GB2403070B - A structure for containing thermal interface material in electrical equipment - Google Patents

A structure for containing thermal interface material in electrical equipment

Info

Publication number
GB2403070B
GB2403070B GB0314151A GB0314151A GB2403070B GB 2403070 B GB2403070 B GB 2403070B GB 0314151 A GB0314151 A GB 0314151A GB 0314151 A GB0314151 A GB 0314151A GB 2403070 B GB2403070 B GB 2403070B
Authority
GB
United Kingdom
Prior art keywords
electrical equipment
thermal interface
interface material
containing thermal
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0314151A
Other versions
GB0314151D0 (en
GB2403070A (en
Inventor
Young-Kwang Sheu
Fu-Jeng Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uniwill Computer Corp
Original Assignee
Uniwill Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE20309244U priority Critical patent/DE20309244U1/en
Application filed by Uniwill Computer Corp filed Critical Uniwill Computer Corp
Priority to GB0314151A priority patent/GB2403070B/en
Priority to FR0308158A priority patent/FR2857215B3/en
Publication of GB0314151D0 publication Critical patent/GB0314151D0/en
Publication of GB2403070A publication Critical patent/GB2403070A/en
Application granted granted Critical
Publication of GB2403070B publication Critical patent/GB2403070B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Insulation (AREA)
GB0314151A 2003-06-16 2003-06-18 A structure for containing thermal interface material in electrical equipment Expired - Fee Related GB2403070B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE20309244U DE20309244U1 (en) 2003-06-16 2003-06-16 Structure for sealing off a thermal intermediate material
GB0314151A GB2403070B (en) 2003-06-16 2003-06-18 A structure for containing thermal interface material in electrical equipment
FR0308158A FR2857215B3 (en) 2003-06-16 2003-07-04 INSULATING STRUCTURE FOR THERMAL INTERFACE MATERIAL

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE20309244U DE20309244U1 (en) 2003-06-16 2003-06-16 Structure for sealing off a thermal intermediate material
GB0314151A GB2403070B (en) 2003-06-16 2003-06-18 A structure for containing thermal interface material in electrical equipment
FR0308158A FR2857215B3 (en) 2003-06-16 2003-07-04 INSULATING STRUCTURE FOR THERMAL INTERFACE MATERIAL

Publications (3)

Publication Number Publication Date
GB0314151D0 GB0314151D0 (en) 2003-07-23
GB2403070A GB2403070A (en) 2004-12-22
GB2403070B true GB2403070B (en) 2005-08-17

Family

ID=34119397

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0314151A Expired - Fee Related GB2403070B (en) 2003-06-16 2003-06-18 A structure for containing thermal interface material in electrical equipment

Country Status (3)

Country Link
DE (1) DE20309244U1 (en)
FR (1) FR2857215B3 (en)
GB (1) GB2403070B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5623463B2 (en) 2012-06-25 2014-11-12 三菱電機株式会社 Semiconductor module
CN115847947B (en) * 2023-02-07 2023-06-06 有研工程技术研究院有限公司 Multilayer composite indium-based thermal interface material and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5195020A (en) * 1987-05-25 1993-03-16 Fujitsu Limited Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer
US5889652A (en) * 1997-04-21 1999-03-30 Intel Corporation C4-GT stand off rigid flex interposer
US6037659A (en) * 1997-04-28 2000-03-14 Hewlett-Packard Company Composite thermal interface pad
US20030067746A1 (en) * 2001-10-09 2003-04-10 Fujitsu Limited Cooling device capable of contacting target with smaller urging force
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195020A (en) * 1987-05-25 1993-03-16 Fujitsu Limited Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5889652A (en) * 1997-04-21 1999-03-30 Intel Corporation C4-GT stand off rigid flex interposer
US6037659A (en) * 1997-04-28 2000-03-14 Hewlett-Packard Company Composite thermal interface pad
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US20030067746A1 (en) * 2001-10-09 2003-04-10 Fujitsu Limited Cooling device capable of contacting target with smaller urging force

Also Published As

Publication number Publication date
FR2857215B3 (en) 2005-06-03
DE20309244U1 (en) 2003-08-14
GB0314151D0 (en) 2003-07-23
GB2403070A (en) 2004-12-22
FR2857215A3 (en) 2005-01-07

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120618