GB2357158B - A method of inspecting objects for defects - Google Patents
A method of inspecting objects for defectsInfo
- Publication number
- GB2357158B GB2357158B GB0106575A GB0106575A GB2357158B GB 2357158 B GB2357158 B GB 2357158B GB 0106575 A GB0106575 A GB 0106575A GB 0106575 A GB0106575 A GB 0106575A GB 2357158 B GB2357158 B GB 2357158B
- Authority
- GB
- United Kingdom
- Prior art keywords
- defects
- inspecting objects
- inspecting
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0804—Catadioptric systems using two curved mirrors
- G02B17/0808—Catadioptric systems using two curved mirrors on-axis systems with at least one of the mirrors having a central aperture
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0892—Catadioptric systems specially adapted for the UV
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70375—Multiphoton lithography or multiphoton photopolymerization; Imaging systems comprising means for converting one type of radiation into another type of radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/681,528 US5717518A (en) | 1996-07-22 | 1996-07-22 | Broad spectrum ultraviolet catadioptric imaging system |
GB9700213A GB2315562B (en) | 1996-07-22 | 1997-01-07 | Broad-band deep-ultraviolet achromatic catadioptric imaging system |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0106575D0 GB0106575D0 (en) | 2001-05-09 |
GB2357158A GB2357158A (en) | 2001-06-13 |
GB2357158B true GB2357158B (en) | 2001-07-18 |
Family
ID=26310758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0106575A Expired - Fee Related GB2357158B (en) | 1996-07-22 | 1997-01-07 | A method of inspecting objects for defects |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2357158B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10146583A1 (en) * | 2001-09-21 | 2003-04-17 | Siemens Ag | Device and method for optically scanning a substrate wafer |
US6917421B1 (en) | 2001-10-12 | 2005-07-12 | Kla-Tencor Technologies Corp. | Systems and methods for multi-dimensional inspection and/or metrology of a specimen |
US7684039B2 (en) * | 2005-11-18 | 2010-03-23 | Kla-Tencor Technologies Corporation | Overlay metrology using the near infra-red spectral range |
CN109103141A (en) * | 2018-07-14 | 2018-12-28 | 全讯射频科技(无锡)有限公司 | A kind of the cutting protection technique and protection structure of surface-sensitive wafer |
CN113050257B (en) * | 2021-03-19 | 2022-03-01 | 中国科学院长春光学精密机械与物理研究所 | Wide-spectrum ultraviolet imager optical system based on material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1986007148A1 (en) * | 1985-05-20 | 1986-12-04 | The Regents Of The University Of California | Differential imaging device |
US5034611A (en) * | 1988-07-01 | 1991-07-23 | Siemens Aktiengesellschaft | Method for non-destructive identification for electronic inhomogeneities in semiconductor layers |
EP0628806A2 (en) * | 1993-04-30 | 1994-12-14 | International Business Machines Corporation | Image measurement system and method |
-
1997
- 1997-01-07 GB GB0106575A patent/GB2357158B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1986007148A1 (en) * | 1985-05-20 | 1986-12-04 | The Regents Of The University Of California | Differential imaging device |
US5034611A (en) * | 1988-07-01 | 1991-07-23 | Siemens Aktiengesellschaft | Method for non-destructive identification for electronic inhomogeneities in semiconductor layers |
EP0628806A2 (en) * | 1993-04-30 | 1994-12-14 | International Business Machines Corporation | Image measurement system and method |
Also Published As
Publication number | Publication date |
---|---|
GB2357158A (en) | 2001-06-13 |
GB0106575D0 (en) | 2001-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160107 |