GB2262743B - Electrically conductive copper paste - Google Patents

Electrically conductive copper paste

Info

Publication number
GB2262743B
GB2262743B GB9226903A GB9226903A GB2262743B GB 2262743 B GB2262743 B GB 2262743B GB 9226903 A GB9226903 A GB 9226903A GB 9226903 A GB9226903 A GB 9226903A GB 2262743 B GB2262743 B GB 2262743B
Authority
GB
United Kingdom
Prior art keywords
electrically conductive
conductive copper
copper paste
paste
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9226903A
Other languages
English (en)
Other versions
GB2262743A (en
GB9226903D0 (en
Inventor
Hirofumi Hatanaka
Koichi Machida
Kazumi Suzuki
Toru Fukuda
Ichirou Nakayama
Tatsumi Hoshino
Seiji Yokode
Kunio Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Publication of GB9226903D0 publication Critical patent/GB9226903D0/en
Publication of GB2262743A publication Critical patent/GB2262743A/en
Application granted granted Critical
Publication of GB2262743B publication Critical patent/GB2262743B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB9226903A 1991-12-27 1992-12-24 Electrically conductive copper paste Expired - Fee Related GB2262743B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34604891 1991-12-27

Publications (3)

Publication Number Publication Date
GB9226903D0 GB9226903D0 (en) 1993-02-17
GB2262743A GB2262743A (en) 1993-06-30
GB2262743B true GB2262743B (en) 1995-11-01

Family

ID=18380787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9226903A Expired - Fee Related GB2262743B (en) 1991-12-27 1992-12-24 Electrically conductive copper paste

Country Status (4)

Country Link
JP (1) JPH05325636A (ja)
KR (1) KR930016000A (ja)
GB (1) GB2262743B (ja)
MY (1) MY108188A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320728A (en) * 1996-12-30 1998-07-01 Coates Brothers Plc Depositing a metallic film involving pretreatment
JPH10256687A (ja) * 1997-03-14 1998-09-25 Matsushita Electric Ind Co Ltd ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板
JP4803910B2 (ja) * 2001-06-27 2011-10-26 三菱鉛筆株式会社 繊維束製インキ誘導部材の製造方法
KR100390638B1 (ko) * 2001-07-09 2003-07-07 남애전자 주식회사 도전성 실리콘 페이스트
KR20020061469A (ko) * 2001-08-04 2002-07-24 김병만 전자부품용 도전성 페이스트
KR100403549B1 (ko) * 2001-10-31 2003-10-30 남애전자 주식회사 도포형 실리콘 페이스트를 이용한 현장성형 방식의 전자파차폐 방법
KR100484246B1 (ko) * 2001-12-17 2005-04-20 (주)그린폴 폐전선 피복물을 이용한 전기전도성 조성물
JP5907305B1 (ja) * 2015-09-10 2016-04-26 東洋インキＳｃホールディングス株式会社 レーザー加工用導電性ペースト
JP6566008B2 (ja) * 2017-11-24 2019-08-28 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP7466348B2 (ja) * 2020-03-25 2024-04-12 株式会社タムラ製作所 異方性導電ペーストおよび電子基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155114A (ja) * 1988-12-06 1990-06-14 Mitsui Toatsu Chem Inc 導電性銅ペースト
JPH10125311A (ja) * 1996-10-25 1998-05-15 Toyota Motor Corp 電池電極の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155114A (ja) * 1988-12-06 1990-06-14 Mitsui Toatsu Chem Inc 導電性銅ペースト
JPH10125311A (ja) * 1996-10-25 1998-05-15 Toyota Motor Corp 電池電極の製造方法

Also Published As

Publication number Publication date
GB2262743A (en) 1993-06-30
JPH05325636A (ja) 1993-12-10
GB9226903D0 (en) 1993-02-17
MY108188A (en) 1996-08-30
KR930016000A (ko) 1993-07-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19961224