MY108188A - Electrically conductive copper paste. - Google Patents
Electrically conductive copper paste.Info
- Publication number
- MY108188A MY108188A MYPI92002385A MYPI19922385A MY108188A MY 108188 A MY108188 A MY 108188A MY PI92002385 A MYPI92002385 A MY PI92002385A MY PI19922385 A MYPI19922385 A MY PI19922385A MY 108188 A MY108188 A MY 108188A
- Authority
- MY
- Malaysia
- Prior art keywords
- parts
- weight
- electrically conductive
- conductive copper
- copper paste
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
AN ELECTRICALLY CONDUCTIVE COPPER PASTE COMPRISING 100 PARTS BY WEIGHT OF A POWDER, 14-25 PARTS BY WEIGHT IN TOTAL OF A MODIFIED HYDROQUINONE RESIN AND A LIQUID EPOXY RESIN AND 5-20 PARTS BY WEIGHT OF AN INORGANIC FILLER. THIS PASTE HAS A FURTHER IMPROVED BALANCE IN PROPERTIES WHEN THE AMOUNT OF THE LIQUID EPOXY RESIN IS 65-80 PARTS BY WEIGHT PER 100 PARTS BY WEIGHT OF THE MODIFIED HYDROQUINONE RESIN AND THE PARTICLE DIAMETER OF THE INORGANIC FILLER IS 0.1 UM TO UM.THE ELECTRICALLY CONDUCTIVE COPPER PASTE HAS A LOW ELECTRICAL RESISTANCE, IS BALANCED IN PRINTABILITY, ADHESION, HEAT RESISTANCE DURING SOLDERING, HEAT STABILITY, HUMIDITY STABILITY, ETC., AND IS BEST SUITED FOR THE PURPOSE OF ELECTROMAGNETIC SHIELDING. ETC.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34604891 | 1991-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY108188A true MY108188A (en) | 1996-08-30 |
Family
ID=18380787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI92002385A MY108188A (en) | 1991-12-27 | 1992-12-24 | Electrically conductive copper paste. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH05325636A (en) |
KR (1) | KR930016000A (en) |
GB (1) | GB2262743B (en) |
MY (1) | MY108188A (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2320728A (en) * | 1996-12-30 | 1998-07-01 | Coates Brothers Plc | Depositing a metallic film involving pretreatment |
JPH10256687A (en) * | 1997-03-14 | 1998-09-25 | Matsushita Electric Ind Co Ltd | Conductor paste composition for filling it into via hole, and printed circuit board using the same |
JP4803910B2 (en) * | 2001-06-27 | 2011-10-26 | 三菱鉛筆株式会社 | Manufacturing method of fiber guide ink guide member |
KR100390638B1 (en) * | 2001-07-09 | 2003-07-07 | 남애전자 주식회사 | Electrically conductive silicone paste |
KR20020061469A (en) * | 2001-08-04 | 2002-07-24 | 김병만 | Electric Conduition Nature Pasted For An Electron Parts |
KR100403549B1 (en) * | 2001-10-31 | 2003-10-30 | 남애전자 주식회사 | A method for shielding electromagnetic interference waves by using form-in- place type electrically conductive silicone pastes |
KR100484246B1 (en) * | 2001-12-17 | 2005-04-20 | (주)그린폴 | Electroconductive composition containing waste electric wires |
JP5907305B1 (en) * | 2015-09-10 | 2016-04-26 | 東洋インキScホールディングス株式会社 | Conductive paste for laser processing |
JP6566008B2 (en) * | 2017-11-24 | 2019-08-28 | 東洋インキScホールディングス株式会社 | Electromagnetic shielding sheet and printed wiring board |
JP7466348B2 (en) * | 2020-03-25 | 2024-04-12 | 株式会社タムラ製作所 | Anisotropic conductive paste and method for manufacturing electronic substrate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02155114A (en) * | 1988-12-06 | 1990-06-14 | Mitsui Toatsu Chem Inc | Conductive copper paste |
JPH10125311A (en) * | 1996-10-25 | 1998-05-15 | Toyota Motor Corp | Manufacture of battery electrode |
-
1992
- 1992-12-22 JP JP4342614A patent/JPH05325636A/en active Pending
- 1992-12-24 GB GB9226903A patent/GB2262743B/en not_active Expired - Fee Related
- 1992-12-24 KR KR1019920025523A patent/KR930016000A/en not_active Application Discontinuation
- 1992-12-24 MY MYPI92002385A patent/MY108188A/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB2262743A (en) | 1993-06-30 |
JPH05325636A (en) | 1993-12-10 |
GB9226903D0 (en) | 1993-02-17 |
KR930016000A (en) | 1993-07-24 |
GB2262743B (en) | 1995-11-01 |
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