GB2332045A - Heated flooring module - Google Patents

Abstract

A pre-fabricated heated flooring module comprises a plurality of generally planar laminated layers including: a first layer (1) of thermally insulating material; a second layer (2) of flooring material bonded to the upper surface of first layer (1); a third layer (3) comprising a thin film electrical heating membrane bonded to the upper surface of the second layer; and a fourth layer of protective material (4) bonded to the upper surface of the third layer. The module includes markings (6) indicating parts of the module where fixing means may be safely inserted through the module without penetrating the heating membrane or other electrically conductive parts of the third layer. Electrical connectors (7) connected to heating membrane may be provided so that adjacent flooring modules may be connected together in electrical circuit.

Description

2332045 1 This invention relates to heated flooring modules.

Insulated flooring module that includes direct acting electric underfloor heating as an integral part of the module structure, being arranged in such a way as to akw a multitude of pre marked fixing points evenly spaced across the whole top surface of the product.

Direct acting electric heated floors require that they are fabricated in layers in situ as the floor is being constructed. This requires skilled labour from different disciplines to be working on a floor assembly at the same time. To maintain floor heating efficiency and required building insulation values, it is common practice to construct floors from preinsulated flooring grade chipboard, either directly onto concrete or on joists for a suspended floor. Combining insulated flooring products as manufactured by several suppliers with heating products and factory assembling these into single 'plug together units or modules, avoids complicated on site work, which allows floors and heating to be installed in one operation, requiring only the same skill used for normal non heated -floor construction.

This type of flooring structure requires that it is fixed to the joist at regular intervals, usually at three points across the width at each or every second joist centre. Fixing to concrete may also be required but at less frequent points. These mechanical requirements mean that fixing through the heating element membrane plane cannot be avoided.

i - -.. - - ZZ lIZ2 - The following design combines 'standard' products from different manufactures into a single new product that provides a heated flooring module which can be safely secured through many predetermined and premarked fixing points distributed almost evenly across the whole surface of the product.

The combination of a standard insulated chip board flooring product with a low watt density thin film heating membrane, fixed to the top chipboard surface, protected with a ply or similar thin board product. The element design and assembled configuration being arranged in such a way that allows a multitude of drilled and screw through fixing points without puncturing the heating element or any electrical part there of, while maintaining clearance on live parts in excess of regulatory requirements.

A specific embodiment of the invention will now be explained by way of example with reference to the accompanying drawing where:- Figure 1 shows an exploded view of the assembled product detailing the main parts:- ( 1) and ( 2) show the standard bonded insulated flooring component.

( 1) being insulation material which is normally 25 to 50 mm thick dependant on insulation values required.

( 2) is standard flooring grade chipboard nominally 1Simm thick with tongued and grooved edges.

These are readily available as a complete bonded product.

I 1 3 ( 3) represents the planar heating element which takes the form of layers of electrically insulating material enclosing a plurality of resistive strips separated by clear unheated areas repeated for the full length of the element. The clear areas between the heating areas are regularly pierced by a plurality of holes ( 5). This is a pre finished component of a standard planar heating element designed for installation into specifically tiling cements directly under a tiled floor or in any instance where the element needs to be laminated into a structure that does not naturally bond to the elements surface, allowing the bonding agents to pass through the holes forming mechanical links to the materials either side of the heating element.

This structure of planar heating element with punched holes is the subject of British Patent Application No. 9617358.8 ( 4) Is a protective covering layer of thin ply.

( 7) Electrical interconnection system formed as live and neutral connections terminating in male and female lock together connectors arranged in such a way as to ensure correct live and neutral interconnection. These exit the product on the underside to facilitate connection of successive modules in a way that does not interfere with the continuity of the top surface.

The heating element ( 3) is manufactured to very high dimensional tolerances, to the point that all lengths of the heating element can be considered to be identical. The accurate positioning of this component during assembly is accomplished 4 in such a way that the many punched holes in this product are consistently positioned in the same places with relation to the outside and overall dimensions of the completed module product.

This accurate hole pattern is also printed on to the top surface of the ply protective top ( 4) with marks ( 6) of smaller diameter than the holes ( 5) effectively marking the centre positions of holes ( 5).

This feature is used to allow a multitude of possible fixing points for the completed product to the supporting structure of a floor by allowing drilled clearance or guide holes to be made using the marked points ( 6) as centre marks for these fixing holes. Screws, screw nails or other suitable fixings can then be driven through the guide holes into the floor supporting structure passing through the centres of the preformed holes in the planar element layer without piercing or otherwise disturbing the element or any of its electrically conductive parts.

Furthermore the use of planar elements complete with performed holes allows for better penetration of glues used during assembly, improving production speed and product strength.

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Claims (1)

1 Claims 2 3 4 5 6 7

8 9 10 11 12 13 14 is 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 1. A pre-fabricated heated flooring module comprising a plurality of generally planar laminated layers including: a first layer of thermally insulating material; a second layer of flooring material bonded to the upper surface of said first layer; a third layer comprising a thin film electrical heating membrane bonded to the upper surface of said second layer; and a fourth layer of protective material bonded to the upper surface of said third layer.

2. A heated flooring module as claimed in Claim 1, including markings indicating parts of the module where fixing means may be safely inserted through the module without penetrating heating elements or other electrically conductive parts of said third layer.

3. A heated flooring module as claimed in Claim 1 or Claim 2, further including electrical connector means connected to heating elements of said third layer whereby adjacent flooring modules may be connected together in electrical circuit.

4. A heated flooring module as claimed in any preceding Claim, wherein said second layer is formed from chipboard.

5. A heated flooring module as claimed in any preceding Claim, wherein said fourth layer comprises a thin board material.

6. A heated flooring module as claimed in Claim 5, wherein said thin board material is plywood.

7. A heated flooring module as claimed in any 6 1 2 3 4 6 7 8 preceding Claim, wherein said first layer has a thickness in the range 25 to 50 mm.

8. A heated flooring module substantially as hereinbefore described with reference to the accompanying drawing.

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