GB2273831A - Overvoltage protection circuit; electrostatic discharge protection - Google Patents
Overvoltage protection circuit; electrostatic discharge protection Download PDFInfo
- Publication number
- GB2273831A GB2273831A GB9226989A GB9226989A GB2273831A GB 2273831 A GB2273831 A GB 2273831A GB 9226989 A GB9226989 A GB 9226989A GB 9226989 A GB9226989 A GB 9226989A GB 2273831 A GB2273831 A GB 2273831A
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- GB
- United Kingdom
- Prior art keywords
- transistor
- input terminal
- circuit
- coupled
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003071 parasitic effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 230000005669 field effect Effects 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 description 6
- 238000013459 approach Methods 0.000 description 4
- 230000003292 diminished effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
The protection circuit 8 has first and second input terminals 10, 11 connected to the operating power supply voltage of a user device 9 and to ground respectively, and a terminal 12 receiving an input signal voltage of varying magnitude and connected to an output terminal 13 via a node 14. A diode 15 is connected between input terminals 10, 11, a MOSFET 16 has drain and source electrodes 17, 18 coupled to node 14 and terminal 10 respectively, and a bipolar transistor 20 has its emitter 21 and collector 22 coupled to node 14 and terminal 11 respectively with its base 23 coupled to N-well substrate 24 of MOSFET 16. The transistors 16, 20 and the diode 15 provide conduction paths in the event of excess voltage occurring at the signal input terminal 12 and so provide voltage protection at the output terminal 13. The circuit 8 may be constructed from a low number of components on a single integrated circuit, the transistor 20 being formed as a parasitic element of the MOSFET 16, and the diode 15 being formed by the N-well 24 of the MOSFET 16. <IMAGE>
Description
VOLTAGE PROTECTION CIRCUIT
FIELD OF THE INVENTION
This invention relates to voltage protection circuits, and particularly to circuits for protecting devices from electrostatic discharge.
BACKGROUND OF THE INVENTION
A voltage protection circuit may be used to safeguard a connected user device against electrostatic discharges (ESDs) associated with input signals to the device. Such protection circuits exist which can protect against both positive and negative polarity ESDs.
A simple diode arrangement coupled between supply lines and the device input terminals may be used to prevent signals which are higher than the supply voltage (VDD) or lower than the ground reference voltage from reaching the input terminals of the user device. However, in some devices, such as those adhering to the well known RS232 and RS422 specifications, the input signal of the device may, during normal operation, exceed the envelope bounded by the supply voltage and the ground reference voltage (in the case of
RS422, the input signal may reach a voltage 10 volts higher or lower than the boundary of the aforementioned envelope).
For such devices, a protection circuit is required which will allow the input signal voltage to exceed the above defined envelope whilst continuing to protect the device from ESDs of a magnitude capable of damaging the device.
From US PATENT No. 4,750,078, there is known a method for providing such protection involving a circuit in which the breakdown regimes of bipolar transistors are utilised to selectively steer away the ESD from the connected device.
However, a problem with this arrangement is that damage can still occur in the device because the threshold voltages of the bipolar transistors (the voltages at which the transistors will configure to conduction modes and hence begin to steer away the ESD) may be significantly higher than the minimum voltage which would damage the device, thus allowing a proportion of the ESD through before the circuit is activated, and so not comprehensively protecting the device.
The present invention seeks to provide a voltage protection circuit in which the above mentioned disadvantages are mitigated.
SUMMARY OF THE INVENTION
A voltage protection circuit which provides voltage protection for a user device, includes first and second input terminals provided for receiving first and second reference voltages respectively. A third input terminal is coupled to receive an input signal voltage of varying magnitude. An output terminal provides a connection to the user device. A node is coupled between the third input terminal and the output terminal. A diode is connected between the first input terminal and the second input terminal. A first transistor has a first current electrode coupled to the node and has a second current electrode coupled to the first input terminal. A second transistor has a first current electrode coupled to the node, has a second current electrode coupled to the second input terminal and has a control electrode coupled to the first transistor.The first and second transistors and the diode provide conduction paths in the event of excess voltage occurring at the third input terminal and so provide voltage protection at the output terminal.
The circuit may be constructed from a low number of components on a single integrated circuit, the second transistor being formed as a parasitic element of the first transistor, and the diode being formed by an Nwell connection to the first input terminal.
BRIEF DESCRIPTION OF THE DRAWING
An exemplary embodiment of the invention will now be described with reference to the drawing of FIG. 1 which shows a preferred embodiment of a voltage protection circuit in accordance with the invention.
DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT
Referring to FIG. 1, there is shown a voltage protection circuit 8 for providing protection against damage for a user device 9 connected to the circuit 8. A first input terminal 10 of the circuit 8 is provided for receiving a first reference voltage, typically the operating power supply voltage of the device (VDD). A second input terminal 11 is provided for receiving a second reference voltage, typically a ground reference voltage, such that the potential difference between the terminals 10 and 11 would be the normal operating voltage of the user device 9. A third input terminal 12 is provided for receiving an input signal voltage which may exceed the range enveloped by the voltages of the first and second input terminals 10 and 11. An output terminal 13 is provided for connecting the circuit 8 to the user device 9.A node 14 is coupled between the third input terminal 12 and the output terminal 13. A diode 15 is connected between the first input terminal 10 and the second input terminal 11 for allowing current flow if the potential difference of the second input terminal 11 with respect to the first input terminal 10 is positive. A metal oxide field effect transistor (MOSFET) 16 has a drain electrode 17 coupled to the node 14 and has a source electrode 18 and a gate electrode 19 coupled to the first input terminal 10. A
PNP bipolar transistor 20 has an emitter electrode coupled to the node 14, has a collector electrode 22 coupled to the second input terminal 11 and has a base electrode 23 coupled to the MOSFET 16 via an N-well substrate section 24 of the
MOSFET 16.
With reference to the operation of the voltage protection circuit 8, if a positive polarity ESD appears between the third input terminal 12 and the first input terminal 10, the
MOSFET 16 approaches a threshold voltage VT1 (typically 20 volts) of a conduction regime which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14, such that the excess voltage of the ESD will be diminished as current flows through this path.
If a negative polarity ESD appears between the third input terminal 12 and the first input terminal 10, the MOSFET 16 approaches a threshold voltage VT2 (typically 22 volts) of a breakdown conduction regime again giving rise to a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14, such that the excess voltage of the ESD will be diminished as current flows through this path.
If a negative polarity ESD appears between the third input terminal 12 and the second input terminal 11, the MOSFET 16 approaches the threshold voltage VT2 Of a breakdown regime, which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14.
The diode 15 offers forward bias conduction, and forward collector-emitter breakdown of the Bipolar transistor 20 may also occur such that in combination with the action of the
MOSFET, the excess voltage of the ESD will be diminished as current flows through these paths.
If a positive polarity ESD appears between the third input terminal 12 and the second input terminal 11, the MOSFET 16 approaches the threshold voltage VT1 of a conduction regime, which produces a conductive path between the first input terminal 10 and the third input terminal 12 via the node 14.
The diode 15 offers reverse breakdown conduction, and reverse collector-emitter breakdown of the Bipolar transistor 20 may also occur such that with the combination of these two and the action of the MOSFET, the excess voltage of the ESD will be diminished as current flows through these paths.
In this way ESDs of either positive or negative polarity and present between either the third input terminal 12 and the first input terminal 10 or between the third input terminal 12 and the second input terminal 11 are detected and prevented from reaching the user device 9 whilst their voltages are substantially less than the minimum voltage which could damage the user device 9.
In construction, the voltage protection circuit 8 may be formed entirely on a single integrated circuit, using by way of example, a CMOS process, wherein the bipolar transistor 20 is formed as a parasitic element of the MOSFET 16 and the diode 15 is formed by the Nwell of the MOSFET 16, thus enabling the entire voltage protection circuit to be built from a low number of components in a very small area of a semiconductor wafer substrate, or as part of a larger semiconductor device.
It will be appreciated that various alternatives to the above described preferred embodiment will be apparent to a person skilled in the art, such as for example the use of transistors of types other than those described or the fabrication of the circuit by processes other than a CMOS process.
Claims (11)
1. A voltage protection circuit for providing voltage protection for a user device comprising:
a first input terminal for receiving a first reference voltage;
a second input terminal for receiving a second reference voltage;
a third input terminal for receiving an input signal voltage of varying magnitude; an output terminal for connection to the user device;
a node coupled between the third input terminal and the output terminal;
a diode connected between the first input terminal and the second input terminal;
a first transistor having a first current electrode coupled to the node and having a second current electrode coupled to the first input terminal;;
a second transistor having a first current electrode coupled to the node, having a second current electrode coupled to the second input terminal and having a control electrode coupled to the first transistor, wherein the first and second transistors and the diode provide conduction paths in the event of excess voltage occurring at the third input terminal and so provide voltage protection at the output terminal.
2. The circuit of claim 1 wherein the first transistor is a field effect transistor.
3. The circuit of claim 2 wherein the first current electrode of the first transistor is a drain electrode and the second current electrode of the first transistor is a source electrode.
4. The circuit of claim 2 or 3 wherein the first transistor includes an N-well substrate to which the control electrode of the second transistor is coupled.
5. The circuit of any of the claims 2 to 4 inclusive wherein the first transistor includes a gate electrode coupled to the first input terminal.
6. The circuit of any preceding claim wherein the second transistor is a bipolar transistor.
7. The circuit of claim 6 wherein first current electrode of the second transistor is an emitter electrode, the second current electrode of the second transistor is a collector electrode and the control electrode of the second transistor is a base electrode.
8. The circuit of any preceding claim wherein the second transistor is formed as a parasitic element of the first transistor.
9. The circuit of any of the claims 4 to 8 inclusive wherein the diode is formed by an Nwell connection to the first input terminal.
10. The circuit of any preceding claim wherein the circuit is formed on a single integrated circuit.
11. A voltage protection circuit substantially as herebefore described and with reference to the accompanying drawing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9226989A GB2273831B (en) | 1992-12-24 | 1992-12-24 | Voltage protection circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9226989A GB2273831B (en) | 1992-12-24 | 1992-12-24 | Voltage protection circuit |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9226989D0 GB9226989D0 (en) | 1993-02-17 |
GB2273831A true GB2273831A (en) | 1994-06-29 |
GB2273831B GB2273831B (en) | 1997-03-26 |
Family
ID=10727238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9226989A Expired - Fee Related GB2273831B (en) | 1992-12-24 | 1992-12-24 | Voltage protection circuit |
Country Status (1)
Country | Link |
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GB (1) | GB2273831B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2336241A (en) * | 1998-01-15 | 1999-10-13 | United Microelectronics Corp | Substrate-triggering electrostatic discharge protection circuit for deep-submicron integrated circuits |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018120955A (en) * | 2017-01-25 | 2018-08-02 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4264941A (en) * | 1979-02-14 | 1981-04-28 | National Semiconductor Corporation | Protective circuit for insulated gate field effect transistor integrated circuits |
US4476476A (en) * | 1979-04-05 | 1984-10-09 | National Semiconductor Corporation | CMOS Input and output protection circuit |
US4736271A (en) * | 1987-06-23 | 1988-04-05 | Signetics Corporation | Protection device utilizing one or more subsurface diodes and associated method of manufacture |
EP0291242A2 (en) * | 1987-05-15 | 1988-11-17 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
US4868705A (en) * | 1987-02-23 | 1989-09-19 | Kabushiki Kaisha Toshiba | Insulated-gate semicustom integrated circuit |
US4930037A (en) * | 1989-02-16 | 1990-05-29 | Advaced Micro Devices, Inc. | Input voltage protection system |
US4996626A (en) * | 1988-10-14 | 1991-02-26 | National Semiconductor Corp. | Resistorless electrostatic discharge protection device for high speed integrated circuits |
-
1992
- 1992-12-24 GB GB9226989A patent/GB2273831B/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4264941A (en) * | 1979-02-14 | 1981-04-28 | National Semiconductor Corporation | Protective circuit for insulated gate field effect transistor integrated circuits |
US4476476A (en) * | 1979-04-05 | 1984-10-09 | National Semiconductor Corporation | CMOS Input and output protection circuit |
US4868705A (en) * | 1987-02-23 | 1989-09-19 | Kabushiki Kaisha Toshiba | Insulated-gate semicustom integrated circuit |
EP0291242A2 (en) * | 1987-05-15 | 1988-11-17 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
US4736271A (en) * | 1987-06-23 | 1988-04-05 | Signetics Corporation | Protection device utilizing one or more subsurface diodes and associated method of manufacture |
US4996626A (en) * | 1988-10-14 | 1991-02-26 | National Semiconductor Corp. | Resistorless electrostatic discharge protection device for high speed integrated circuits |
US4930037A (en) * | 1989-02-16 | 1990-05-29 | Advaced Micro Devices, Inc. | Input voltage protection system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2336241A (en) * | 1998-01-15 | 1999-10-13 | United Microelectronics Corp | Substrate-triggering electrostatic discharge protection circuit for deep-submicron integrated circuits |
GB2336241B (en) * | 1998-01-15 | 2000-06-14 | United Microelectronics Corp | Substrate-triggering electrostatic dicharge protection circuit for deep-submicron integrated circuits |
Also Published As
Publication number | Publication date |
---|---|
GB2273831B (en) | 1997-03-26 |
GB9226989D0 (en) | 1993-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19991224 |