GB2386128A - Magnetron sputtering apparatus - Google Patents

Magnetron sputtering apparatus

Info

Publication number
GB2386128A
GB2386128A GB0311038A GB0311038A GB2386128A GB 2386128 A GB2386128 A GB 2386128A GB 0311038 A GB0311038 A GB 0311038A GB 0311038 A GB0311038 A GB 0311038A GB 2386128 A GB2386128 A GB 2386128A
Authority
GB
United Kingdom
Prior art keywords
assembly
magnetron sputtering
sputtering apparatus
rotated
lead screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0311038A
Other versions
GB0311038D0 (en
GB2386128B (en
Inventor
Gordon Robert Green
Robert Kenneth Trowell
Anthony William Barrass
Robert William Teagle
Ian Moncrieff
Stephen Robert Burgess
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aviza Europe Ltd
Original Assignee
Aviza Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0029568A external-priority patent/GB0029568D0/en
Priority claimed from GB0105466A external-priority patent/GB0105466D0/en
Application filed by Aviza Europe Ltd filed Critical Aviza Europe Ltd
Publication of GB0311038D0 publication Critical patent/GB0311038D0/en
Publication of GB2386128A publication Critical patent/GB2386128A/en
Application granted granted Critical
Publication of GB2386128B publication Critical patent/GB2386128B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Abstract

A magnetic assembly (15) is mounted on a lead screw (12) on one side of a sputter target (14). A further lead screw (11) carries a counter weight (16). The lead screws can be rotated by a stepper motor (13) to adjust the lateral positions of assembly (15) and weight (16). The stepper motor and hence the assembly (15), can be rotated about a vertical axis by shaft (17) and motor (18) so that a magnetic field can be swept around the target (14). The position of the assembly (15) is varied in accordance with a process characteristic.
GB0311038A 2000-12-05 2001-12-04 Magnetron sputtering apparatus Expired - Lifetime GB2386128B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0029568A GB0029568D0 (en) 2000-12-05 2000-12-05 Magnetron sputtering apparatus
GB0105466A GB0105466D0 (en) 2001-03-06 2001-03-06 Magnetron sputtering apparatus
PCT/GB2001/005360 WO2002047110A1 (en) 2000-12-05 2001-12-04 Magnetron sputtering apparatus

Publications (3)

Publication Number Publication Date
GB0311038D0 GB0311038D0 (en) 2003-06-18
GB2386128A true GB2386128A (en) 2003-09-10
GB2386128B GB2386128B (en) 2004-08-04

Family

ID=26245373

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0311038A Expired - Lifetime GB2386128B (en) 2000-12-05 2001-12-04 Magnetron sputtering apparatus

Country Status (5)

Country Link
US (1) US20040050690A1 (en)
AU (1) AU2002217261A1 (en)
DE (1) DE10196963T1 (en)
GB (1) GB2386128B (en)
WO (1) WO2002047110A1 (en)

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US8778144B2 (en) * 2004-09-28 2014-07-15 Oerlikon Advanced Technologies Ag Method for manufacturing magnetron coated substrates and magnetron sputter source
BRPI0516204A (en) * 2004-09-28 2008-08-26 Oc Oerlikon Balzers Ag process for producing magnetron coated substrates and magnetron spray source
GB0423032D0 (en) * 2004-10-16 2004-11-17 Trikon Technologies Ltd Methods and apparatus for sputtering
US8021527B2 (en) 2005-09-14 2011-09-20 Applied Materials, Inc. Coaxial shafts for radial positioning of rotating magnetron
US8114256B2 (en) * 2007-11-30 2012-02-14 Applied Materials, Inc. Control of arbitrary scan path of a rotating magnetron
US9480900B2 (en) 2011-10-07 2016-11-01 Jugs Sports, Inc. Changeup controller for ball throwing machine
US9480899B2 (en) * 2011-10-07 2016-11-01 Jugs Sports, Inc. Changeup controller for ball throwing machine
US20160133445A9 (en) * 2011-11-04 2016-05-12 Intevac, Inc. Sputtering system and method for highly magnetic materials
US20140332376A1 (en) * 2011-11-04 2014-11-13 Intevac, Inc. Sputtering system and method using counterweight
US10106883B2 (en) * 2011-11-04 2018-10-23 Intevac, Inc. Sputtering system and method using direction-dependent scan speed or power
JP6018757B2 (en) * 2012-01-18 2016-11-02 東京エレクトロン株式会社 Substrate processing equipment
KR102360357B1 (en) 2013-02-08 2022-02-09 에바텍 아크티엔게젤샤프트 Method of HIPIMS sputtering and HIPIMS sputter system
US9418823B2 (en) * 2013-03-01 2016-08-16 Sputtering Components, Inc. Sputtering apparatus
US9312108B2 (en) 2013-03-01 2016-04-12 Sputtering Components, Inc. Sputtering apparatus
CN104746027A (en) * 2013-12-29 2015-07-01 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron component and magnetron sputtering device
US9567668B2 (en) * 2014-02-19 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method
KR102327285B1 (en) * 2014-02-20 2021-11-16 인테벡, 인코포레이티드 Sputtering system and method using counterweight
WO2015138091A1 (en) * 2014-03-14 2015-09-17 Applied Materials, Inc. Smart chamber and smart chamber components
EP3137646B1 (en) * 2014-04-28 2020-02-19 Sputtering Components, Inc. Sputtering apparatus
US9957606B2 (en) * 2015-10-26 2018-05-01 Tango Systems Inc. Physical vapor deposition system using rotating pallet with X and Y positioning
US10053771B2 (en) * 2015-10-26 2018-08-21 Tango Systems Inc. Physical vapor deposition system with target magnets controlled to only be above workpiece
US11189472B2 (en) * 2017-07-17 2021-11-30 Applied Materials, Inc. Cathode assembly having a dual position magnetron and centrally fed coolant
US11322338B2 (en) 2017-08-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Sputter target magnet
US10844477B2 (en) * 2017-11-08 2020-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Electromagnetic module for physical vapor deposition
TW202119873A (en) * 2019-07-16 2021-05-16 美商應用材料股份有限公司 Em source for enhanced plasma control
JP7182577B2 (en) * 2020-03-24 2022-12-02 株式会社Kokusai Electric Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and program
JP2022101218A (en) * 2020-12-24 2022-07-06 東京エレクトロン株式会社 Sputtering device, and control method of sputtering device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026471A (en) * 1989-09-07 1991-06-25 Leybold Aktiengesellschaft Device for coating a substrate
US5126029A (en) * 1990-12-27 1992-06-30 Intel Corporation Apparatus and method for achieving via step coverage symmetry
US5262030A (en) * 1992-01-15 1993-11-16 Alum Rock Technology Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates
EP0858095A2 (en) * 1997-02-06 1998-08-12 Intevac, Inc. Methods and apparatus for linear scan magnetron sputtering
US6132565A (en) * 1999-10-01 2000-10-17 Taiwan Semiconductor Manufacturing Company, Ltd Magnetron assembly equipped with traversing magnets and method of using

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047113A1 (en) * 1980-12-13 1982-07-29 Leybold-Heraeus GmbH, 5000 Köln Cathode arrangement and control method for cathode sputtering systems with a magnet system for increasing the sputtering rate
US4714536A (en) * 1985-08-26 1987-12-22 Varian Associates, Inc. Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
US5182001A (en) * 1990-06-13 1993-01-26 Leybold Aktiengesellschaft Process for coating substrates by means of a magnetron cathode
DE4125110C2 (en) * 1991-07-30 1999-09-09 Leybold Ag Magnetron sputtering cathode for vacuum coating systems
US5478455A (en) * 1993-09-17 1995-12-26 Varian Associates, Inc. Method for controlling a collimated sputtering source
US5770025A (en) * 1995-08-03 1998-06-23 Nihon Shinku Gijutsu Kabushiki Kaisha Magnetron sputtering apparatus
US6464841B1 (en) * 1997-03-04 2002-10-15 Tokyo Electron Limited Cathode having variable magnet configuration
US6228236B1 (en) * 1999-10-22 2001-05-08 Applied Materials, Inc. Sputter magnetron having two rotation diameters

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026471A (en) * 1989-09-07 1991-06-25 Leybold Aktiengesellschaft Device for coating a substrate
US5126029A (en) * 1990-12-27 1992-06-30 Intel Corporation Apparatus and method for achieving via step coverage symmetry
US5262030A (en) * 1992-01-15 1993-11-16 Alum Rock Technology Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates
EP0858095A2 (en) * 1997-02-06 1998-08-12 Intevac, Inc. Methods and apparatus for linear scan magnetron sputtering
US6132565A (en) * 1999-10-01 2000-10-17 Taiwan Semiconductor Manufacturing Company, Ltd Magnetron assembly equipped with traversing magnets and method of using

Also Published As

Publication number Publication date
US20040050690A1 (en) 2004-03-18
GB0311038D0 (en) 2003-06-18
DE10196963T1 (en) 2003-11-20
GB2386128B (en) 2004-08-04
WO2002047110A1 (en) 2002-06-13
AU2002217261A1 (en) 2002-06-18

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20150716 AND 20150722

PE20 Patent expired after termination of 20 years

Expiry date: 20211203