GB2357158B - A method of inspecting objects for defects - Google Patents

A method of inspecting objects for defects

Info

Publication number
GB2357158B
GB2357158B GB0106575A GB0106575A GB2357158B GB 2357158 B GB2357158 B GB 2357158B GB 0106575 A GB0106575 A GB 0106575A GB 0106575 A GB0106575 A GB 0106575A GB 2357158 B GB2357158 B GB 2357158B
Authority
GB
Grant status
Grant
Patent type
Prior art keywords
defects
method
inspecting objects
inspecting
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0106575A
Other versions
GB2357158A (en )
GB0106575D0 (en )
Inventor
Yung-Ho Chuang
David R Shafer
Bin-Ming B Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA-Tencor Corp
Original Assignee
KLA-Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70225Catadioptric systems, i.e. documents describing optical design aspect details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B17/00Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08Catadioptric systems
    • G02B17/0804Catadioptric systems using two curved mirrors
    • G02B17/0808Catadioptric systems using two curved mirrors on-axis systems with at least one of the mirrors having a central aperture
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B17/00Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08Catadioptric systems
    • G02B17/0892Catadioptric systems specially adapted for the UV
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70275Multiple projection paths, array of projection systems, microlens projection systems, tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70375Imaging systems not otherwise provided for, e.g. multiphoton lithography; Imaging systems comprising means for converting one type of radiation into another type of radiation, systems comprising mask with photo-cathode
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/7065Defect inspection
GB0106575A 1996-07-22 1997-01-07 A method of inspecting objects for defects Expired - Fee Related GB2357158B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US08681528 US5717518A (en) 1996-07-22 1996-07-22 Broad spectrum ultraviolet catadioptric imaging system
GB9700213A GB2315562B (en) 1996-07-22 1997-01-07 Broad-band deep-ultraviolet achromatic catadioptric imaging system

Publications (3)

Publication Number Publication Date
GB0106575D0 true GB0106575D0 (en) 2001-05-09
GB2357158A true GB2357158A (en) 2001-06-13
GB2357158B true GB2357158B (en) 2001-07-18

Family

ID=26310758

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0106575A Expired - Fee Related GB2357158B (en) 1996-07-22 1997-01-07 A method of inspecting objects for defects

Country Status (1)

Country Link
GB (1) GB2357158B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146583A1 (en) * 2001-09-21 2003-04-17 Siemens Ag Apparatus and method for optically scanning a substrate wafer
US6917421B1 (en) 2001-10-12 2005-07-12 Kla-Tencor Technologies Corp. Systems and methods for multi-dimensional inspection and/or metrology of a specimen
US7684039B2 (en) 2005-11-18 2010-03-23 Kla-Tencor Technologies Corporation Overlay metrology using the near infra-red spectral range

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986007148A1 (en) * 1985-05-20 1986-12-04 The Regents Of The University Of California Differential imaging device
US5034611A (en) * 1988-07-01 1991-07-23 Siemens Aktiengesellschaft Method for non-destructive identification for electronic inhomogeneities in semiconductor layers
EP0628806A2 (en) * 1993-04-30 1994-12-14 International Business Machines Corporation Image measurement system and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986007148A1 (en) * 1985-05-20 1986-12-04 The Regents Of The University Of California Differential imaging device
US5034611A (en) * 1988-07-01 1991-07-23 Siemens Aktiengesellschaft Method for non-destructive identification for electronic inhomogeneities in semiconductor layers
EP0628806A2 (en) * 1993-04-30 1994-12-14 International Business Machines Corporation Image measurement system and method

Also Published As

Publication number Publication date Type
GB2357158A (en) 2001-06-13 application
GB0106575D0 (en) 2001-05-09 application

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160107