GB2277526A - Electroconductive paste for forming a solderable coating film - Google Patents
Electroconductive paste for forming a solderable coating film Download PDFInfo
- Publication number
- GB2277526A GB2277526A GB9406711A GB9406711A GB2277526A GB 2277526 A GB2277526 A GB 2277526A GB 9406711 A GB9406711 A GB 9406711A GB 9406711 A GB9406711 A GB 9406711A GB 2277526 A GB2277526 A GB 2277526A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- electroconductive
- electroconductive filler
- coating film
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
- C09D167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
An electroconductive paste for forming a coating film that can be soldered and screen-printed to form printed circuit boards comprises 60 to 80 vol% electroconductive filler, preferably spherical silver powder, in a binder resin containing a thermoplastic resin, preferably a saturated polyester resin. Further, 10 to 1 wt% of the foregoing thermoplastic resin may be replaced by a crosslinker or a thermosetting resin.
Description
ELECTROCONDUCTIVE PASTE FOR FORMING A SOLDERABLE COATING
FILM
The present invention relates to an electroconductive paste for use in manufacturing low-cost printed circuit boards that can be soldered so that the electroconductive paste is screen-printed to form a circuit.
In the field of printed circuit boards, solderable coating films have been mainly formed by screen-printing an electroconductive paste. The electroconductive paste has been formed into the paste by mixing and dispersing an electroconductive filler, such as silver powder or copper powder, a binder resin composed of a thermosetting resin, a solvent for adjusting the printing characteristics and additives. The electroconductive paste has been printed on a resinlaminated or plastic film substrate by screen printing, and has been sufficiently dried and heated to remove the solvent and harden the thermosetting resin, which is the binder resin, to obtain a circuit pattern of a thin and solidified film.
As a combination of a binder resin and an electroconductive filler in a typical and conventional electroconductive paste, there has been used a combination of an epoxy resin and copper powder, the epoxy resin and silver powder, a phenol resin and silver-coated copper powder, and the phenol resin and silver powder.
However, in such conventional electroconductive paste using, as the binder resin, the epoxy or phenol thermosetting resin, it has been difficult to raise the content of the electroconductive filler in the formed coating film. As a result, the surface of the electroconductive filler is covered with the layer of the thermosetting resin, thus raising a problem in that socalled wettability of the solder is insufficient, the solder cannot easily adhere, and accordingly the reliability of the solder is unsatisfactory.
The reason why the fact that the binder resin is the thermosetting resin results in difficulty in raising the content of the electroconductive filler can be considered as follows: the electroconductive filler must possess screen printability, that is, viscosity ranging from 60 to 300 poise and adequate thixotropic flow characteristics. Important factors affecting the foregoing printability, that is, the viscosity and the flow characteristics, are the viscosity of the binder resin, the type and the quantity of the solvent, and the type and the quantity of the electroconductive filler.
Although a variety of additives are used to adjust the printability, it is basically necessary to adequately select and combine the foregoing factors. The hardening resin is so designed as to have a large molecular weight after hardening and to three-dimensionally crosslink.
Since the molecular weight of the resin is small (as compared with the thermoplastic resin according to the present invention) before the resin is hardened, that is, when the resin is in the material state, the resin component in a resin solution (that is, the concentration of the solid component) is high in a case where the resin solution having a constant viscosity is prepared by adding a solvent. When the electroconductive filler is dispersed to adjust the viscosity to a range adaptable to screen printing, the concentrate solid component in the resin solution inevitably raises the concentration of the solid component in the electroconductive paste. The content of the electroconductive filler in the solid component, in a case where the thermosetting resin is used as the binder resin, is 50 vol% or lower. Although it might be considered feasible to employ a method in which the quantity of the solvent is enlarged to lower the concentration of the solid component in the resin solution and simultaneously the viscosity is lowered in order to enlarge the quantity of the electroconductive filler, lowering of the viscosity of the resin solution results in sedimentation of the electroconductive filler. Therefore, the state where the electroconductive filler is dispersed cannot be maintained.
Since the content of the electroconductive filler is only 50 vol% in the formed coating film (the solid component) in the case where the hardening resin is used as the binder resin, the electroconductive filler is surrounded by the layer of the thermosetting resin.
Moreover, a considerably thick layer is formed on the electroconductive filler adjacent to the surface of the coating film. Therefore, the solder cannot easily be brought into contact with the electroconductive filler.
Since the content of the electroconductive filler in the solid component cannot be raised, the type of the electroconductive filler is limited. That is, the impossibility of raising the content of the electroconductive filler causes a tendency of intensifying the specific resistance of the coating film to be formed into the electric line for forming a circuit. As a result, there arises a necessity of using, for example, flake-shape silver powder which weakens the specific resistance of the coating film with the same content.
However, the flake-shape silver powder has a problem that denudation of solder takes place easily. Therefore, uses of electroconductive pastes of a type having strong specific resistance are limited.
Accordingly, an object of the present invention is to provide an electroconductive paste capable of overcoming the problems experienced with the conventional technology, enabling a coating film to be formed, which exhibits a large content of an electroconductive filler, which has good electroconductivity and wettability of solder, and which exhibits satisfactory printability.
In order to overcome the foregoing problem, the present invention is characterized in the structure of an electroconductive paste for forming a coating film arranged such that 60 to 80 vol% electroconductive filler is contained in a binder resin containing a thermoplastic resin, typically a thermoplastic polyester resin.
In order to improve heat resistance while maintaining the foregoing wettability of solder, the printability and the electroconductivity at satisfactory conditions, a structure is employed in place of the foregoing structure arranged such that the binder resin is composed of a mixture of a thermoplastic resin and 10 wt% or less of a hardening resin, and 60 to 80 vol% electroconductive filler is contained in the binder resin.
Embodiments of the present invention have the above structure, specifically the structure that the thermoplastic resin is used as the binder resin, so that the content of the electroconductive filler in the coating film formed by using the electroconductive filler can significantly be enlarged to 60 wt% or more. Therefore, the surface of the filler positioned on the surface of the coating film is not covered with a relatively thick and strong resin film. Even if somewhat resin film exists, the resin is softened with the heat generated at the time of performing the soldering operation. As a result, the contact between the solder and the electroconductive filler can easily be realized, resulting in improved wettability. Simultaneously, the electroconductivity of the coating film is ameliorated. Since the content of the electroconductive filler is made to be 80 wt% or lower, the printability can be satisfactorily maintained. The latter structure, specifically the structure such that 10 wt% or less portion of the binder is replaced by the hardening resin, enables the heat resistance to be improved with the effects of the former structure substantially maintained.
As the binder resin, a thermoplastic polyester resin, which is soluble in a solvent, is used. An acid component of the polyester resin is terephthalic acid, isophthalic acid, adipic acid, sebacic acid, eicosanoic acid, caprolactone, trimellitic acid or naphthalenedicarboxylic acid. A glycol component is ethylene glycol, propane diol, 1,4-butanediol, 1,6hexanediol, diethyleneglycol, neopentyl glycol, polyethylene glycol, polytetramethylene glycol, trimethylol propane or bisphenol A dietylene glycol.
Their copolymer having a melt viscosity of 2900 poise or higher at 2000C and a glass transition point of 650C or higher can be used, preferably 900C or higher. If the melt viscosity is low, a large quantity of the solvent is not required to prepare the resin solution having constant viscosity. Therefore, the content of the electroconductive filler in the solid component of the electroconductive paste cannot be raised. If the glass transition point is lower than 650C, heat resisting characteristics of internal cohesive force of the solid substances in the electroconductive paste are unsatisfactory to be used practicably.
As a sub-component of the binder resin, a crosslinker or a hardening resin may be used. As the crosslinker, a block substance, such as toluene diisocyanate or diphenylmethane di-isocyanate, or a metal complex, such as iron-acetylacetonate complex, nickel acetyl acetonate complex, copper acetylacetonate complex or copper-8 oxyquinoline complex is used. As the hardening resin, a melamine or epoxy resin is used. If the hardening resin is blended by 10% or more, the wettability of solder deteriorates.
As the solvent, methylethylketone, cellosolve acetate, butylcellosolve acetate, carbitol acetate or isophorone or their mixture is used.
As the electroconductive filler, silver powder, silver-plated copper powder, silver-coated copper powder or silver/copper alloy powder is used. At least 70% of the electroconductive filler is made of metal powder having a particle size of 1 to 10 ym, preferably 2 to 5 pm, and formed into a spherical shape as accurate as possible. The spherical shape is preferable since the sphere has the minimum specific surface area and therefore results in that the content can be raised. If the particle size is less than 1 pm, the influence of the denudation of solder becomes critical. If the particle size is larger than 10 Mm, sedimentation in the electroconductive paste easily takes place and screen printing cannot easily be performed. Moreover, electroconductivity of the coating film is unsatisfactory.
The spherical powder forming the electroconductive filler may be, in a quantity of less than 30%, replaced with flake powder or branch-form powder having a particle size of 0.1 to 10 m or small spherical powder having a particle size of 1 m of less. If the flake powder or the branch-form powder is used in place of the spherical powder, the influence of the denudation of solder becomes critical.
If the content of the electroconductive filler in the solid component is less than 60%, the electroconductivity deteriorates excessively. If it exceeds 80%, the flow characteristics of the electroconductive paste are made to be dilatancy, and therefore such material is not adaptable to screen printing.
In addition to the foregoing materials, additives may be added, such as a coupling agent for intensifying the interface strength between the binder resin and the electroconductive filler, such as a silane coupling agent or titanate-type coupling agent, a dispersant for aiding the dispersion of the electroconductive filler in the paste, and a thioxotropy enhancing agent for improving the printability.
Examples 1 to 7
As the binder resin, saturated polyester resin ("Kemitt K-1294" manufactured by Toray, melt viscosity: 4300 poise, glass transition point: 670C) was, while being heated, dissolved in carbitol acetate which was a solvent, so that a resin solution was prepared. As the electroconductive filler, spherical silver powder having a particle size of 2 to 3 ym was mixed so that its blending ratio was varied in each example, and dispersed with a three-roll mill, so that electroconductive pastes were obtained. Then, the electroconductive paste was screenprinted on a paper-phenol laminated plate and heated to remove the solvent, so that a printed circuit board was obtained. The difference in the viscosity of the electroconductive paste occurring due to the difference in the blending ratio of the electroconductive filler was adjusted by previously changing the quantity of the solvent and the quantities of the additives. The results of evaluation of the examples about the content of the electroconductive filler in the solid component, the printability, the wettability of solder and the electroconductivity were as follows. Experimental examples having the content of silver powder in the solid component thereof deviated from the range employed in the examples encountered problems in particle use.
Table 1 shows the experimental results for examples 1 to 7 as follows:
Content of Printability Wettability Electroconductivity Silver Powder of Solder Specific Resistivity in Solid (*cm) Component (volt) Example 1 60 Excellent Good 6.7 x 10-4 2 63 Excellent Excellent 2.6 x 10-4 3 67 Excellent Excellent 2.3 x 10 4 70 Excellent Excellent 1.6 x 10-4 5 73 Excellent Excellent 1.1 x 10-4 6 78 Good Excellent 0.8 x 10 7 80 Allowable Excellent 0.8 x 10 Experimental Example 1 57 Excellent Unsatisfactory 3.2 x 10-3 2 83 Printinq was Evaluation was - imoossible impossible Use of the saturated polyester resin as the binder resin realized excellent wettability of solder and printability and satisfactory electroconductivity while making the content of the electroconductive filler to be in a high range such that the content of the silver powder in the solid component ranged from 60 to 80%.
Examples 8 and 9
The binder resin according to Example 4 was changed, and the strength of the adhesivity of the soldered portion was measured after the soldering process.
A sample according to Example 8 was prepared by the same method as that according to Example 4 except the binder resin, which was a saturated polyester resin, the glass transition point of which was 350C and the melt viscosity of which was 7000 poise. A sample according to Example 9 was prepared by the same method as that according to
Example 4 except the binder resin which was a saturated polyester resin, the glass transition point of which was 940C and the melt viscosity of which was 13000 poise. The thus-prepared samples were brought into contact with molten solder of 2600C for three seconds, and they were subject to heat history of 700C for 30 minutes and -300C for 30 minutes. Then, the force required for the soldered portion to be separated from a substrate was measured.
The sample according to Example 4 was subjected to the same experiment for comparison.
Glass Transition Force to Separate the Soldered Point Portion (kg) (Tg, OC) Eeary Stage After Heat History Example 8 35 7.71 Natural separation took place at an intermediate moment in the heat history 4 67 9.42 5.20 9 94 9.21 9.18 It was found that the heat resistance is unsatisfactory if the glass transition point is low, resulting in that the soldered portion is separated depending upon the conditions of the environment of reservation.
Examples 10 to 13
Evaluations were made in this way that a portion of the binder resin according to Example 3 was replaced with a melamine resin ("Sumimal M-100" manufactured by
Sumitomo Kagaku Kogyo) which was a hardening resin or with an epoxy resin ("Tactics 785" manufactured by Dow
Chemicals). The results were as follows:
Hardening Ratio of Wettability Electroconductivity Resin Hardening of Solder Specific Type Resin (%) Resistivity (fl.cm) Example 10 Melamine 0.7 Excellent 2.1 x 10-4 11 Melamine 1.3 Excellent 2.3 x 10-4 12 Melamine 2.0 Good 2.9 x 10 -4 13 Epoxy 8.3 Good 1.6 x 10-4 Experimental Example 3 Epoxy 16.7 Unsatisfactory 3.3 x 10-4 4 Epoxy was Solder was not 3.4 x 10-4 wetted 5 Epoxy 33.3 Solder was not 4.0 x 10-4 wetted The replacement of the portion of the binder resin (the saturated polyester resin) with the hardening resin results in an improvement in the heat resistance.
However, if the quantity is 10% or more of the binder resin, the wettability of solder deteriorates.
Examrles 14 to 17
A portion of the spherical silver powder, which was the electroconductive filler according to Example 2, was replaced with flake silver powder (TCG-7 manufactured by Tokuriki Kagaku). The results of evaluations were as follows:
Ratio of Wettability of Solder Electroconductivity Flake Specific Resistivity Silver (fl.cm) Powder (*) Example 14 10 Excellent 1.5 x 10 15 20 Excellent 1.2 x 10 16 30 Excellent 9.0 x 10 17 40 Good but denudation of solder took place 7.0 x 10 I Although the electroconductivity is improved if the portion of the electroconductive filler is replaced with the flake silver powder, denudation of solder takes place if the ratio exceed 30%.
Comparative examples
Electroconductive pastes each using commercial thermosetting resin were similarly evaluated.
Manufacturers and part nos according to comparative examples.
Comparative Example 1 Asahi Kasei, GPC-6593
2 Mitsui Kinzoku Kogyo, S-5000
3 Kyoto Elecs, DD-1610A-5
4 Asahi Kagaku, ACP-055-AE
5 Sinto-Chemitron, K-3424
Material of component of comparative example The content of the electroconductive filler in the solid substances according to comparative examples was 50 vol% or less.
Binder Resin Electroconductive Filler Comparative Example 1 Phenol Resin Silver/Copper Gradient Alloy Powder 2 Phenol Resin Silver-Coated Copper Powder 3 Phenol Resin Silver Powder 4 Epoxy Resin Copper Powder 5 Epoxy Resin Silver Powder Results of evaluations of the comparative examples
Printability Wettability Electroconductivity of Solder Specific Resistivity (n.cm) Comparative Good Solder was not 1.9 x 10 Example 1 wetted 2 Good Good 7.8 x 10-4 3 Good Good, but 8.2 x denudation of silver took place 4 Good Solder was not 5.3 x 10-3 5 | Good Good, but 1.3 x denudation of silver took place Although the aforesaid examples have been descried in a way that the saturated polyester resin was employed as the representative of the thermoplastic resin, replacement of the same with another thermoplastic resin that can be considered from the viewpoints of the operation and effects of the present invention is, of course, permitted. Also the hardening resin for use in place of the thermoplastic resin may be replaced adequately. Although only the silver powder has been described as the electroconductive filler, substitution of another material such as silver-coated copper powder or silver/copper alloy for the silver powder is permitted.
Since the content of a filler having intense oxidization characteristics such as copper powder can be raised, it is apparent that such a filler produces an effect of improving the wettability of solder and the like.
The present invention has the former structure, specifically the structure that the thermoplastic resin is used as the binder resin, so that the content of the electroconductive filler in the coating film formed by using the electroconductive filler can significantly be enlarged to 60 wt% or more. Therefore, the surface of the filler positioned on the surface of the coating film is not covered with a relatively thick and strong resin film.
Even if somewhat resin film exists, the resin is softened with the heat generated at the time of performing the soldering operation. As a result, the contact between the solder and the electroconductive filler can easily be realized, resulting in that the wettability is improved.
Simultaneously, the electroconductivity of the coating film is ameliorated. Since the content of the electroconductive filler is made to be 80 wt% or lower, the printability can be maintained satisfactorily. The latter structure, specifically the structure such that 10 wt% or less portion of the binder is replaced by the hardening resin, enables the heat resistance to be improved with the effects of the former structure substantially maintained.
Claims (4)
1. An electroconductive paste for forming a coating film that can be soldered, wherein 60 to 80 vol% electroconductive filler is contained in a binder resin containing a thermoplastic resin.
2. An electroconductive paste as claimed in Claim 1, wherein said thermoplastic resin is a thermoplastic polyester resin.
3. An electroconductive paste as claimed in Claim 1 or Claim 2, wherein the binder resin is composed of 90 to 99 wt% thermoplastic resin and 10 to 1 wt% crosslinker or a thermosetting resin.
4. An electroconductive paste substantially as hereinbefore described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5101975A JP2965815B2 (en) | 1993-04-05 | 1993-04-05 | Solderable conductive paste for film formation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9406711D0 GB9406711D0 (en) | 1994-05-25 |
| GB2277526A true GB2277526A (en) | 1994-11-02 |
| GB2277526B GB2277526B (en) | 1996-07-17 |
Family
ID=14314874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9406711A Expired - Fee Related GB2277526B (en) | 1993-04-05 | 1994-04-05 | Electroconductive paste for forming a solderable coating film |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2965815B2 (en) |
| GB (1) | GB2277526B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0805616A1 (en) * | 1996-05-03 | 1997-11-05 | International Business Machines Corporation | Electrically conductive compositions |
| US5866044A (en) * | 1994-11-15 | 1999-02-02 | International Business Machines | Lead free conductive composites for electrical interconnections |
| CN101350233B (en) * | 2007-07-18 | 2011-11-02 | 太阳控股株式会社 | Conductive paste, light-permeable conductive film using the paste, and manufacturing method of the light-permeable conductive film |
| WO2016012753A1 (en) * | 2014-07-22 | 2016-01-28 | Alpha Metals, Inc. | Stretchable interconnects for flexible electronic surfaces |
| EP3270386A1 (en) * | 2016-07-11 | 2018-01-17 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition for use as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4000655B2 (en) * | 1998-02-26 | 2007-10-31 | 日立化成工業株式会社 | Film-like adhesive for circuit connection, circuit board and IC card |
| JP4815719B2 (en) * | 2001-08-27 | 2011-11-16 | 東洋紡績株式会社 | Conductive paste and printed wiring board |
| JP2006059720A (en) * | 2004-08-20 | 2006-03-02 | Sony Corp | Conductive paste and touch panel |
| JP4522939B2 (en) * | 2005-10-31 | 2010-08-11 | アルプス電気株式会社 | Bonding structure between substrate and component and manufacturing method thereof |
| KR20070084918A (en) * | 2006-02-22 | 2007-08-27 | 삼성에스디아이 주식회사 | A composition for preparing an electron emitter, the electron emitter prepared using the composition, an electron emission device comprising the electron emitter, and a method for preparing the electron emitter |
| JP5255792B2 (en) * | 2007-07-18 | 2013-08-07 | 太陽ホールディングス株式会社 | Conductive paste composition, translucent conductive film using the composition, and method for producing the same |
| JP5177027B2 (en) * | 2009-03-12 | 2013-04-03 | 日本電気株式会社 | Electrode pad manufacturing method, circuit wiring body including electrode pad and manufacturing method thereof, solder joint structure using the electrode pad, and method thereof |
| EP2431438B1 (en) | 2010-09-20 | 2012-11-28 | Henkel AG & Co. KGaA | Electrically conductive adhesives |
| CN104751942B (en) * | 2015-04-23 | 2016-11-30 | 江苏欧耐尔新型材料有限公司 | Solaode fine rule silk screen printing unleaded electrocondution slurry and preparation method thereof |
| CN104867537B (en) * | 2015-04-23 | 2017-03-01 | 江苏欧耐尔新型材料有限公司 | Low lead high square resistance silicon solar cell front silver electrode paste and preparation method thereof |
| CN111148586B (en) * | 2017-09-27 | 2022-12-02 | 同和电子科技有限公司 | Silver powder mixture, method for producing same, and conductive paste |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1375793A (en) * | 1971-02-03 | 1974-11-27 | ||
| GB1519298A (en) * | 1974-09-27 | 1978-07-26 | Gen Electric | Radiation curable inks |
| WO1991019297A1 (en) * | 1990-06-05 | 1991-12-12 | Asea Brown Boveri Ab | Method of manufacturing an electrical device |
-
1993
- 1993-04-05 JP JP5101975A patent/JP2965815B2/en not_active Expired - Lifetime
-
1994
- 1994-04-05 GB GB9406711A patent/GB2277526B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1375793A (en) * | 1971-02-03 | 1974-11-27 | ||
| GB1519298A (en) * | 1974-09-27 | 1978-07-26 | Gen Electric | Radiation curable inks |
| WO1991019297A1 (en) * | 1990-06-05 | 1991-12-12 | Asea Brown Boveri Ab | Method of manufacturing an electrical device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5866044A (en) * | 1994-11-15 | 1999-02-02 | International Business Machines | Lead free conductive composites for electrical interconnections |
| US6197222B1 (en) | 1994-11-15 | 2001-03-06 | International Business Machines Corporation | Lead free conductive composites for electrical interconnections |
| EP0805616A1 (en) * | 1996-05-03 | 1997-11-05 | International Business Machines Corporation | Electrically conductive compositions |
| CN101350233B (en) * | 2007-07-18 | 2011-11-02 | 太阳控股株式会社 | Conductive paste, light-permeable conductive film using the paste, and manufacturing method of the light-permeable conductive film |
| WO2016012753A1 (en) * | 2014-07-22 | 2016-01-28 | Alpha Metals, Inc. | Stretchable interconnects for flexible electronic surfaces |
| CN106663494A (en) * | 2014-07-22 | 2017-05-10 | 阿尔法装配解决方案公司 | Stretchable interconnects for flexible electronic surfaces |
| CN106663494B (en) * | 2014-07-22 | 2018-11-30 | 阿尔法装配解决方案公司 | Stretchable interconnection for flexible electrical component surface |
| US10672531B2 (en) | 2014-07-22 | 2020-06-02 | Alpha Assembly Solutions Inc. | Stretchable interconnects for flexible electronic surfaces |
| US11139089B2 (en) | 2014-07-22 | 2021-10-05 | Alpha Assembly Solutions Inc. | Stretchable interconnects for flexible electronic surfaces |
| US11830640B2 (en) | 2014-07-22 | 2023-11-28 | Alpha Assembly Solutions, Inc. | Stretchable interconnects for flexible electronic surfaces |
| EP3270386A1 (en) * | 2016-07-11 | 2018-01-17 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition for use as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells |
| WO2018010884A1 (en) * | 2016-07-11 | 2018-01-18 | Heraeus Deutschland GmbH & Co. KG | Electronically conductive composition for use an electronically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9406711D0 (en) | 1994-05-25 |
| GB2277526B (en) | 1996-07-17 |
| JPH06295616A (en) | 1994-10-21 |
| JP2965815B2 (en) | 1999-10-18 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090405 |