GB2403070A

GB2403070A - An element for retaining thermal interface material used with electronic components

Info

Publication number: GB2403070A
Application number: GB0314151A
Authority: GB
Inventors: Young-Kwang Sheu; Fu-Jeng Yu
Original assignee: Uniwill Computer Corp
Current assignee: Uniwill Computer Corp
Priority date: 2003-06-16
Filing date: 2003-06-18
Publication date: 2004-12-22
Anticipated expiration: 2023-06-18
Also published as: FR2857215B3; DE20309244U1; GB0314151D0; GB2403070B; FR2857215A3

Abstract

A ring shaped element 20 is used to surround thermal interface material 31 such as a phase-change material or grease 31 used with an electronic component 10, e.g. interposed between the component and a heat-sink 30, so as to contain the material when it flows on heating of the component and thereby prevent pollution or short-circuits. The element may be flexible so as to be compressed between the component and heat-sink and it may be circular, square, rectangular, elliptical or star-shaped.

Description

A Structure For Isolating Thermal Intcrfacc Material

BACKGROUND OF TI-IE INVENTION

1. Field of the Invention

i'hc present invention generally relates to a structure for isolating thermal interface material, especially to the structure for preventing thermal interface material melted by high temperature to cause pollution or short circuits.

2. Description of the Prior Ant

Generally, electrical components generating high heat energy while running are called heat generating element, such as CPU, power IC, etc. For a heat generating element being capable of standing a critical temperature of heat energy, scientists adopts the way of adding a heat- dissipating element, as a heat sink, on a heat generating element for exhausting heat, and even that to installing a cooling fan to rapidly cool the heat generating element down.

Between a heat-generating element and a heat-dissipating element, there always exits a thermal interface material (TIM). The thermal interface material is normally phase-changing material, thermal grease, etc. for high power Ics. Sequentially, another problem is then caused.

For such type TIM, which is changed from a solid phase to a gel phase or even a liquid phase by heating up process; hence, the thermal interface material with the gel phase or the liquid phase is possible to spread and pollute near by components. This will cause short circuits and pollutions

and bothers the field for a long period.

SUMMARY OF THE INVENTION

The premier objective of the present invention is to offer a structure for isolating thermal inter&cc material. 'I'he structure wraps around a heat generating element and is a series of closed isolating element. The structure, an isolating element, functions to restrict thermal interface material existing between a heat generating element and a heatdissipating element in a closed room, and the room is composed by the isolating clement; then the thermal interface material will not overflow everywhere to cause pollution. short circuits and even danger while the thermal interface material been changing phase from solid phase to gel phase or liquid phase.

I'he second objective of the present invention is to offer a structure for isolating thermal interface material. The structure, as aforesaid isolating element, provides with perfect flexibility and is capable of suitable elongation while being pressed by the heat-dissipating element; and therefore the structure is tightly on a PC13 surface and a bottom of the heat-dissipating element.

That is, the thermal interface material to overflow is prevented.

Other and further features, advantages and benefits of the invention will become apparent in the following description taken in conjunction with the following drawings. It is to be understood that the foregoing general description and following detailed description are exemplary and explanatory but are not to be restrictive of the invention. The accompanying drawings are incorporated in and constitute a part of this application and, together with the description, serve to explain the principles of the invention in general terms. Like numerals refer

to like parts throughout the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects, spirits and advantages of the preferred embodiments of the present invention will be readily understood by the accompanying drawings and detailed descriptions, wherein: Fig. I is a 3-D explored view of a first preferred embodiment of the present invention.

Fig. 2 is a rear view of an assembly of Fig. 1.

Fig. 3 is an A-A sectional view of thermal interface material before changing phase of Fig. 2.

Fig. 4 is another A-A sectional view of thermal interface material after changing phase of Fig. 2.

Fig. 5 is a 3-D explored view of a second preferred embodiment of'the present invention.

DETAILED DESCRIPTION OF TIIE INVENTION

Referring to l;ig. 1 to Fig. 4, which are a 3-D explored view of a first preferred embodiment of the present inverltiorl, a rear view of an assembly of Fig. 1, an A-A sectional view of thermal interface material before changing phase of Fig. 2 and another A-A sectional view of thermal interface material after changing phase of Fig. 2. A heat generating element 10 is wrapped around by a series of'closed isolating element 20, which provides a perfect flexibility and a function of isolating and is a little higher than the heat generating element 10; it is then that the isolating element 20 contains the heat generating element 10. Referring to Fig. 3, a distance 21 between an internal surface of the isolating clement 20 and the heat generating element 10 provides a containing room for involving phase- changed thermal interface material 31 coated between the heat generating element 10 and a heat-dissipating element 30.

She heat-dissipating element 30 is assembled on the heat generating element 10 with a fastening device (prior arts, not shown in figures). The fastening device grants a fixing force to enhance the heatdissipating element 30 compressing on the isolating element 20. By way of the characteristics ofthc perfect flexibility, the isolating element 20 is capable of suitable elongating, and a bottom of the heat-dissipating element 30 is tightly on a surface of the heat generating element 10. Both top and bottom surface of the isolating element 20 are closely against to a bottom surface of the heat-dissipating element 30 and a surface of a PCB 11 by way of the flexibility of the isolating element 20, then there is no any gap existing among the PCB 11, the isolating element 20 and the heat-dissipating element 30. Referring to Fig. 4, continuously, while the thermal interface material 31 changing phase caused by that the heat generating element 10 gradually raising temperature and overflowing from the gap between the heat-dissipating element 30 and the heat generating element 10, the thermal interface material 31 is isolated by means of the isolating element 20. It is obviously the overflow problem in prior arts being solved, and thus the contamination and short circuits do no longer exist.

Referring to Fig. 5, which is a 3-D explored view of a second preferred embodiment of the present invention. The second embodiment functions as same as the first embodiment; the only different is the shape of the isolating element 20. The isolating element 20 of the embodiment is a circle and must be fit with the conditions of a series of closed isolating material with flexibility for isolating the thermal interface material 31; but the first embodiment is a square for the isolating element. The present invention may not be limited by the shape of the isolating element 20, thus it can be triangle, star, rectangular, ellipse, etc. Although this invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for use in numerous other embodiments that will be apparent to persons skilled in the art. This invention is, therefore, to be limited only as indicated by the scope of the appended claims.

Claims

WIIAT IS CLAIMED IS

1. A structure for isolating thermal interface material, the structure is a series of closed isolating element and wraps around a heat generating element to form a closed room for containing and isolating overflowed thermal interface material caused by the heat generating element of raising temperature.

2. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element provides a function of flexibility.

3. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is a little higher and larger than the heat generating element.

4. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is compressed by a heat-dissipating element to be tightly against to a bottom of the heat-dissipating element and a surface of a PCB where the heat generating element is on.

5. '[he structure for isolating thermal interface material as cited claim 1, wherein the isolating element is a square.

6. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is a rectangular.

7. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is a circle.

8. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is a star.

9. The structure for isolating thermal interface material as cited claim 1, wherein the isolating element is an ellipse.

10. The structure for isolating thermal interface material as cited claim 1, wherein the thermal interface material is capable of changing phase.

11. The structure for isolating thermal interface material as cited claim 1, wherein the thermal interface material is cooling material with grease state.