CN203334613U - Waveform heat conduction composite floor - Google Patents
Waveform heat conduction composite floor Download PDFInfo
- Publication number
- CN203334613U CN203334613U CN2013203034871U CN201320303487U CN203334613U CN 203334613 U CN203334613 U CN 203334613U CN 2013203034871 U CN2013203034871 U CN 2013203034871U CN 201320303487 U CN201320303487 U CN 201320303487U CN 203334613 U CN203334613 U CN 203334613U
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- waveform
- board
- metal
- heat conduction
- moulded board
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Abstract
The utility model relates to a waveform heat conduction composite floor which comprises an upper layer floor base board, a lower layer floor base board, a middle layer arranged between the upper layer floor base board and the lower layer floor base board. The middle layer is composed of a metal waveform molded plate, longitudinal frames and transverse frames, wherein the longitudinal frames and the transverse frames are arranged around the periphery of the metal waveform molded plate. Three-dimensional waveform strips of the metal waveform molded plate are placed in a transversely parallel mode. The metal waveform molded plate is machined by a metal thin plate with heating cable holes formed in advance in a bent mode so that the functions of containing of heating cables, heat conduction and flow guidance can be achieved. Flow-guiding grooves are formed in the upper side and the lower side of each longitudinal frame in a crossed mode, so that the convection function of heat energy is improved. The materials are bonded in a pressed mode through adhesives and the periphery is respectively provided with tenon edges and grooves, wherein the tenon edges and the grooves are used for splicing floors. The metal waveform molded plate is used for rapidly and evenly transmitting heat to the surface of the floor and the indoor space so that the heat conduction effect can be improved. The waveform heat conduction composite floor is stable in structure, safe, reliable, high in heat conductive efficiency, convenient to install, environmentally friendly, saving in energy and the like.
Description
Technical field
The utility model relates to a kind of composite floor board, particularly a kind of waveform heat conduction composite floor board.
Background technology
Along with social development, the continuous progress of science and technology.Composite floor board becomes the material that increasing house decoration adopts, but, after the composite floor board of mating formation, the floor heating heating layer need could arrive ground by air layer, the wood flooring with a determining deviation between wood flooring, due to the poor thermal conductivity of timber own, cause thermal source to run off, cause a large amount of wastes of resource.And the area of heating is not installed while building in house, if option and installment electric radiation heating repaves the dress wood flooring after the heat generating wire cable of so just need to first mating formation, its installation procedure is loaded down with trivial details, and poor thermal conductivity, for reaching the effect of heating, energy consumption consumption is large, increases use cost.
Existence due to the problems referred to above, the applicant is studied and is improved existing floor technique, in order to can produce Stability Analysis of Structures, Stability Analysis of Structures, prevent the waveform heat conduction composite floor board of watt change of floor transverse bending and dash board longitudinal cracking, and also improved in use the cross conduction of heat energy, floor is heated evenly, has improved the thermal efficiency.
Summary of the invention
The technical problems to be solved in the utility model is to provide a kind of Stability Analysis of Structures, prevent the waveform heat conduction composite floor board of watt change of floor transverse bending and dash board longitudinal cracking, and also improved in use the cross conduction of heat energy, and floor is heated evenly, improved the thermal efficiency.
For reaching above-mentioned purpose, the technical solution of the utility model is: a kind of waveform heat conduction composite floor board, comprise upper floor substrate 1, lower floor substrate 5 and be arranged at the centre between described upper floor substrate 1 and lower floor substrate 5, described intermediate layer 3 is metal waveform moulded board 36, and, around vertical frame 32 of metal waveform moulded board 36 surroundings and horizontal frame 33, the three-dimensional waveform strip of wherein said metal waveform moulded board 36 is horizontal parallel placement.
Described metal waveform moulded board 36 can be the heating cable hole 34 be provided with on the waveform inclined-plane on metal waveform moulded board 36 more than a row with the floor parallel longitudinal, and heating cable hole 34, adjacent inclined-plane is corresponding.
Described metal waveform moulded board 36 can be also to be processed by the metal sheet roof covering complications that set in advance heating cable hole 34.
On described horizontal frame 33, be provided with and position, corresponding hole, heating cable hole 34 on described metal waveform moulded board 36, now, the heating cable hole 34 on the Kong Weiyu metal waveform moulded board 36 on the horizontal frame 33 at described metal waveform moulded board 36 two ends is a straight line.
Its further, the inclined-plane of described metal waveform moulded board 36 or vertical plane and upper floor substrate 1 and lower floor substrate 5 in conjunction with Plane Angle be 90 ~ 135 the degree.
Preferably, be provided with the thermal conductance chute 37 of top-bottom cross on vertical frame 32, for discharging moisture in heat energy and plate, improve heat-conducting effect and stability.
Laterally the heating cable hole 34 on frame 33 and the 34 aperture, heating cable hole on metal waveform moulded board 36 are greater than heating electric cable 7 external diameters.
Metal waveform moulded board 36 is curved metal ripple moulded board, heating cable hole 34 is set on subvertical.
The utility model advantage is:
The utility model structure is similar to composite floor board three times, and ripple adopts and is placed horizontally in the middle part, floor, with floor, vertically intersect, and Stability Analysis of Structures, substrate is identical with three layers of composite floor structure, can prevent watt change of floor transverse bending and dash board longitudinal cracking; Also improved the cross conduction of heat energy, floor is heated evenly, improved the thermal efficiency, be conducive to energy-conservation simultaneously.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is decomposing schematic representation of the present utility model.
Fig. 2 is longitudinal cross-section of the present utility model cross-sectional schematic.
Fig. 3 is lateral cross section cross-sectional schematic of the present utility model.
The plane perspective view that Fig. 4 is intermediate layer of the present utility model.
The specific embodiment
Embodiment: shown in figure 1-4, the utility model provides a kind of waveform heat conduction composite floor board, comprise upper floor substrate 1, lower floor substrate 5 and be arranged at the intermediate layer 3 between described upper floor substrate 1 and lower floor substrate 5, described intermediate layer 3 is metal waveform moulded board 36, and around vertical frame 32 of metal waveform moulded board 36 surroundings and horizontal frame 33, the three-dimensional waveform strip of wherein said metal waveform moulded board 36 is laterally parallel putting, described metal waveform moulded board 36 can be the heating cable hole 34 be provided with on the waveform inclined-plane on metal waveform moulded board 36 more than a row with the floor parallel longitudinal, heating cable hole 34, adjacent inclined-plane is corresponding, described metal waveform moulded board 36 can be also to be processed by the metal sheet roof covering complications that set in advance heating cable hole 34.The effect of placing heating electric cable 7 and heat conduction, water conservancy diversion can be played in this heating cable hole 34.On described horizontal frame 33, be provided with and position, corresponding hole, heating cable hole 34 on described metal waveform moulded board 36, now, the heating cable hole 34 on the Kong Weiyu metal waveform moulded board 36 on the horizontal frame 33 at described metal waveform moulded board 36 two ends is a straight line.
Its further, the inclined-plane of described metal waveform moulded board 36 or vertical plane and upper floor substrate 1 and lower floor substrate 5 in conjunction with Plane Angle be 90 ~ 135 the degree.
Preferably, be provided with the thermal conductance chute 37 of top-bottom cross on vertical frame 32, for discharging moisture in heat energy and plate, improve heat-conducting effect and stability.
Laterally the heating cable hole 34 on frame 33 and the 34 aperture, heating cable hole on metal waveform moulded board 36 are greater than heating electric cable 7 external diameters.
Metal waveform moulded board 36 is curved metal ripple moulded board, heating cable hole 34 is set on subvertical.
During installation, arrange heating electric cable 7 at least one heating cable hole 34, heating electric cable 6 passes heating cable hole 34 and is electrically connected with power supply.Heat energy evenly transmits to all directions rapidly.
The utility model has adopted metal waveform moulded board 36, thereby makes heat energy be delivered to quickly and evenly floor surface and the interior space, promotes heat-conducting effect.The utlity model has Stability Analysis of Structures, the characteristics such as safe and reliable, heat transfer efficiency is high, easy for installation, environmental protection and energy saving.
Certainly above-described embodiment is only explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalent transformations of doing according to the Spirit Essence of the utility model main technical schemes or modification, within all should being encompassed in protection domain of the present utility model.
Claims (10)
1. a waveform heat is conducted composite floor board, comprise upper floor substrate (1), lower floor substrate (5) and be arranged at described upper floor substrate (1) and lower floor substrate (5) between intermediate layer (3), it is characterized in that: described intermediate layer (3) for metal waveform moulded board (36), and around vertical frame (32) and the horizontal frame (33) of metal waveform moulded board (36) surrounding
,the three-dimensional waveform strip of wherein said metal waveform moulded board (36) is horizontal parallel placement.
2. waveform heat as claimed in claim 1 is conducted composite floor board, it is characterized in that: more than being provided with a row on the waveform inclined-plane on described metal waveform moulded board (36) and the heating cable hole (34) of floor parallel longitudinal, heating cable hole, adjacent inclined-plane (34) is corresponding.
3. waveform heat as claimed in claim 1 is conducted composite floor board, and it is characterized in that: described metal waveform moulded board (36) is processed by the metal sheet roof covering complications that set in advance heating cable hole (34).
4. waveform heat is conducted composite floor board as claimed in claim 2 or claim 3, it is characterized in that: on described horizontal frame (33), be provided with and position, corresponding hole, heating cable hole (34) on described metal waveform moulded board (36), now, the heating cable hole (34) on the Kong Weiyu metal waveform moulded board (36) on the horizontal frame (33) at described metal waveform moulded board (36) two ends is a straight line.
5. as claim 1 or 2 or 3 described waveforms heat conduction composite floor boards, it is characterized in that: the inclined-plane of described metal waveform moulded board (36) or vertical plane and upper floor substrate (1) and lower floor substrate (5) in conjunction with Plane Angle, be 90 ~ 135 to spend.
6.. waveform heat conduction composite floor board as claimed in claim 5, is characterized in that: the thermal conductance chute (37) that is provided with top-bottom cross on described vertical frame (32).
7. waveform heat as claimed in claim 5 is conducted composite floor board, and it is characterized in that: the heating cable hole (34) on described horizontal frame (33) and the aperture in the heating cable hole (34) on metal waveform moulded board (36) are greater than heating electric cable (7) external diameter.
8. waveform as claimed in claim 5 heat conduction composite floor board, it is characterized in that: described metal waveform moulded board (36) is curved metal ripple moulded board, heating cable hole (34) is set on subvertical.
9. as claim 1 or 2 or 3 or 6 described waveform heat conduction composite floor boards, it is characterized in that: described upper floor substrate (1) and lower floor substrate (5) are plates of solid wood or composite board or integrated sheet material or bamboo board.
10. as claim 1 or 2 or 3 described waveform heat conduction composite floor boards, it is characterized in that: described upper floor substrate (1), metal waveform moulded board (36), frame and lower floor substrate (5) are pressed into one through the adhesive of glue-line (2,4) in length and breadth, and its surrounding is provided with for the tenon limit (35) of splicing floors and notch (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203034871U CN203334613U (en) | 2013-05-30 | 2013-05-30 | Waveform heat conduction composite floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203034871U CN203334613U (en) | 2013-05-30 | 2013-05-30 | Waveform heat conduction composite floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203334613U true CN203334613U (en) | 2013-12-11 |
Family
ID=49703293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203034871U Expired - Fee Related CN203334613U (en) | 2013-05-30 | 2013-05-30 | Waveform heat conduction composite floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203334613U (en) |
-
2013
- 2013-05-30 CN CN2013203034871U patent/CN203334613U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20150530 |
|
| EXPY | Termination of patent right or utility model |