach resin to a substrate.</p>
<p>In one aspect, the invention provides a method for packaging using resin, comprising a substrate, a plurality of bare objects to be packaged on the substrate via resin and an independent resin-packaging component formed after packaging; wherein the bare objects are separately packaged on the substrate to form the independent resin-packaging component; there is a gap with a certain width between the bare objects; and the independent resin-packaging component formed after packaging is cut into a plurality of independent packaging components after a solidification process.</p>
<p>In certain classes of this embodiment, the bare object is a semiconductor chip, a conductive lead, a printed circuit, a resistor, an inductor, a capacitor, or a combination thereof.</p>
<p>In certain classes of this embodiment, the substrate is an organic substrate.</p>
<p>In certain classes of this embodiment, the substrate is a composite substrate.</p>
<p>In certain classes of this embodiment, the independent resin-packaging component is a packaging component formed by moulds.</p>
<p>In certain classes of this embodiment, the independent resin-packaging component is a packaging component formed by drip irrigation.</p>
<p>In certain classes of this embodiment, the independent resin-packaging component is a packaging component formed by absorption.</p>
<p>In certain classes of this embodiment, a plurality of clearance holes are disposed between independent resin-packaging components on the substrate.</p>
<p>In certain classes of this embodiment, a plurality of connections are formed between independent resin-packaging components.</p>
<p>In certain classes of this embodiment, the connection may be located at a top corner of the independent resin-packaging components or somewhere else.</p>
<p>In certain classes of this embodiment, the solidification process may be implemented by high-temperature heating.</p>
<p>In certain classes of this embodiment, the solidification process may be implemented by normal-temperature placement.</p>
<p>A plurality of bare objects are packaged with casting resin on an organic substrate or a composite substrate. Since coefficients of thermal expansion (CTE) of the substrate along the X, Y and Z axis are different from those of the resin, the substrate may split or deviate from the resin. In designing a substrate, a gap with a certain width is disposed between the independent resin-packaging components, as the resin is molded with high temperature, an absolute displacement between the resin of the independent resin-packaging component and the substrates with different CTEs will decrease, and thus the displacement stress is less than the adhesion force. After high-temperature molding, the resin of the independent resin-packaging component will not split or deviate from, but tightly attach to the substrates with different CTEs.</p>
<p>A plurality of clearance holes are formed between different independent resin-packaging components on a substrate and a connection is formed on a certain substrate between different independent resin-packaging components.</p>
<p>The connection may be located at a top corner of the independent resin-packaging components or somewhere else. The clearance hole may take different shapes. Once the clearance hole is used, a cost effective ram slicing may be realized, and an absolute displacement between the resin of the independent resin-packaging component and the substrates with different CTEs will decrease as the resin is molded with high temperature. After high-temperature molding, the resin of the independent resin-packaging component will not split or deviate from, but tightly attach to the substrates with different CTEs.</p>
<p>In choosing an organ or a composite substrate and matching packaging resin, material characteristic of different substrates, the number of layers of a substrate, thickness of a dielectric plate and a copper-clad laminate, layout and heat-dissipation design, along with CTEs of different substrates are determined by factors such as low-frequency/highfrequency applications, low-density/high-density packaging, along with power/non-power devices.</p>
<p>During molding of the packaging process, as the displacement stress is greater than the adhesion force, the resin will split or deviate from substrates with different CTEs. In view of the above complex packaging situations, by way of experimenting and calculating, a gap with a certain width is disposed between the independent resin-packaging components, thereby the displacement stress is less than the adhesion force, and thus an absolute displacement between the resin of the independent resin-packaging component and the substrates with different CTEs will decrease. After high-temperature molding, the resin of the independent resin-packaging component will not split or deviate from, but tightly attach to the substrates with different CTEs.</p>
<p>The invention has the following advantages over the prior art: a. the invention is suitable for large scale packaging using resin.</p>
<p>b. the invention is suitable for cost-effective packaging using resin.</p>
<p>c. a plurality of clearance hole are disposed between the independent resin-packaging components, which makes it convenient for slicing, and prevents the resin from splitting or deviating from the substrate.</p>
<p>d. the independent resin-packaging component may be formed by different packaging technologies, such as moulds, drip irrigation or absorption.</p>
<p>The invention will now be described solely by way of example and with reference to the accompanying drawings in which: Fig. 1 is a schematic diagram of a method for packaging using resin of the invention; Fig. 2 is a diagram illustrating resin splitting from a substrate as a traditional packaging method is used; Fig. 3 is a packaging method in which a plurality of clearance holes 4 are formed between different independent resin-packaging components on a substrate; and Fig. 4 illustrates packaging components respectively formed by moulds, drip irrigation and absorption.</p>
<p>The invention will now be described further, by way of example, with reference to the accompany drawings and integral movement modes. The reference numbers of the parts/components in accordance with the present invention are listed below, in which: substrate 1, independent resin-packaging component 2, gap 3, clearance hole 4, resin 5 and bare object 6.</p>
<p>Fig. 1 is a schematic diagram of a method for packaging using resin of the invention.</p>
<p>Fig. 1(a) comprises a substrate 1, a plurality of bare objects 6 to be packaged on the substrate 1 via resin, and an independent resin-packaging component 2 formed after packaging. The bare objects 6 are separately packaged on the substrate 1 to form the independent resin-packaging components 2, and there is a gap 3 between the independent resin-packaging components 2.</p>
<p>After a solidification process, the independent resin-packaging component 2 formed on the substrate 1 is cut into a plurality of independent packaging components.</p>
<p>As can be seen from Fig. 1(b), the substrate 1 curves and deviates from a horizontal line A3-A4 after high-temperature molding. By way of experimenting and calculating, a gap 3 with a certain width is disposed between the independent resin-packaging components 2.</p>
<p>A plurality of bare objects 6 are packaged with casting resin 5 on an organic substrate or a composite substrate. Since coefficients of thermal expansion (GTE) of the substrate 1 along the X, Y and Z axis are different from those of the resin 5, the substrate 1 may split or deviate from the resin 5.</p>
<p>Taking a MCM packaging on the organic substrate for example, a 4-layer FR-4 substrate with a dielectric constant of 4.2 is employed. The bare objects 6 (namely a bare semiconductor chip, a conductive lead, a printed circuit, a resistor, an inductor, a capacitor and so on) are packaged into a component. A typical CTE value of the RF-4 substrate in X and Y direction is approximately 1215ppmI0C. However, in an unconstraint condition, a CTE value of the RF-4 substrate in Z direction may be up to 55-6OppmiC, and a CTE value of epoxy resin in X, V and Z direction is approximately 7Oppm/ C.</p>
<p>Due to the existence of the gap 3, as the resin 5 is molded with high temperature, an absolute displacement between the resin 5 of the independent resin-packaging component 2 and the substrates 1 with different CTEs will decrease, and thus the displacement stress is less than the adhesion force.</p>
<p>After high-temperature molding, the resin 5 of the independent resin-packaging component 2 will not split or deviate from, but tightly attach to the substrates 1 with different CTEs.</p>
<p>In choosing an organ or a composite substrate and matching packaging resin, material characteristic of different substrates, the number of layers of a substrate, thickness of a dielectric plate and a copper-clad laminate, layout and heat-dissipation design, along with CTEs of different substrates are determined by factors such as low-frequency/high-frequency applications, low-density/high-density packaging, along with power/non-power devices.</p>
<p>During molding of the packaging process, as the displacement stress is greater than the adhesion force, the resin 5 will split or deviate from substrates 1 with different CTEs. In view of the above complex packaging situations, by way of experimenting and calculating, a gap 3 with a certain width is disposed between the independent resin-packaging components 2, thereby the displacement stress is less than the adhesion force, and thus an absolute displacement between the resin 5 of the independent resin-packaging component 2 and the substrates 1 with different CTEs will decrease. After high-temperature molding, the resin 5 of the independent resin-packaging component 2 will not split or deviate from, but tightly attach to the substrates 1 with different CTEs.</p>
<p>Fig. 2 is a diagram illustrating resin 5 splitting from a substrate 1 as a traditional packaging method is used.</p>
<p>Fig. 2(a) illustrates a scenario where a plurality of components are integratively packaged on an organic or a composite substrate.</p>
<p>As can be seen from Fig. 2(b), in a heating process, the resin 5 is prone to split or deviate from the substrate 1 due to different CTEs on the substrate 1.</p>
<p>Fig. 3 is a packaging method in which a plurality of clearance holes 4 are formed between different independent resin-packaging components 2 on a substrate 1. Once the clearance hole 4 is used, a cost effective ram slicing may be realized, and an absolute displacement between the resin of the independent resin-packaging component 2 and the substrates with different CTEs will decrease as the resin 5 is molded with high temperature.</p>
<p>As shown in a side view Fig. 3(a), a plurality of connections are formed between different independent resin-packaging components 2. In this embodiment, the connection is located at a top corner of the independent resin-packaging components 2. In other embodiments, the connection may be located somewhere else.</p>
<p>As shown in a top view Fig. 3(b), the clearance hole 4 may take different shapes.</p>
<p>As shown in a sectional view Fig. 3(c), the resin 5 of the independent resin-packaging component 2 will not split or deviate from, but tightly attach to the substrates 1 with different CTEs.</p>
<p>The independent resin-packaging component 2 may be formed by moulds, drip irrigation or absorption.</p>
<p>Figs. 4(a), 4(b) and 4(c) respectively illustrates packaging components respectively formed by moulds, drip irrigation and absorption.</p>
<p>It should be emphasized herein that the solidification process may be implemented by high-temperature or normal-temperature heating.</p>
<p>The particular embodiment having thus been described, it will now be evident to those skilled in the art that further modifications and variation thereto may be contemplated. Such modifications and variations are not regarded as a departure from the invention.</p>
<p>All publications and patent applications mentioned in this specification are indicative of the level of skill of those skilled in the art to which this invention pertains. All publications and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication or patent application mentioned in this specification was specifically and individually indicated to be incorporated by reference.</p>

Claims (1)

  1. <p>CLAIMS</p>
    <p>1. A method for packaging using resin, comprising a substrate; a plurality of bare objects to be packaged on the substrate via resin; and an independent resin-packaging component formed after packaging; wherein the bare objects are separately packaged on the substrate to form the independent resin-packaging component; there is a gap with a certain width between the bare objects; and the independent resin-packaging component formed after packaging is cut into a plurality of independent packaging components after a solidification process.</p>
    <p>2. The method for packaging using resin of claim 1, wherein the bare object is a semiconductor chip, a conductive lead, a printed circuit, a resistor, an inductor, a capacitor, or a combination thereof.</p>
    <p>3. The method for packaging using resin of claim 2, wherein the substrate is an organic substrate 4. The method for packaging using resin of claim 3, wherein the substrate is a composite substrate.</p>
    <p>5. The method for packaging using resin of claim 1, wherein the independent resin-packaging component is a packaging component formed by moulds.</p>
    <p>6. The method for packaging using resin of claim 5, wherein the independent resin-packaging component is a packaging component formed by drip irrigation.</p>
    <p>7. The method for packaging using resin of claim 6, wherein the independent resin-packaging component is a packaging component formed by absorption.</p>
    <p>8. The method for packaging using resin of claim 1, wherein a plurality of clearance holes are disposed between independent resin-packaging components on the substrate 1.</p>
    <p>9. The method for packaging using resin of claim 8, wherein a plurality of connections are formed between independent resin-packaging components.</p>
    <p>10. The method for packaging using resin of claim 9, wherein the connection may be located at a top corner of the independent resin-packaging components or somewhere else.</p>
    <p>11. The method for packaging using resin of claim 1, wherein the solidification process may be implemented by high-temperature heating.</p>
    <p>12. The method for packaging using resin of claim 11, wherein the solidification process may be implemented by normal-temperature placement.</p>
GB0712834.1A 2006-07-05 2007-07-03 Method for packaging using resin Expired - Fee Related GB2439837B (en)

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CN101101882A (en) 2008-01-09
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WO2008006299A1 (en) 2008-01-17

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