GB2273831A - Overvoltage protection circuit; electrostatic discharge protection - Google Patents

Overvoltage protection circuit; electrostatic discharge protection Download PDF

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Publication number
GB2273831A
GB2273831A GB9226989A GB9226989A GB2273831A GB 2273831 A GB2273831 A GB 2273831A GB 9226989 A GB9226989 A GB 9226989A GB 9226989 A GB9226989 A GB 9226989A GB 2273831 A GB2273831 A GB 2273831A
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GB
United Kingdom
Prior art keywords
transistor
input terminal
circuit
coupled
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9226989A
Other versions
GB2273831B (en
GB9226989D0 (en
Inventor
Jo Hamid
Francois Mackre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Freescale Semiconducteurs France SAS
Original Assignee
Motorola Semiconducteurs SA
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Publication date
Application filed by Motorola Semiconducteurs SA filed Critical Motorola Semiconducteurs SA
Priority to GB9226989A priority Critical patent/GB2273831B/en
Publication of GB9226989D0 publication Critical patent/GB9226989D0/en
Publication of GB2273831A publication Critical patent/GB2273831A/en
Application granted granted Critical
Publication of GB2273831B publication Critical patent/GB2273831B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

The protection circuit 8 has first and second input terminals 10, 11 connected to the operating power supply voltage of a user device 9 and to ground respectively, and a terminal 12 receiving an input signal voltage of varying magnitude and connected to an output terminal 13 via a node 14. A diode 15 is connected between input terminals 10, 11, a MOSFET 16 has drain and source electrodes 17, 18 coupled to node 14 and terminal 10 respectively, and a bipolar transistor 20 has its emitter 21 and collector 22 coupled to node 14 and terminal 11 respectively with its base 23 coupled to N-well substrate 24 of MOSFET 16. The transistors 16, 20 and the diode 15 provide conduction paths in the event of excess voltage occurring at the signal input terminal 12 and so provide voltage protection at the output terminal 13. The circuit 8 may be constructed from a low number of components on a single integrated circuit, the transistor 20 being formed as a parasitic element of the MOSFET 16, and the diode 15 being formed by the N-well 24 of the MOSFET 16. <IMAGE>

Description

VOLTAGE PROTECTION CIRCUIT FIELD OF THE INVENTION This invention relates to voltage protection circuits, and particularly to circuits for protecting devices from electrostatic discharge.
BACKGROUND OF THE INVENTION A voltage protection circuit may be used to safeguard a connected user device against electrostatic discharges (ESDs) associated with input signals to the device. Such protection circuits exist which can protect against both positive and negative polarity ESDs.
A simple diode arrangement coupled between supply lines and the device input terminals may be used to prevent signals which are higher than the supply voltage (VDD) or lower than the ground reference voltage from reaching the input terminals of the user device. However, in some devices, such as those adhering to the well known RS232 and RS422 specifications, the input signal of the device may, during normal operation, exceed the envelope bounded by the supply voltage and the ground reference voltage (in the case of RS422, the input signal may reach a voltage 10 volts higher or lower than the boundary of the aforementioned envelope).
For such devices, a protection circuit is required which will allow the input signal voltage to exceed the above defined envelope whilst continuing to protect the device from ESDs of a magnitude capable of damaging the device.
From US PATENT No. 4,750,078, there is known a method for providing such protection involving a circuit in which the breakdown regimes of bipolar transistors are utilised to selectively steer away the ESD from the connected device.
However, a problem with this arrangement is that damage can still occur in the device because the threshold voltages of the bipolar transistors (the voltages at which the transistors will configure to conduction modes and hence begin to steer away the ESD) may be significantly higher than the minimum voltage which would damage the device, thus allowing a proportion of the ESD through before the circuit is activated, and so not comprehensively protecting the device.
The present invention seeks to provide a voltage protection circuit in which the above mentioned disadvantages are mitigated.
SUMMARY OF THE INVENTION A voltage protection circuit which provides voltage protection for a user device, includes first and second input terminals provided for receiving first and second reference voltages respectively. A third input terminal is coupled to receive an input signal voltage of varying magnitude. An output terminal provides a connection to the user device. A node is coupled between the third input terminal and the output terminal. A diode is connected between the first input terminal and the second input terminal. A first transistor has a first current electrode coupled to the node and has a second current electrode coupled to the first input terminal. A second transistor has a first current electrode coupled to the node, has a second current electrode coupled to the second input terminal and has a control electrode coupled to the first transistor.The first and second transistors and the diode provide conduction paths in the event of excess voltage occurring at the third input terminal and so provide voltage protection at the output terminal.
The circuit may be constructed from a low number of components on a single integrated circuit, the second transistor being formed as a parasitic element of the first transistor, and the diode being formed by an Nwell connection to the first input terminal.
BRIEF DESCRIPTION OF THE DRAWING An exemplary embodiment of the invention will now be described with reference to the drawing of FIG. 1 which shows a preferred embodiment of a voltage protection circuit in accordance with the invention.
DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT Referring to FIG. 1, there is shown a voltage protection circuit 8 for providing protection against damage for a user device 9 connected to the circuit 8. A first input terminal 10 of the circuit 8 is provided for receiving a first reference voltage, typically the operating power supply voltage of the device (VDD). A second input terminal 11 is provided for receiving a second reference voltage, typically a ground reference voltage, such that the potential difference between the terminals 10 and 11 would be the normal operating voltage of the user device 9. A third input terminal 12 is provided for receiving an input signal voltage which may exceed the range enveloped by the voltages of the first and second input terminals 10 and 11. An output terminal 13 is provided for connecting the circuit 8 to the user device 9.A node 14 is coupled between the third input terminal 12 and the output terminal 13. A diode 15 is connected between the first input terminal 10 and the second input terminal 11 for allowing current flow if the potential difference of the second input terminal 11 with respect to the first input terminal 10 is positive. A metal oxide field effect transistor (MOSFET) 16 has a drain electrode 17 coupled to the node 14 and has a source electrode 18 and a gate electrode 19 coupled to the first input terminal 10. A PNP bipolar transistor 20 has an emitter electrode coupled to the node 14, has a collector electrode 22 coupled to the second input terminal 11 and has a base electrode 23 coupled to the MOSFET 16 via an N-well substrate section 24 of the MOSFET 16.
With reference to the operation of the voltage protection circuit 8, if a positive polarity ESD appears between the third input terminal 12 and the first input terminal 10, the MOSFET 16 approaches a threshold voltage VT1 (typically 20 volts) of a conduction regime which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14, such that the excess voltage of the ESD will be diminished as current flows through this path.
If a negative polarity ESD appears between the third input terminal 12 and the first input terminal 10, the MOSFET 16 approaches a threshold voltage VT2 (typically 22 volts) of a breakdown conduction regime again giving rise to a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14, such that the excess voltage of the ESD will be diminished as current flows through this path.
If a negative polarity ESD appears between the third input terminal 12 and the second input terminal 11, the MOSFET 16 approaches the threshold voltage VT2 Of a breakdown regime, which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14.
The diode 15 offers forward bias conduction, and forward collector-emitter breakdown of the Bipolar transistor 20 may also occur such that in combination with the action of the MOSFET, the excess voltage of the ESD will be diminished as current flows through these paths.
If a positive polarity ESD appears between the third input terminal 12 and the second input terminal 11, the MOSFET 16 approaches the threshold voltage VT1 of a conduction regime, which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14.
The diode 15 offers reverse breakdown conduction, and reverse collector-emitter breakdown of the Bipolar transistor 20 may also occur such that with the combination of these two and the action of the MOSFET, the excess voltage of the ESD will be diminished as current flows through these paths.
In this way ESDs of either positive or negative polarity and present between either the third input terminal 12 and the first input terminal 10 or between the third input terminal 12 and the second input terminal 11 are detected and prevented from reaching the user device 9 whilst their voltages are substantially less than the minimum voltage which could damage the user device 9.
In construction, the voltage protection circuit 8 may be formed entirely on a single integrated circuit, using by way of example, a CMOS process, wherein the bipolar transistor 20 is formed as a parasitic element of the MOSFET 16 and the diode 15 is formed by the Nwell of the MOSFET 16, thus enabling the entire voltage protection circuit to be built from a low number of components in a very small area of a semiconductor wafer substrate, or as part of a larger semiconductor device.
It will be appreciated that various alternatives to the above described preferred embodiment will be apparent to a person skilled in the art, such as for example the use of transistors of types other than those described or the fabrication of the circuit by processes other than a CMOS process.

Claims (11)

1. A voltage protection circuit for providing voltage protection for a user device comprising: a first input terminal for receiving a first reference voltage; a second input terminal for receiving a second reference voltage; a third input terminal for receiving an input signal voltage of varying magnitude; an output terminal for connection to the user device; a node coupled between the third input terminal and the output terminal; a diode connected between the first input terminal and the second input terminal; a first transistor having a first current electrode coupled to the node and having a second current electrode coupled to the first input terminal;; a second transistor having a first current electrode coupled to the node, having a second current electrode coupled to the second input terminal and having a control electrode coupled to the first transistor, wherein the first and second transistors and the diode provide conduction paths in the event of excess voltage occurring at the third input terminal and so provide voltage protection at the output terminal.
2. The circuit of claim 1 wherein the first transistor is a field effect transistor.
3. The circuit of claim 2 wherein the first current electrode of the first transistor is a drain electrode and the second current electrode of the first transistor is a source electrode.
4. The circuit of claim 2 or 3 wherein the first transistor includes an N-well substrate to which the control electrode of the second transistor is coupled.
5. The circuit of any of the claims 2 to 4 inclusive wherein the first transistor includes a gate electrode coupled to the first input terminal.
6. The circuit of any preceding claim wherein the second transistor is a bipolar transistor.
7. The circuit of claim 6 wherein first current electrode of the second transistor is an emitter electrode, the second current electrode of the second transistor is a collector electrode and the control electrode of the second transistor is a base electrode.
8. The circuit of any preceding claim wherein the second transistor is formed as a parasitic element of the first transistor.
9. The circuit of any of the claims 4 to 8 inclusive wherein the diode is formed by an Nwell connection to the first input terminal.
10. The circuit of any preceding claim wherein the circuit is formed on a single integrated circuit.
11. A voltage protection circuit substantially as herebefore described and with reference to the accompanying drawing.
GB9226989A 1992-12-24 1992-12-24 Voltage protection circuit Expired - Fee Related GB2273831B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9226989A GB2273831B (en) 1992-12-24 1992-12-24 Voltage protection circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9226989A GB2273831B (en) 1992-12-24 1992-12-24 Voltage protection circuit

Publications (3)

Publication Number Publication Date
GB9226989D0 GB9226989D0 (en) 1993-02-17
GB2273831A true GB2273831A (en) 1994-06-29
GB2273831B GB2273831B (en) 1997-03-26

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GB9226989A Expired - Fee Related GB2273831B (en) 1992-12-24 1992-12-24 Voltage protection circuit

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2336241A (en) * 1998-01-15 1999-10-13 United Microelectronics Corp Substrate-triggering electrostatic discharge protection circuit for deep-submicron integrated circuits

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018120955A (en) * 2017-01-25 2018-08-02 ルネサスエレクトロニクス株式会社 Semiconductor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4264941A (en) * 1979-02-14 1981-04-28 National Semiconductor Corporation Protective circuit for insulated gate field effect transistor integrated circuits
US4476476A (en) * 1979-04-05 1984-10-09 National Semiconductor Corporation CMOS Input and output protection circuit
US4736271A (en) * 1987-06-23 1988-04-05 Signetics Corporation Protection device utilizing one or more subsurface diodes and associated method of manufacture
EP0291242A2 (en) * 1987-05-15 1988-11-17 Advanced Micro Devices, Inc. Protection system for CMOS integrated circuits
US4868705A (en) * 1987-02-23 1989-09-19 Kabushiki Kaisha Toshiba Insulated-gate semicustom integrated circuit
US4930037A (en) * 1989-02-16 1990-05-29 Advaced Micro Devices, Inc. Input voltage protection system
US4996626A (en) * 1988-10-14 1991-02-26 National Semiconductor Corp. Resistorless electrostatic discharge protection device for high speed integrated circuits

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4264941A (en) * 1979-02-14 1981-04-28 National Semiconductor Corporation Protective circuit for insulated gate field effect transistor integrated circuits
US4476476A (en) * 1979-04-05 1984-10-09 National Semiconductor Corporation CMOS Input and output protection circuit
US4868705A (en) * 1987-02-23 1989-09-19 Kabushiki Kaisha Toshiba Insulated-gate semicustom integrated circuit
EP0291242A2 (en) * 1987-05-15 1988-11-17 Advanced Micro Devices, Inc. Protection system for CMOS integrated circuits
US4736271A (en) * 1987-06-23 1988-04-05 Signetics Corporation Protection device utilizing one or more subsurface diodes and associated method of manufacture
US4996626A (en) * 1988-10-14 1991-02-26 National Semiconductor Corp. Resistorless electrostatic discharge protection device for high speed integrated circuits
US4930037A (en) * 1989-02-16 1990-05-29 Advaced Micro Devices, Inc. Input voltage protection system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2336241A (en) * 1998-01-15 1999-10-13 United Microelectronics Corp Substrate-triggering electrostatic discharge protection circuit for deep-submicron integrated circuits
GB2336241B (en) * 1998-01-15 2000-06-14 United Microelectronics Corp Substrate-triggering electrostatic dicharge protection circuit for deep-submicron integrated circuits

Also Published As

Publication number Publication date
GB2273831B (en) 1997-03-26
GB9226989D0 (en) 1993-02-17

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PCNP Patent ceased through non-payment of renewal fee

Effective date: 19991224