GB2552292A - Underfloor heating - Google Patents
Underfloor heating Download PDFInfo
- Publication number
- GB2552292A GB2552292A GB1607605.1A GB201607605A GB2552292A GB 2552292 A GB2552292 A GB 2552292A GB 201607605 A GB201607605 A GB 201607605A GB 2552292 A GB2552292 A GB 2552292A
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- United Kingdom
- Prior art keywords
- layer
- panel
- conductors
- modular
- heating element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
- E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
- E04C2/32—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure formed of corrugated or otherwise indented sheet-like material; composed of such layers with or without layers of flat sheet-like material
- E04C2/322—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure formed of corrugated or otherwise indented sheet-like material; composed of such layers with or without layers of flat sheet-like material with parallel corrugations
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/44—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose
- E04C2/52—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits
- E04C2/521—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling
- E04C2/525—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling for heating or cooling
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2203/00—Specially structured or shaped covering, lining or flooring elements not otherwise provided for
- E04F2203/02—Specially structured or shaped covering, lining or flooring elements not otherwise provided for having particular shapes, other than square or rectangular, e.g. triangular, hexagonal, circular, irregular
- E04F2203/023—Specially structured or shaped covering, lining or flooring elements not otherwise provided for having particular shapes, other than square or rectangular, e.g. triangular, hexagonal, circular, irregular having triangular shapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/026—Heaters specially adapted for floor heating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Central Heating Systems (AREA)
- Resistance Heating (AREA)
Abstract
A modular heated panel for heating a building, for example as in-floor heating, has an upper layer 5, first 1 and second 2 middle layers and a lower layer 7. The upper layer 5 comprises a first material such as wood, slate or marble or any other material suitable for floor or wall panels; the first middle layer 1 comprises a second material and has a heating element 3, which may be a nano carbon heating element, received within grooves or channels 4; the second middle layer 6 comprises a thermally and/or electrically insulating material; and the lower layer comprises a fourth material having one or more grooves or channels 8 receiving two power supplying conductors 11. The conductors are externally accessible and are releasably connectable through connectors (12, Fig. 5) to the conductors of a second identical flooring unit. Power can be supplied to multiple panels from a single power source.
Description
(54) Title of the Invention: Underfloor heating
Abstract Title: A modular layered heated panel for use as a flooring or wall panel (57) A modular heated panel for heating a building, for example as in-floor heating, has an upper layer 5, first 1 and second 2 middle layers and a lower layer 7. The upper layer 5 comprises a first material such as wood, slate or marble or any other material suitable for floor or wall panels; the first middle layer 1 comprises a second material and has a heating element 3, which may be a nano carbon heating element, received within grooves or channels 4; the second middle layer 6 comprises a thermally and/or electrically insulating material; and the lower layer comprises a fourth material having one or more grooves or channels 8 receiving two power supplying conductors 11. The conductors are externally accessible and are releasably connectable through connectors (12, Fig. 5) to the conductors of a second identical flooring unit. Power can be supplied to multiple panels from a single power source.
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Title: Underfloor heating
Description of Invention
This invention relates to heated panels for flooring or walls, in particular to modular heated panels.
Typical systems comprise either electric or water based heating systems, which are installed under a floor or behind a wall and typically require an insulating layer.
Electric systems may comprise either single heating elements, which are arranged under flooring panels by the user, or pre-formed mats comprising multiple heating elements, which are simply put down before the panels are fitted.
Water based systems may comprise a network of pipes linked to a boiler and use a flow of heated water to transfer heat to the room.
Both electric and water based systems require that an insulating layer is put down before the electric or water heating elements are installed, and both systems need to be installed before the panels are put down and require space underneath the panels to be installed.
It is desirable to have a system for heating flooring and/or wall panels, which is easy to install and does not require a separate insulating layer.
The present invention aims to address at least some of these problems.
Accordingly, one aspect of the present invention provides a modular heated panel for use in providing heating for a building, the panel having an upper layer, first and second middle layers and a lower layer; wherein: the upper layer comprises a first material; the first middle layer comprises a second material having one or more grooves or channels formed therein, a heating element being received within the grooves or channels; the second middle layer comprises a third material which is a thermally and/or electrically insulating material, the first middle layer being in between the upper layer and the second middle layer; and the lower layer comprises a fourth material having one or more grooves or channels formed therein, the channels or grooves receiving two power supplying conductors, wherein the conductors are configured such that the conductors are connectable to a power source, the heating element is connected to the power conductors to receive power from the conductors, the conductors are accessible from the exterior of the panel, and the conductors are releasably connectable to the conductors of a second identical flooring unit.
Preferably, the heating element is a nano carbon heating element.
Preferably, the heating element is powered through a physical connection with the conductors.
Preferably, the second middle layer has one or more apertures formed therethrough to allow the physical connection between the heating element and the conductors.
Preferably, the heating element is powered through an induction loop.
Preferably, the groove or channel of the first middle layer is less than half the depth of the first middle layer.
Preferably, one or more of the layers have male and female portions configured to join adjacent strips of connected panels together.
Preferably, the modular heated panel is waterproofed, such that liquid cannot reach the electric components.
Preferably, at least some of the electric components contained within the panel are waterproof.
Preferably, at least one of the first, second, third or fourth materials are wood.
Preferably, at least one of the first, second, third or fourth materials are a ceramic.
Preferably, at least one of the first, second, third or fourth materials are a polymer.
Preferably, the first material is slate.
Preferably, the first material is marble.
Preferably, at least a part of the modular heated panel is made of elm, maple or walnut.
Preferably, the power source is an external power source.
Preferably, at least a part of the power is supplied by a piezoelectric generator.
Preferably, the panel further comprises a pressure sensor, the pressure sensor configured to turn off the heating element if a pressure over a threshold pressure is detected.
The present invention may also relate to a joining arrangement for use with modular heated panels according to any of the above, wherein: the joining arrangement comprises two pairs of connectors on the same side of the joining arrangement, the pairs of connectors configured to receive a first pair of conductors of a first modular heating panel and a second pair of conductors of a second modular heating panel; the joining arrangement configured to conduct power to the second modular heating panel from the conductors of the first modular heating panel, such that only one power source is needed to power the first and second modular heating panels.
Another aspect of the present invention may relate to a kit comprising two or more panels according to any of the above, in combination with the above joining arrangement.
The present invention may also provide a method of making a modular heated panel, comprising the steps of: providing a first, surface layer, providing a second layer, forming a groove in a second layer, placing a heating element in the groove of the second layer, joining the first layer and the second layer, providing a third insulating layer, joining the third layer to the first and second layer, providing a fourth layer, configured to receive power cables, joining the fourth layer to the first, second and third layers.
In order that the present invention may be more readily understood, embodiments thereof will now be described, by way of example, with reference to the accompanying drawings, in which:
Fig. 1 is a schematic view of a heating panel according to an embodiment of the present invention.
Fig. 2 is a schematic view of panel layer with a heating element according to an embodiment of the present invention.
Fig. 3 is a schematic view of a panel layer for receiving a heating element according to an embodiment of the present invention.
Fig. 4 is a schematic view of the underside of a heating panel according to an embodiment of the present invention.
Fig. 5 is a schematic view of power cable connectors according to an embodiment of the present invention.
Fig. 6 is a schematic view of a room with heating panels and joining sections according to an embodiment of the present invention.
Fig. 7 is a schematic view of a room with heating panels and joining sections according to another embodiment of the present invention.
The embodiment shown in Fig. 1 comprises a multi-layered panel, in accordance with the present invention, made up of a first (i.e. uppermost) layer 5, a second layer 1, a third layer 6 and a fourth (i.e. lowermost) layer 7. All the layers 5, 1,6, 7 are preferably substantially the same length and width. In one embodiment, the panel is 1210 mm long, 165 mm wide and 18.5 mm deep, although panels may be made to any suitable size. One or more of the layers may have a male portion, such as a protruding rib, running along one side edge 13 of the panel and a corresponding female portion, such as a groove, running along the opposite edge of the panel (not shown). These male and female portions may join two adjacent strips of panels together, and/or help to maintain adjacent strips of panels in relative positions so that the first layers 5 of the panels are at the same level.
The layers 5,1,6,7 are closely stacked upon one another and are joined to one another by any suitable joining method, such as by glue.
The first layer 5 typically comprises a robust and presentable material such as wood, slate, marble, a ceramic, a polymer or any other material suitable for floor or wall panels. In use, the first layer 5 will comprise the visible surface of the panel. In preferred embodiments, the first layer 5 comprises a high density wood.
The second layer 1 comprises a thermally insulating material such as wood, a ceramic or a polymer and holds a heating element, such as a nano-carbon heating element. The second layer 1 is described in greater detail below. In preferred embodiments, the second layer 1 comprises an engineered wood, such as plywood or MDF. In some embodiments, wherein the second layer 1 comprises a layer made of wood, the grain of the second layer 1 is at 90° to the first layer 5.
The third layer 6 comprises an electrically and/or thermally insulating material such as wood, a ceramic or a polymer. In preferred embodiments, the third layer 6 comprises an engineered wood, such as plywood or MDF. In some embodiments, wherein the third layer 6 comprises a layer made of wood, the grain of the third layer 6 is at 90° to the second layer 1.
The fourth layer 7 comprises a material such as wood, a ceramic or a polymer and further comprises at least one channel 8, for receiving a power cable. The fourth layer 7 is described in greater detail below. In preferred embodiments, the fourth layer 7 comprises an engineered wood, such as plywood or MDF. In some embodiments, wherein the fourth layer 7 comprises a layer made of wood, the grain of the fourth layer 7 is at 90° to the third layer 6.
An advantage of having layers wherein the grain of the wood of a layer is at 90° to the layer above is that it reduces the amount that the wood can swell or shrink and increases the overall strength of the panel.
Fig. 2 shows the second layer 1 of the multi-layered panel in more detail. The second layer 1 comprises a rectangular layer 2 of substantially constant thickness with a first major surface (shown here as the upper surface), and the rectangular layer 2 has one or more grooves 4 in the upper surface of the rectangular layer 2, which are deep enough to receive the nano carbon heating element 3.
In the embodiment shown, the groove 4 runs from a first end of the second layer 1, along the length of the second layer 1 to a second end of the second layer 1, travels in a perpendicular direction to the length of the second layer 1 and then returns towards the first end of the second layer 1. The groove runs up and down the length of the second layer 1, in order to allow a length of the heating element 3 that is substantially longer than the length of the second layer 1 to be placed in the groove 4. The groove 4 therefore “zig zags” across the upper surface of the second layer 1. It should be understood that any other suitable arrangement of grooves may be used. In the embodiment shown in Fig. 2, the nano carbon heating element 3 is in the order of six times the length of the second layer 1, however other multiples such as two, nine, twelve and twenty times are contemplated. In some embodiments, wider panels will have larger multiples of length of nano carbon heating element. In other embodiments, the multiple of nano carbon heating element length is independent of the width of the panel.
In the embodiment shown, the heating element 3 has two free ends. Power can be supplied across the free ends in use, as explained below.
Fig. 3 shows a cross sectional view of the second layer 1, without the heating element 3. In this example, the grooves 4 for receiving the heating element 3 are less than half the depth of the second layer 1. In preferred embodiments, the grooves 4 are significantly less than the depth of the second layer 1.
Fig. 4 shows the fourth layer 7 in more detail. The fourth layer 7 again comprises a rectangular layer 9 of substantially constant thickness, having two channels 10 running along the entire length of the fourth layer 7, extending between openings 8 at either end of the fourth layer 7. In the embodiment shown, the channels 10 are substantially straight and parallel. In this example, the channels 10 are open at the underside of the fourth layer 7. The channels 10 are wide enough and deep enough to receive power cables, for powering the heating element 3. The power cables are described in more detail below.
Fig. 5 shows the power cables 11 in more detail. The power cables 11 are positioned in the channels 10 of the fourth layer 7. There is a positive power cable in a first channel 10 and a negative power cable in a second channel 10. The power cables 11 are used for delivering power to the heating element 3. At each end of the power cables 11, there are connectors 12, used for connecting an end of a power cable 11 in the panel to the end of a power cable in a second such panel, such that multiple panels can be linked together and power can be delivered to the heating elements of multiple panels from a single power source, with power flowing through the cables 11 and the connectors 12 of the panels. In other embodiments, each panel can be attached to its own power source.
In use, the panels are typically used as flooring panels or wall panels. Figs. 6 and 7 show the panels placed on the floor of a room. The panels are modular and are connected in strips so that the whole or part of a floor or a wall of a room may be covered in strips of connected panels. As the power cables 11 of the panels connect to one another and the panels are laid in strips, a power source or connections to a power source are only needed at one end of each strip, as shown in Fig. 6. In other embodiments, joining portions 15 join the ends of the strips of panels together, such that only one power source is needed to power all of the strips of panels, as shown in Fig. 7. The joining portions 15 include connectors and power cables that allow an electrical connection between the power cables of one panel with the power cables of an adjacent, parallel panel.
When the panels are installed, each strip of connected panels may terminate in an end connector 13, as shown in Fig. 6. The end connector receives the ends of the power cables 11, so that they are not exposed. The end connector may be of a same standard length as the other panels, or may be half length or a quarter length or any other suitable length so that the flooring panels fit the room in which they are installed. In preferred embodiments, a flooring panel without a heating element is used as an end connector 13. The advantage of such an end connector 13 is that if, for example, an area 14 of the end connector 13 needed to be removed so that the flooring fit a nonregular shaped room, the user would not need to worry about cutting through either a heating element 3 or a power cable 11.
If the panels cover a wall and a floor of a room, joining portions 13,15 may join the panels on the wall and the panels on the floor such that only one power supply is needed for a room.
The third layer 6 comprises an insulating layer, which separates the heating element 3 from the power cables 11. In the case of a fault with the power cables 11, the insulating layer 3 provides added protection to a user. Likewise, if a user, for example, spills a liquid on the panel, the insulating layer 3 provides added protection to the user from receiving an electric shock. In other embodiments there may be two, three, four or any other number of insulating layers between the heating layer and the power layer. For example, one layer may be a thermally insulating layer and a second layer may be an electrically insulating layer, in other embodiments one or more layers that are both thermally and electrically insulating may be used.
The entire flooring panel may be waterproof, such that liquid cannot reach the electronic components (aside, possibly, from the connectors) and so exposure to, or even immersion in, liquid will not expose a user to the risk of an electric shock. The waterproofing may arise from sealing the separate layers such that liquid cannot move between the layers or by coating and/or treating the panel arrangement as a whole. Alternatively, or in addition, the electronic components themselves may be waterproof, such that if any liquid that moves through the layers and reaches a live part of the panel, the user is not at risk of an electric shock.
Connections must be formed between the power cables 11 and the heating element 3.
In some embodiments, the heating element 3 is routed down from the second layer 1, through the third layer 6 and into the fourth layer 7, where it connects to the power cables 11. In other embodiments, the heating element 3 is routed down from the second layer 1 into the third layer 6 and the power cables 11 are routed up from the fourth layer 7 into the third layer 6. In this embodiment, the heating element 3 is connected to the power cables 11 in the third layer 6. In other embodiments, the power cables 11 are routed up from the fourth layer 4, through the third layer 6 and into the second layer 1, where they connect to the heating element 3. Preferably, the heating element 3 connects to the power cables 11 near an end of the panel. In some embodiments, one or more separate wires or other conductors are placed in between the second layer 1 and the fourth layer 7 and link the heating element 3 and the power cables 11. In other embodiments, the heating element 3 is powered by an induction loop or another non-contact arrangement.
In preferred embodiments, the materials that make up the panel are chosen such that they do not substantially expand when the heating element 3 is powered. For example, high density woods such as elm, maple or walnut may be chosen for the first layer 5. This is advantageous as it prevents the first layer 5 from cracking or splitting after repeated heating cycles.
The power source may be connected to a thermostat unit comprising at least a thermostat and a processor. The power source may be turned on and off by the thermostat unit in order to keep the room or floor surface at a constant temperature. The thermostat unit may be connectable to a remote device, such as a mobile phone or a table, via a network, such as the internet, so that a user can turn the power source on and off remotely via, for example, a computer program or app. This is advantageous as it allows a user to save energy or to pre-warm a room before the user enters the room.
The power source for the heated panel is generally mains electricity; however, other power sources are contemplated. For example, if the panels are used as flooring, piezoelectric power generators, which generate power from users walking on the floor, may provide a portion of the power to the heating element. In other embodiments, the panels may be connected to a ground source heat pump, an air source heat pump or renewable electricity source such as a solar panel or a wind turbine.
In some embodiments, a pressure sensor is included in a flooring panel. The pressure sensor may be connected to a logic circuit. If, for example, a heavy piece of furniture is placed on top of the flooring panel, the pressure sensor sends a signal to the logic circuit, which turns off the heating element (e.g. by opening a switch so that power is not supplied to the heating element). The advantage of such an arrangement is that placing furniture on top of a flooring panel may cause it to overheat. The pressure sensor is used to detect the furniture and the heating circuit is switched off, preventing overheating.
In other embodiments, the heated panel may mounted on a roof in order to melt, and prevent the build-up of, snow.
When used in this specification and claims, the terms comprises and comprising and variations thereof mean that the specified features, steps or integers are included. The terms are not to be interpreted to exclude the presence of other features, steps or components.
The features disclosed in the foregoing description, or the following claims, or the accompanying drawings, expressed in their specific forms or in terms of a means for performing the disclosed function, or a method or process for attaining the disclosed result, as appropriate, may, separately, or in any combination of such features, be utilised for realising the invention in diverse forms thereof.
Claims (25)
1. A modular heated panel for use in providing heating for a building, the panel having an upper layer, first and second middle layers and a lower layer; wherein:
the upper layer comprises a first material;
the first middle layer comprises a second material having one or more grooves or channels formed therein, a heating element being received within the grooves or channels;
the second middle layer comprises a third material which is a thermally and/or electrically insulating material, the first middle layer being in between the upper layer and the second middle layer; and the lower layer comprises a fourth material having one or more grooves or channels formed therein, the channels or grooves receiving two power supplying conductors, wherein the conductors are configured such that the conductors are connectable to a power source, the heating element is connected to the power conductors to receive power from the conductors, the conductors are accessible from the exterior of the panel, and the conductors are releasably connectable to the conductors of a second identical flooring unit.
2. The modular heated panel of claim 1 wherein the heating element is a nano carbon heating element.
3. The modular heated panel of claims 1 or 2 wherein the heating element is powered through a physical connection with the conductors.
4. The modular heated panel of claim 3 wherein the second middle layer has one or more apertures formed therethrough to allow the physical connection between the heating element and the conductors.
5. The modular heated panel of claims 1 or 2 wherein the heating element is powered through an induction loop.
6. The modular heated panel of claims 1 - 5 wherein the groove or channel of the first middle layer is less than half the depth of the first middle layer.
7. The modular heated panel of claims 1 - 6 wherein one or more of the layers have male and female portions configured to join adjacent strips of connected panels together.
8. The modular heated panel of claims 1 - 7 wherein the modular heated panel is waterproofed, such that liquid cannot reach the electric components.
9. The modular heated panel of claims 1 - 8 wherein the at least some of the electric components contained within the panel are waterproof.
10. The modular heated panel of any preceding claim, wherein at least one of the first, second, third or fourth materials are wood.
11. The modular heated panel of claims 1 - 9, wherein at least one of the first, second, third or fourth materials are a ceramic.
12. The modular heated panel of claims 1 - 9, wherein at least one of the first, second, third or fourth materials are a polymer.
13. The modular heated panel of claims 1-12, wherein the first material is slate.
14. The modular heated panel of claims 1-12, wherein the first material is marble.
15. The modular heated panel of any preceding claim, wherein at least a part of the modular heated panel is made of elm, maple or walnut.
16. The modular heated panel of any preceding claim, wherein the power source is an external power source.
17. The modular heated panel of any preceding claim, wherein the at least a part of the power is supplied by a piezoelectric generator.
18. The modular heated panel of any preceding claim, wherein the panel further comprises a pressure sensor, the pressure sensor configured to turn off the heating element if a pressure over a threshold pressure is detected.
19. A joining arrangement for use with modular heated panels according to any preceding claim, wherein:
the joining arrangement comprises two pairs of connectors on the same side of the joining arrangement, the pairs of connectors configured to receive a first pair of conductors of a first modular heating panel and a second pair of conductors of a second modular heating panel;
the joining arrangement configured to conduct power to the second modular heating panel from the conductors of the first modular heating panel, such that only one power source is needed to power the first and second modular heating panels.
20. A kit comprising two or more panels according to any one of claims 1 to 18, in combination with a joining arrangement according to claim 19.
21. A method of making a modular heated panel, comprising the steps of: providing a first, surface layer, providing a second layer, forming a groove in a second layer, placing a heating element in the groove of the second layer, joining the first layer and the second layer, providing a third insulating layer, joining the third layer to the first and second layer, providing a fourth layer, configured to receive power cables, joining the fourth layer to the first, second and third layers.
5
22. A modular heated panel substantially as hereinbefore described with reference to the accompanying drawings.
23. A joining arrangement substantially as hereinbefore described with reference to the accompanying drawings.
24. A kit substantially as herein before described with reference to the accompanying drawings.
25. Any novel feature or combination of features disclosed herein.
Intellectual
Property
Office
Application No: GB1607605.1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1607605.1A GB2552292A (en) | 2016-04-29 | 2016-04-29 | Underfloor heating |
PCT/GB2017/050626 WO2017187121A1 (en) | 2016-04-29 | 2017-03-08 | Underfloor heating |
CN201790000096.9U CN208075075U (en) | 2016-04-29 | 2017-03-08 | Modular heating plate for providing heating for building |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1607605.1A GB2552292A (en) | 2016-04-29 | 2016-04-29 | Underfloor heating |
Publications (2)
Publication Number | Publication Date |
---|---|
GB201607605D0 GB201607605D0 (en) | 2016-06-15 |
GB2552292A true GB2552292A (en) | 2018-01-24 |
Family
ID=56234215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1607605.1A Withdrawn GB2552292A (en) | 2016-04-29 | 2016-04-29 | Underfloor heating |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN208075075U (en) |
GB (1) | GB2552292A (en) |
WO (1) | WO2017187121A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019119964B4 (en) | 2019-07-24 | 2022-09-08 | Surteco Gmbh | Heated surface covering, heated structure, method and covering panel |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108081909A (en) * | 2017-12-20 | 2018-05-29 | 厦门伟特思汽车科技有限公司 | A kind of new integral new-energy passenger constant temperature heating control system |
CN108592152A (en) * | 2018-06-12 | 2018-09-28 | 虞琼洁 | Graphene Electrical heating floor |
CN110996407A (en) * | 2019-12-31 | 2020-04-10 | 佛山市斯特美光电科技有限公司 | Electronic heating plate and temperature control system thereof |
CN112931293B (en) * | 2021-01-22 | 2022-12-27 | 广西壮族自治区畜牧研究所 | Intelligent clearance system in house is bred to africa ostrich scale |
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JPH03197750A (en) * | 1989-12-25 | 1991-08-29 | Matsushita Electric Works Ltd | Base plate of wooden heating floor |
GB2332045A (en) * | 1997-11-21 | 1999-06-09 | David Marrs | Heated flooring module |
US20120234819A1 (en) * | 2009-11-13 | 2012-09-20 | Berger Craig M | Multilayer structural heating panel |
CN203249312U (en) * | 2013-04-12 | 2013-10-23 | 陆建立 | Phase change energy storage far infrared deformation-resistant solid wood floor |
CN204876472U (en) * | 2015-07-08 | 2015-12-16 | 黄启明 | Multi -functional fossil fragments spontaneous heating solid wood floor that exempts from |
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DE29512166U1 (en) * | 1995-07-28 | 1995-11-23 | Vahlbrauk, Karl Heinz, 37581 Bad Gandersheim | Wall element |
DE10051749B4 (en) * | 2000-10-18 | 2017-04-13 | Bechir Chahed | Plate-shaped self-supporting assembly component with integrated heating and / or cooling surfaces and method for its production |
US20100126985A1 (en) * | 2008-06-13 | 2010-05-27 | Tsinghua University | Carbon nanotube heater |
FR2935216A1 (en) * | 2008-08-19 | 2010-02-26 | Gerard Rollot | Decorative heating panel e.g. heating door, has decorative element arranged on support that is made of wood or composite material, where support has source constituted of film and glued mica resistors |
KR20100039064A (en) * | 2008-10-07 | 2010-04-15 | 김성곤 | Heating bottom plate and assembly of the same |
DE202013105171U1 (en) * | 2013-11-15 | 2013-11-26 | Yuyao City Tuoda Flooring Co., Ltd. | Heat-emitting floor |
-
2016
- 2016-04-29 GB GB1607605.1A patent/GB2552292A/en not_active Withdrawn
-
2017
- 2017-03-08 WO PCT/GB2017/050626 patent/WO2017187121A1/en active Application Filing
- 2017-03-08 CN CN201790000096.9U patent/CN208075075U/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03197750A (en) * | 1989-12-25 | 1991-08-29 | Matsushita Electric Works Ltd | Base plate of wooden heating floor |
GB2332045A (en) * | 1997-11-21 | 1999-06-09 | David Marrs | Heated flooring module |
US20120234819A1 (en) * | 2009-11-13 | 2012-09-20 | Berger Craig M | Multilayer structural heating panel |
CN203249312U (en) * | 2013-04-12 | 2013-10-23 | 陆建立 | Phase change energy storage far infrared deformation-resistant solid wood floor |
CN204876472U (en) * | 2015-07-08 | 2015-12-16 | 黄启明 | Multi -functional fossil fragments spontaneous heating solid wood floor that exempts from |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019119964B4 (en) | 2019-07-24 | 2022-09-08 | Surteco Gmbh | Heated surface covering, heated structure, method and covering panel |
Also Published As
Publication number | Publication date |
---|---|
WO2017187121A1 (en) | 2017-11-02 |
CN208075075U (en) | 2018-11-09 |
GB201607605D0 (en) | 2016-06-15 |
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COOA | Change in applicant's name or ownership of the application |
Owner name: JET BLUE LIMITED Free format text: FORMER OWNER: TIMBERTHERM (HONG KONG) LIMITED |
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WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |