GB2312091B - A packaging assembly for a circuit assembly - Google Patents

A packaging assembly for a circuit assembly

Info

Publication number
GB2312091B
GB2312091B GB9705171A GB9705171A GB2312091B GB 2312091 B GB2312091 B GB 2312091B GB 9705171 A GB9705171 A GB 9705171A GB 9705171 A GB9705171 A GB 9705171A GB 2312091 B GB2312091 B GB 2312091B
Authority
GB
United Kingdom
Prior art keywords
assembly
packaging
circuit
circuit assembly
packaging assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9705171A
Other languages
English (en)
Other versions
GB2312091A (en
GB9705171D0 (en
Inventor
Dean B Nicholson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9705171D0 publication Critical patent/GB9705171D0/en
Publication of GB2312091A publication Critical patent/GB2312091A/en
Application granted granted Critical
Publication of GB2312091B publication Critical patent/GB2312091B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB9705171A 1996-04-12 1997-03-13 A packaging assembly for a circuit assembly Expired - Fee Related GB2312091B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/629,949 US5668408A (en) 1996-04-12 1996-04-12 Pin grid array solution for microwave multi-chip modules

Publications (3)

Publication Number Publication Date
GB9705171D0 GB9705171D0 (en) 1997-04-30
GB2312091A GB2312091A (en) 1997-10-15
GB2312091B true GB2312091B (en) 2000-08-23

Family

ID=24525135

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9705171A Expired - Fee Related GB2312091B (en) 1996-04-12 1997-03-13 A packaging assembly for a circuit assembly

Country Status (4)

Country Link
US (1) US5668408A (enExample)
JP (1) JPH1041421A (enExample)
DE (1) DE19701337C2 (enExample)
GB (1) GB2312091B (enExample)

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US6028497A (en) * 1998-01-28 2000-02-22 Trw Inc. RF pin grid array
JP3129288B2 (ja) 1998-05-28 2001-01-29 日本電気株式会社 マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造
JP3526788B2 (ja) * 1999-07-01 2004-05-17 沖電気工業株式会社 半導体装置の製造方法
US6323743B1 (en) 1999-08-24 2001-11-27 Tresness Irrevocable Patent Trust Electronic filter assembly
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US6482038B2 (en) 2001-02-23 2002-11-19 Fci Americas Technology, Inc. Header assembly for mounting to a circuit substrate
US6498551B1 (en) * 2001-08-20 2002-12-24 Xytrans, Inc. Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC)
US20030095014A1 (en) * 2001-11-21 2003-05-22 Lao Binneg Y. Connection package for high-speed integrated circuit
US6803252B2 (en) 2001-11-21 2004-10-12 Sierra Monolithics, Inc. Single and multiple layer packaging of high-speed/high-density ICs
US6791317B1 (en) 2002-12-02 2004-09-14 Cisco Technology, Inc. Load board for testing of RF chips
US7811100B2 (en) 2007-07-13 2010-10-12 Fci Americas Technology, Inc. Electrical connector system having a continuous ground at the mating interface thereof
US8764464B2 (en) 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
WO2009139210A1 (ja) 2008-05-12 2009-11-19 三菱電機株式会社 高周波収納ケースおよび高周波モジュール
US7772694B2 (en) * 2008-11-26 2010-08-10 Freescale Semiconductor, Inc. Integrated circuit module and method of packaging same
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8267721B2 (en) 2009-10-28 2012-09-18 Fci Americas Technology Llc Electrical connector having ground plates and ground coupling bar
US8616919B2 (en) 2009-11-13 2013-12-31 Fci Americas Technology Llc Attachment system for electrical connector
DE102010030317B4 (de) * 2010-06-21 2016-09-01 Infineon Technologies Ag Schaltungsanordnung mit Shuntwiderstand
US9312817B2 (en) * 2012-07-20 2016-04-12 Freescale Semiconductor, Inc. Semiconductor package design providing reduced electromagnetic coupling between circuit components
US9240390B2 (en) 2013-06-27 2016-01-19 Freescale Semiconductor, Inc. Semiconductor packages having wire bond wall to reduce coupling
US9401342B2 (en) 2013-06-27 2016-07-26 Freescale Semiconductor, Inc. Semiconductor package having wire bond wall to reduce coupling
CN109148421B (zh) * 2018-08-31 2020-04-28 成都天箭科技股份有限公司 一种微波单片集成电路接地结构及其安装工艺
CN111707929B (zh) * 2020-06-29 2024-07-30 深圳赛西信息技术有限公司 一种pga封装微波测试夹具
FR3152928A1 (fr) * 2023-09-07 2025-03-14 Thales Interposeur coaxial hyperfréquences.

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US3689804A (en) * 1971-09-30 1972-09-05 Nippon Denso Co Hybrid circuit device
GB2246470A (en) * 1990-06-22 1992-01-29 Watkins Johnson Co Microwave integrated circuit package to eliminate alumina substrate cracking and method
WO1996013059A2 (en) * 1994-10-17 1996-05-02 Litton Systems, Inc. Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
EP0732745A2 (en) * 1995-03-16 1996-09-18 Oxley Developments Company Limited Microstrip microwave package

Also Published As

Publication number Publication date
DE19701337A1 (de) 1997-10-16
GB2312091A (en) 1997-10-15
GB9705171D0 (en) 1997-04-30
JPH1041421A (ja) 1998-02-13
DE19701337C2 (de) 2000-11-02
US5668408A (en) 1997-09-16

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732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070313