GB2282089A - Attaching lead elements to electronic components - Google Patents
Attaching lead elements to electronic components Download PDFInfo
- Publication number
- GB2282089A GB2282089A GB9416190A GB9416190A GB2282089A GB 2282089 A GB2282089 A GB 2282089A GB 9416190 A GB9416190 A GB 9416190A GB 9416190 A GB9416190 A GB 9416190A GB 2282089 A GB2282089 A GB 2282089A
- Authority
- GB
- United Kingdom
- Prior art keywords
- leads
- lead elements
- band
- electronic lead
- tabs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 67
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 abstract description 24
- 238000012545 processing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
- H01G4/245—Tabs between the layers of a rolled electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Electronic lead elements and the production method thereof are disclosed, wherein a set of electronic elements are wound up into a form of coil of a thin leaf band wherein electronic lead elements are composed of leads 10 and aluminum tabs 13 respectively, the leads 10 having one end fixed to the band 11 with a predetermined space provided therebetween and the other ends of the leads having aluminum tabs 13 welded thereto respectively and wherein the aluminum tabs are flattened. Thus the fins, which may be formed on the tabs, are prevented from damaging aluminum foil to be wound around the tabs to form condensers. <IMAGE>
Description
SPECIFICATION
TITLE OF THE INVENTION:
Electronic lead elements and the production
method thereof
FIELD OF THE INVENTION:
The invention relates to electronic lead elements and the production thereof, and more particularly relates to the steps for a plurality of leads to a thin metal leaf band with a predetermined space provided therebetween and then for welding aluminum tabs to the leads and then for pressing the tabs into a form of flat plate, thus to orientate in one and same direction the faces of the tabs having fins which may be generally produced when the tabs are subjected to the press processing, and then for winding up the band into a form of coil, thus to form up a set of completed electronic lead elements.
Namely the invention is intended to supply the lead elements directly to a tab welding device without relying on the conventional parts feeder which makes it difficult to orientate in one and same direction the faces of the tabs having the fins formed thereon. Thus the invention is intended to prevent the fin formed faces of tabs from being attached to an aluminum foil because the fins will give damages to the aluminum foil thereby to deteriorate the quality of completed condenser. In this sense, the invention may be said to be an epock making invention.
BACKGROUND OF THE INVENTION:
As shown in Figs. 5, 6 and 11-14, it has been generally known that the electronic lead element 1 is composed of a lead la and an aluminum tab lb which is welded to one end of the lead at a joint ld. The tab lb is then partly pressed into a form of flat plate lc and is then trimmingly processed to have a predetermined outline. In this case, the electronic lead elements 1 are processed in an individually separated condition and also released into market in an individually separated condition.
As shown in Figs. 5 and 6, the joint ld between the lead la and the tab lb is generally formed with hard and sharp projections le as a result of weld processing and further the flat plate lc is generally formed with the fins lf along the outline on one face thereof as a result of press processing.
The projections le and the fins lf are very hard because the aluminum is hardened by the processings.
The electronic lead elements 1 are transported to the tab welding device (not shown) by a whirpool formed parts feeder of vibration type (not shown) which is operated to turn the lead elements 1 so that the leads la will come down in alignment as shown in Figs. 11 and 12 and then convey the leads la into a clearance 2a provided between a pair of guide rails 2. Thus the parts feeder transports the lead elements 1 in the direction as indicated by arrow mark A to the tab welding device by means of gravity or giving vibrations to the guide rails 2.
During this transportation, the lead elements 1 are actually inclined to axially turn in the direction as indicated by arrow mark B or C between the guide rails 2.
This turning movements of the lead elements 1 will cause the joints ld to make frictions with the opposite edges 2b of the guide rails 2 and thereby to scrape the edges 2b of the guide rails 2 as the lead elements 1 are transported. Such scraping actions will rapidly destroy the transporting function of the guide rails 2. If the lead elements 1 are transported by such scraped guide rails 2, the leads la are caught by the damaged edges 2a of the guide rails 2 and are not smoothly transported. It has therefore been frequently required to repair the guide rails 2 or to employ new ones.
As shown in Figs. 13 and 14, in order to produce electrolytic condenser elements, it is required to fixedly attach the flat plates lc of the lead elements 1 to the aluminum foil 3 by mechanically applying a pressure (so called tab attaching). However if the face of flat plate lc having fins lf is contacted to the aluminum foil 3 and is then a mechanical pressure is applied, the fins If will hurt or cut the aluminum foil 3 away in the direction as indicated by arrow mark D. As the result, the electrical quality of the electrolytic condenser element will be remarkably deteriorated.
In order to prevent the aluminum foil 3 from being hurted, it is necessary to contact to the aluminum foil the face of the flat plate lc having no fins lf and then to apply mechanical pressure. However as shown in Fig. 8, the lead elements 1 are axially turned in the direction as shown by the arrow mark B or C as these are transported on the guide rails 2. It is actually impossible to orientate the same faces of the flat plates lc in one direction so as to contact to the aluminum foil 3 the same faces of all the flat plates Ic. It is especially difficult in case of smaller electrolytic condenser elements because the flat plates lc of the lead elements 1 are further smaller.
As the electronic lead elements 1 are transported while the faces of the flat plates lc are unorientated, the probability is 50 % that the faces of the flat plates lc having the fins lf are contacted and fixed to the aluminum foil 3. In this condition, it is really probable that the fins If will pierce into the aluminum foil 3 and deteriorate the electric property of the condenser. The fins lf will often cut the aluminum foil 3 away in the direction as shown by the arrow mark D and will make the completed condenser useless.
SUMMARY OF THE INVENTION:
The present invention has been provided to eliminate these defects and disadvantages. It is therefore a principal object of the invention to provide a specific method to produce an electronic lead element, in which a set of electronic lead elements are produced in a rolled up condition with a thin leaf band having the lead elements attached thereto with a predetermined space provided between the adjacent lead elements. It is another object of the invention to transport the lead elements without giving damages to a transporting device. It is another object of the invention to smoothly transport the lead elements thereby to remarkably increase the efficiency of a tab attaching operation. It is another object of the invention to fix the leads at one ends thereof to a thin leaf band with a predetermined space provided therebetween and then to weld tabs to the other ends of the leads and then to press one ends of the tabs into flat plates so as to orientate in one direction the faces of the tabs having fins which may be produced by press processing so that none of the faces having the fins will contact an aluminum foil to be wound therearound, thus to prevent the fins from giving damages to the aluminum foil.
It is another object of the invention to fix one ends of leads to a thin leaf band with a predetermined space provided therebetween, the band having a series of feeding openings with a predetermined space provided therebetween and then to weld aluminum tabs to the other ends of the leads and then to press one ends of the tabs into a form of flat plates and then to set the feeding openings of the band in engagement with sprockets for transporting the band. It is still another object of the invention to finally wind up the thin leaf band into a coil containing a set of electronic lead elements. As the result, the lead elements may be easily and conveniently treated.
In short, the present invention is to provide a method for forming wound up coil of a thin leaf band having one ends of leads fixed thereon with a predetermined space provided therebetween, the other ends of the leads having one ends of aluminum tabs welded thereto, and the other end parts of the tabs being pressed into a form of flat plate.
Another aspect of the invention is to fix one ends of leads on a thin leaf band with a predetermined space provided therebetween and then to weld one ends of aluminum tabs to the other ends of the leads and then to press the other end parts of the tabs into a form of flat plates.
Another aspect of the invention is to fix one ends of leads on a thin leaf band with a predetermined space provided therebetween, the other ends of the leads having one ends of aluminum tabs welded thereto, and then to press the other end parts into a form of flat plates.
Another aspect of the invention is to fix one ends of leads on a thin leaf band with a predetermined space provided therebetween, the band having feeding openings formed thereon with a predetermined space provided therebetween and then to weld one ends of aluminum tabs to the other ends of the leads and then to press the other end parts of the tabs into a form of flat plates.
Another aspect of the invention is to fix one ends of leads on a thin leaf band with a predetermined space provided therebetween, the other ends of the leads having one ends of aluminum tabs welded thereto and the band having feeding openings formed thereon with a predetermined space provided therebetween and then to press the other end parts into a form of flat plate.
Another aspect of the invention is to provide a set of electronic lead elements which are in a form of wound up coil of a thin metal leaf band, wherein one ends of the leads of the lead elements are welded on the band with a predetermined space provided therebetween, the other ends of the leads have one ends of aluminum tabs welded thereto and the other ends of the tabs are pressed into a form of flat plate.
Another aspect of the invention is to weld one ends of a plurality of leads on a thin metal leaf band and then to weld one ends of aluminum tabs to the other ends of the leads and then to press the other end parts of the tabs into a form of flat plate.
Another aspect of the invention is to weld one ends of a plurality of leads on a thin leaf band, the other ends of the leads having one ends of aluminum tabs welded thereto and then to press the other end parts into a form of flat plate.
The other features and advantages of the invention will be apparent from the description of preferred embodiments of the invention.
BRIEF DESCRIPTION OF THE ATTACHED DRAWINGS:
Fig. 1 is a front elevational view of electronic lead elements welded on a thin leaf band according to the invention;
Fig. 2 is a perspective view showing the leads of the electronic lead elements being welded on the band;
Fig. 3 is a plan view showing the thin leaf band being wound up into a coil while the electronic lead elements are fixed on the band;
Fig. 4 is a laterally sectioned plan view of the electronic lead element showing one face of the aluminum tab being attached to an aluminum foil without giving damages to the foil;
Fig. 5 is a sectional view of a tab welded to the lead of the electronic lead element shown partly enlarged by way of example;
Fig. 6 is the same with Fig. 5, but showing another example;
Figs. 7-10 show another embodiment of the invention, in which,
Fig.7 is a perspective view showing the electronic lead elements being welded at the lead ends thereof to the projections of a thin leaf band;
Fig. 8 is a perspective view showing the lead ends of the lead elements being welded to the projections of the band by means of a laser welding device;
Fig. 9 is a plan view of a plurality of bands pressed out of a thin leaf sheet;
Fig. 10 is a perspective view of a plurality of bands pressed out of the thin leaf sheet and separated from each other;
Figs. 11-14 show a conventional embodiment, in which,
Fig. 11 is a plan view showing the electronic lead elements being transported on guide rails;
Fig. 12 is a perspective view showing the guide rails damaged by the welded part of the tab;
Fig. 13 a perspective view showing the aluminum foil being cut away by the fins formed on a flat face of the tab; and
Fig. 14 is a laterally sectioned plan view of the lead element and the aluminum foil, the latter being cut away by the fins.
DETAILED DESCRIPTION OF THE INVENTION:
In reference to Figs. 1-4, each of electronic lead elements 10 is composed of a lead 12 and an aluminum tab 13.
The electronic lead elements 10 are fixed to a thin leaf band 11.
The thin leaf band 11 is employed for attaching thereto a plurality of electronic lead elements with a predetermined space provided therebetween. The band 11 may be a stainless steel plate of thickness O.05mm-O.lmm by way of example and has circular feeding openings 11a with a predetermined space provided therebetween.
The lead 12 is a wire (CP wire) made of a mild steel.
The diameter of the lead 12 is variable depending on the size of the electronic lead element 10. However the diameter of the lead 12 as a part of the electrolytic condenser element is generally O.lnim-lmm.
The tab 13 is an aluminum rod which has one end welded to one end 12a of the lead 12. It is generally known that the welded part 10a has hard and sharp projections as shown in
Fig. 5 and 6 as the result of weld processing.
The other free end part of the tab 13 is pressed into a form of flat plate. The flat plate is the pressed out into a predetermined shape 13a. It is generally known that fins 13b are produced along the outline of the flat plate 13a on one face thereof as the result of press out processing.
A lot of electronic lead elements formed up in the method as mentioned above are fixed to the thin leaf band 11 in such a manner that the free ends 12b of the leads 12 are fixed to the band as shown in Fig. 1. The band 11 is then transported as shown in Fig. 3 in the direction as indicated by arrow mark
E and is wound up in the direction as indicated by arrow mark
F so as to be formed as a coil of completed article.
Namely the electronic lead elements are shipped in such a coiled condition.
According to the invention, it is possible that the electronic lead elements 10 are fixed to the band 11 with a predetermined space provided therebetween before the tabs 13 are pressed into the form of flat plates 13a.
In this case, since the tabs 13 are subjected to the press processing after these are fixed to the band 11 as the extesions of the leads 12, the resulted flat plates 13a are oriented in the same direction and accordingly the faces having the fins 13b are destined to be oriented in the same direction. None of these faces will be oriented in a differect direction.
In reference to Figs. 1 and 2, the leads 12 may be fixed to the thin leaf band 11 with a predetermined space provided therebetween by a laser welding device 14 by way of example.
Then the aluminum tabs 13 are welded at one ends thereof to the ends 12a of the leads 12, and then the free end parts of the tabs are pressed into the form of flat plate 13a.
It is possible, of course, to weld the tabs 13 to the leads 12 before the leads 12 are welded to the band 11.
According to the invention, the producing operations are conducted sequentially and automatically with an extremely high efficience, the producing operations including the step for transporting the leads 12 to the thin leaf band 11, the step for welding the leads 12 to the band 11, the step for welding the aluminum tabs 13 to the leads 12, the step for pressing the tabs 13 into the form of flat plate 13a and the step for winding up the band into the form of coil.
As shown in Fig. 3, since the electronic lead elements 10 are wound up into the form of coil, the treatment and transportation of these elements 10 are very easy and convenient when compared with those of the conventional ways wherein the individual electronic elements are put together in containers.
According to the invention, it is apparent that the electronic lead elements 10 are prevented from being twisted and/or bended.
Additionally the electronic lead elements 10 may be easily and rapidly washed and subjected to a chemical treatment.
Further according to the invention, the band 11 having the electronic lead elements 10 attached thereto is put into engagement with sprockets (not shown) by means of the feeding openings Ila and is then transported to a tab welding device which is a part of a condenser producing apparatus (not shown) and then the lead elements 10 are cut off from the band 11 and then the faces of flat plates 13a are contacted to an aluminum foil 20 and are then fixed to the aluminum foil by applying a mechanical pressure. These operations are sequentially and automatically conducted.
According to the invention, since the sprockets are employed to transport the band having the lead elements 10 attached thereto, the lead elements 10 will not give damages to the transporting device which may otherwise be damaged in the case of the conventional parts feeder such as the whirpool type feeder. Thus the parts feeder employed in this invention will long durable and smoothly transport the lead elements 10 to the tab welding device.
Further as shown in Fig. 4, it is to be noted that the tabs 13 are contacted to the aluminum foil 20 in such a manner that the faces of flat plates 13a having no fins 13b are destined to contact the aluminum foil 20 because the lead elements 10 are transported in the condition that the faces of flat plates 13a having the fins 13b are oriented in the same direction. It is therefore apparent that the aluminum foil 20 will not be damaged by the fins 13b when the mechanical pressure is applied to attach the tabs 13 to the aluminum foil 20.
In this embodiment, the thin leaf band 11 is described as stainless steel plate. This band may however be one of other kinds such as a brass plate, a copper plate, a berillium plate, a mild steel plate or a synthetic resin plate. Further the method for fixing the leads to the band may be the one by employing adhesives instead of employing the welding method.
Now in reference to Figs. 7-10, another embodiment of the invention will be described. In this embodiment the thin leaf band is different from the band of the first embodiment in its configuration.
Therefore as to the thin leaf band, the description will be made with different reference numerals while the reference numerals of the other elements are not changed from those of the first embodiment.
Compared with the band 11 of the first embodiment formed with the opposite lateral edges extended in parallel with straight lines, the band 110 of the second embodiment is pressed out of a thin leaf sheet 100 with recesses 110b and projections 110c provided thereon with a predetermined space provided therebetween in a oppositely aligned relation. Further the band 110 is formed with feeding openings 110a with a predetermined space provided therebetween together with the recesses 110b and the projections 110c as shown in Figs. 9 and 10.
The areas and shapes of the recesses 110b and pojections 110c are of a same dimension. The band 110 is of width 5mm by way of example, and the projections 110c are of lateral width approximately lmm which is slightly wider than the diameter of the leads 12 of the electronic lead elements 10 which is 0.lmm-lmm as mentioned hereinbefore.
The leads 12 are welded at the end parts 12b thereof to the projections 110c of the band 110 after or before the tabs 13 are welded to the opposite ends 12a of the leads 12 by means of the laser welding device 14 by way of example. Then the band 110 is wound up into a coil in the same manner as mentioned in reference to the first embodiment.
According to this embodiment, since the heat produced by the weld processing is limited on it to the projections 110c of the band 110, the band 110 will not strained or deformed by the heat.
The invention has been disclosed in reference to the preferred embodiments. But the various modifications and adaptations may be possible from this invention. Such modifications and adaptations will however not depart from the spirit of the invention and from the scope of the claims of the invention as follows.
Claims (18)
1. A set of electronic lead elements wound up in to a form of coil of a thin leaf band, said electronic lead elements composed of leads and aluminum tabs respectively, said aluminum tabs having one end welded to one end of said leads respectively and having the other ends flattened and said leads having the other ends fixed to said band with a predetermined space provided therebetween.
2. A method for producing a set of electronic lead elements comprising the steps for fixing one end of a plurality of electronic lead elements to a thin leaf band with a predetermined space provided therebetween and then for welding one end o aluminum rabs tc the other end of said leads respectively and then for flattening the other ends of said aluminum tabs.
3. A method for producing a set of electronic lead elements comprising the steps for fixing one ends of a plurality of leads to a thin leaf band with a predetermined space provided therebetween, said leads having one ends of aluminum tabs welded to the other ends thereof respectively and then for flattening the other ends of said aluminum tabs.
4. A method for producing a set of electronic lead elements comprising the steps for fixing one ends of leads to a thin leaf band having a plurality of feeding openings arranged thereon with a predetermined space provided therebetween and then for welding one ends of aluminum tabs to the other ends of said leads respectively and then for flattening the other ends of said aluminum tabs.
5. A method for producing a set of electronic lead elements comprising the steps for fixing one ends of leads to a thin leaf band having a plurality of feeding openings arranged thereon with a predetermined space provided therebetween, said leads having one ends of aluminum tabs welded to the other ends thereof and for flattening the other ends of said aluminum tabs.
6. Set of electronic lead elements wound up in a form of coil of a thin leaf band, said electronic lead elements being composed of leads and aluminum tabs respectively, said aluminum tabs having one ends welded to one ends of said leads respectively and having the other ends flattened and said leads having the other ends welded to said band with a predetermined space provided therebetween.
7. A method for producing a set of electronic lead elements comprising the steps for welding one ends of a plurality of leads to a thin metal leaf band with a predetermined space provided therebetween and then for welding one ends of aluminum tabs to the other ends of said leads respectively and then for flattening the other ends of said aluminum tabs.
8. A method for producing a set of electronic lead elements comprising the steps for welding one ends of a plurality of leads to a thin metal leaf band, said leads having one ends of aluminum tabs welded thereto respectively and then for flattening the other ends of said aluminum tabs.
9. The set of electronic lead elements as set forth in claim 1 wherein said thin leaf band has opposite straight edges laterally extended in parallel.
10. The method for producing a set of electronic lead elements as set forth in one of claims 2-5 wherein said thin leaf band has opposite straight edges laterally extended in parallel.
11. The set of electronic lead elements as set forth in claim 6 wherein said thin metal leaf band has opposite edges laterally extended in parallel.
12. The method for producing a set of electronic lead elements as set forth in one of claims 7 and 8 wherein said thin metal leaf band has opposite edges laterally extended in parallel.
13. A set of electronic lead elements wound up in a form of coil of a thin leaf band which has a series of projections formed on one side thereof with a predetermined space provided therebetween, said electronic lead elements being composed of leads and aluminum tabs respectively, said aluminum tabs having one ends welded to one ends of said leads respectively and having the other ends flattened and said leads having the other ends fixed to said projections of said band respectively.
14. A method for producing a set of electronic lead elements comprising the steps for welding one ends of aluminum tabs to one ends of leads respectively and then for flattening the other ends of said aluminum tabs and then for fixing the other ends of said leads to a series of projections of a thin leaf band respectively, said series of projections being formed on one side of said band with a predetermined space provided therebetween.
15. A set of electronic lead elements wound up into a form of coil of a thin leaf band which has a series of projections formed on one side thereof with a predetermined space provided therebetween, said electronic lead elements being composed of leads and aluminum tabs respectively, said aluminum tabs having one ends welded to one ends of said leads and having the other ends flattened and said leads having the other ends welded to said projections of said band respectively.
16. A method for producing a set of electronic lead elements comprising the steps for welding one ends of aluminum tabs to one ends of leads and then for flattening the other ends of said aluminum tabs and then for welding the other ends of said leads to a series of projections of said band respectively, said series of projections being formed on one side of said band with a predetermined space provided therebetween.
17. The set of electronic lead elements as set forth in one of claims 13 and 15, wherein said thin leaf band is made of a metal sheet.
18. The method for producing a set of electronic lead elements as set forth in one of claims 14 and 16, wherein said thin leaf band is made of a metal sheet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5227923A JPH0757979A (en) | 1993-08-19 | 1993-08-19 | Lead wire of electronic device and manufacturing method and apparatus therefor |
| JP6135107A JPH07320990A (en) | 1994-05-25 | 1994-05-25 | Lead wire for electronic parts and method and device for manufacturing it |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9416190D0 GB9416190D0 (en) | 1994-09-28 |
| GB2282089A true GB2282089A (en) | 1995-03-29 |
| GB2282089B GB2282089B (en) | 1996-08-28 |
Family
ID=26469043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9416190A Expired - Fee Related GB2282089B (en) | 1993-08-19 | 1994-08-10 | Electronic lead elements and the production method thereof |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR950007218A (en) |
| CN (2) | CN1054229C (en) |
| GB (1) | GB2282089B (en) |
| MY (1) | MY111294A (en) |
| TW (2) | TW326540B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH701973A1 (en) * | 2009-10-12 | 2011-04-15 | Polycontact Ag | Creating an electric connection between a contact plate of an electromechanic switch, and a stranded wire on a power supply and/or signaling line, comprises electrical conductively connecting together the plate and the stranded wire |
| US20110151271A1 (en) * | 2008-07-10 | 2011-06-23 | Shiloh Industries, Inc. | Metal forming process and welded coil assembly |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896000A (en) * | 2018-08-24 | 2020-03-20 | 东莞市成东电子科技有限公司 | Welding process of thin film capacitor |
| CN112768247B (en) * | 2021-01-29 | 2022-03-08 | 南通三华电子工业有限公司 | Aluminum electrolytic capacitor lead-out wire and production equipment thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2011192A (en) * | 1977-12-27 | 1979-07-04 | Beckman Instruments Inc | Carrier strip for round lead pins and method for making same |
| GB2041256A (en) * | 1979-01-24 | 1980-09-10 | Bicc Burndy Ltd | Improvements in or relating to electric wiring harness |
| GB2057311A (en) * | 1979-08-31 | 1981-04-01 | Plessey Co Ltd | Making electrical connectors |
| GB2069377A (en) * | 1980-02-16 | 1981-08-26 | Plessey Co Ltd | Manufacture of carrier strip for electrical contact members |
| JPH023252A (en) * | 1988-01-05 | 1990-01-08 | Thomson Csf | Electric charge reproducer for charge transfer device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69119381T2 (en) * | 1990-12-21 | 1996-11-14 | Whitaker Corp | Procedure for attaching a connector to a circuit element and solder connection frame therefor |
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1994
- 1994-08-10 GB GB9416190A patent/GB2282089B/en not_active Expired - Fee Related
- 1994-08-15 TW TW086104659A patent/TW326540B/en active
- 1994-08-15 TW TW086214740U patent/TW383895U/en not_active IP Right Cessation
- 1994-08-15 MY MYPI94002131A patent/MY111294A/en unknown
- 1994-08-19 KR KR1019940020468A patent/KR950007218A/en not_active Application Discontinuation
- 1994-08-19 CN CN94116819A patent/CN1054229C/en not_active Expired - Fee Related
-
1998
- 1998-11-23 CN CN98122815A patent/CN1096086C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2011192A (en) * | 1977-12-27 | 1979-07-04 | Beckman Instruments Inc | Carrier strip for round lead pins and method for making same |
| GB2041256A (en) * | 1979-01-24 | 1980-09-10 | Bicc Burndy Ltd | Improvements in or relating to electric wiring harness |
| GB2057311A (en) * | 1979-08-31 | 1981-04-01 | Plessey Co Ltd | Making electrical connectors |
| GB2069377A (en) * | 1980-02-16 | 1981-08-26 | Plessey Co Ltd | Manufacture of carrier strip for electrical contact members |
| JPH023252A (en) * | 1988-01-05 | 1990-01-08 | Thomson Csf | Electric charge reproducer for charge transfer device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110151271A1 (en) * | 2008-07-10 | 2011-06-23 | Shiloh Industries, Inc. | Metal forming process and welded coil assembly |
| CH701973A1 (en) * | 2009-10-12 | 2011-04-15 | Polycontact Ag | Creating an electric connection between a contact plate of an electromechanic switch, and a stranded wire on a power supply and/or signaling line, comprises electrical conductively connecting together the plate and the stranded wire |
Also Published As
| Publication number | Publication date |
|---|---|
| KR950007218A (en) | 1995-03-21 |
| CN1109998A (en) | 1995-10-11 |
| CN1096086C (en) | 2002-12-11 |
| TW383895U (en) | 2000-03-01 |
| MY111294A (en) | 1999-10-30 |
| CN1054229C (en) | 2000-07-05 |
| TW326540B (en) | 1998-02-11 |
| GB9416190D0 (en) | 1994-09-28 |
| GB2282089B (en) | 1996-08-28 |
| CN1222742A (en) | 1999-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20040810 |