GB2252939A - Mounting and connecting arrangements for thermal printing heads - Google Patents

Mounting and connecting arrangements for thermal printing heads Download PDF

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Publication number
GB2252939A
GB2252939A GB9119730A GB9119730A GB2252939A GB 2252939 A GB2252939 A GB 2252939A GB 9119730 A GB9119730 A GB 9119730A GB 9119730 A GB9119730 A GB 9119730A GB 2252939 A GB2252939 A GB 2252939A
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GB
United Kingdom
Prior art keywords
circuit board
support member
thermal printing
printing head
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9119730A
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GB9119730D0 (en
GB2252939B (en
Inventor
Shigeo Ota
Tsutomu Nakamura
Masato Sakai
Mineo Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Publication date
Priority claimed from JP3024580A external-priority patent/JP2834892B2/en
Priority claimed from JP3995391A external-priority patent/JP2959857B2/en
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of GB9119730D0 publication Critical patent/GB9119730D0/en
Publication of GB2252939A publication Critical patent/GB2252939A/en
Application granted granted Critical
Publication of GB2252939B publication Critical patent/GB2252939B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00Actions or mechanisms not otherwise provided for
    • B41J25/304Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface

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  • Electronic Switches (AREA)

Abstract

A thermal printing arrangement comprises a mount 1 which supports a laminar printhead 2 and a presser bar 4 which serves both to clamp the printhead to the mount and to urge an electrical connector 3 against a terminal paid array 8 on the printhead. The printhead includes a plurality of electronic drivers 5 between the terminal array 8 and an elongate line 7 of printing elements. The presser bar 4 urges an elastomeric bead 22 against that part of the connector which overlies the contact pad array so as to ensure a reliable connection, and a portion of the leading edge of the clamping bar overlies the electronics to protect them from damage. The connector 3 may be provided with pins for mating with a socket. <IMAGE>

Description

TITLE OF THE INVENTION THERMAL PRINTING HEAD BACKGROUND OF THE INVENTION 1. Field of the Invention: This invention relates to a thermal printing head which is used for example to print on thermosensitive paper or to cause ink transfer from a thermal transfer ribbon or film onto printing paper. More particularly, the present invention relates to improvements in a thermal printing head of the type wherein a connector board is overlapped on a head circuit board for connection to external circuits.
2. Description of the Prior Art: As is well known, thermal printing heads are widely used in facsimile machines to print transmitted information on thermosensitive paper. The thermal printing head is also used in printers of the type wherein the ink of a transfer ink ribbon or film is thermally caused to be transferred onto printing paper.
There are various type of thermal printing heads which include line-type heads and matrix-type heads. The line-type thermal printing head has a row (line) of multiple heating dots, as disclosed for example in Japanese Patent Application Laid-open No. 63-151466 or No. 63-221055. The matrix-type thermal printing head has a multiplicity of heating dots arranged in a matrix, as disclosed for example in U.S. Patent No. 3,855,448 to Hanagata et al.
The present invention is directed primarily to the line-type thermal printing head. To clarify the objects of the present invention, reference is now made to Figs. 10 and 11 which show a typical line-type thermal printing head.
As shown in Figs. 10 and 11, the prior art thermal printing head comprises an elongate head circuit board 100 adhesively mounted on an elongate support member 101 which is made of aluminum for example to serve also as a heat sink.
The head circuit board 100 carries a longitudinal row (line) of multiple heating dots 102 positioned adjacent one longitudinal side of the head circuit board. The head circuit board also carries a comb-like terminal portion 103 located adjacent the other longitudinal side of the circuit board, and an array of drive IC's 104 for selectively driving the heating dots 102. Though not shown, the head circuit board is further formed with a sophisticated conductor pattern.
The printing head further includes a strip-like flexible connector board 105 which is reinforced by a backing 106 made for example of glass-fiber-reinforced resin. In an assembled state, the backing 106 rests directly on the support member 101, as shown in Fig. 11. The flexible board 105 has a front marginal portion projecting beyond the backing 106 to partially overlap the head circuit board 100. The underside of the projecting marginal portion of the flexible board 105 is formed with a comb-like terminal portion 107 in corresponding relation to the terminal portion 103 of the head circuit board 100.
An elongate presser cover 108 is arranged above the connector board 105 and fixed to the support member 101 by means of mounting screws 109 penetrating through the presser member and the connector board into engagement with the support member. The underside of the presser cover is provided with an elastic rod 110 for pressing the comb-like terminal portion 107 of the connector board into intimate contact with the comb-like terminal portion 103 of the head circuit board 100 when the mounting screws 109 are tightened.
In operation of the printer, the heating dot line 102 of the head circuit board 100 is held in intimate contact with thermosensitive paper backed up by a platen 114 (Fig. 11). To enable loading (or re-loading) of thermosensitive paper and/or maintenance of the printing head, one of the printing head and the platen is mounted on a pivotable part of the printer with the other mounted to a fixed part of the printer, so that the printing head and the platen are movable toward and away from each other. Thus, it is necessary to provide a guide means for guiding the platen into a predetermined position relative to the heating dot line 102 when the printing head and the platen are moved toward each other, thereby insuring good printing quality.
The guide means shown in Figs. 10 and 11 includes a pair of L-shaped platen guides 111 positioned at the respective ends of the support member 101. Each platen guide 111 is formed with a guiding cutout 112 for removably receiving a corresponding shaft end of the platen 114, and fixed to the support member 101 by means of screws 113.
The prior art thermal printing head described above has a serious problem of bending during printing operation. The reason for such bending is as follows.
Generally, the support member (heat sink) 101 and the presser cover 108 are equally made of aluminum because this material is light and yet easily formed into any desired shape. Therefore, these two parts have the same coefficient of linear expansion. However, the support member 101 receives heat immediately from the head circuit board 100, whereas the presser cover 108 receives heat indirectly through the mounting screws 109 with a time lag. Thus, at the time of initiating the actuation of the heating dot line 102 or abruptly changing the actuating voltage, the heat transmitting time lag leads to a difference in the degree of longitudinal expansion between the support member and the presser cover at least before reaching the steady state.
According to the prior art arrangement shown in Figs. 10 and 11, since the comb-like terminal portion 103 of the head circuit board 100 extends substantially over the entire length of the head circuit board, the flexible connector board 105 and the presser cover 108 must also have a length substantially equal to that of the head circuit board.
Further, the entire length of the presser cover 108 must be fixedly mounted to the support member 101 by the mounting screws 109. Thus, when the presser cover and the support member are longitudinally expanded to different degrees, the thermal printing head as a whole bends longitudinally as a result of the so-called "bimetal phenomenon". Also troublesome is the fact that all of the mounting screws 109 must be tightened up in a well controlled manner to insure uniform electrical contact between the two terminal portions 103, 107 over their entire length, consequently prolonging the time required for manufacturing the thermal printing head.
The prior art thermal printing head has another problem with respect to the platen guides 111. Specifically, each platen guide 111 need be made of a hard metal such as an iron-containing alloy because the platen guide must be mechanically strong enough to withstand repetitive engagement with the platen shaft. On the other hand, the support member 101 should be preferably made of a light metal such as aluminum to realize weight reduction. Thus, the platen guide must be initially separate from the support member and later fixed to the support member by the screws 113. As a result, the total number of required components increases, and a longer time is necessary for assembly. Particularly, the platen guide must be strictly adjusted in position for insuring good printing quality, so that careful mounting of the platen guide is required with resultant increase in assembling time.
Theoretically, the support member 101 may be made of an iron-containing alloy and rendered integral with the platen guide 111. However, the support member 101 is required to be rigid (namely thick enough) to minimize the previously described thermal bending of the printing head. Thus, if the support member is made of such an alloy, the overall weight of the printing head increases unacceptably. In reality, therefore, the support member should be made of a light metal such as aluminum without integrating with the platen guide.
U.S. Patent No. 4,963,886 discloses an improved thermal printing head which incorporates a head circuit board carrying a comb-like terminal portion arranged only in a limited central length which is substantially smaller than that of the head circuit board itself. Due to such an arrangement, a flexible connector board is correspondingly reduced in length, and a presser cover is made to press the connector board into contact with the comb-like terminal portion of the head circuit board only in the limited central length of the head circuit board. Thus, though a plurality of mounting screws are used to mount the presser cover onto a support member (heat sink), only those screws located within the limited central length need be tightened up in a well controlled manner.The remaining screws may be inserted loosely in diametrically larger bores of the presser cover to allow longitudinal expansion of the presser cover independently of the support member.
According to the arrangement disclosed in the above-described U.S. patent, thermal bending of the printing head can be prevented since the presser cover is allowed to expand independently of the support member except for a portion located in the limited central length of the head circuit board. Further, those of the mounting screws located outside this limited central length need not be tightened in a well controlled manner, so that the printing head can be assembled in a shorter time than the prior art printing head of Figs. 10 and 11.
However, the printing head of the above U.S. patent still remains to be improved in the following respects.
First, the presser cover still has a length substantially equal to that of the head circuit board in spite of the fact that the length of the flexible connector board has been greatly reduced. Indeed, the presser cover has dual functions of pressing the flexible connector board onto the head circuit board and of covering an array of drive IC's which are sensitive to external shocks. Generally, the drive IC array extends substantially over the entire length of the head circuit board, and it is for this reason that the presser cover must remain long. However, it is very beneficial for weight reduction if the length of the presser cover is reduced at least partially. It is also advantageous for simplification of assembly if the total number of required mounting screws are reduced as a result of reduction in length of the presser cover.
Secondly, the support member (heat sink) is made of a relatively thick aluminum plate. Thus, separate platen guides need be screwed to the respective ends of the support member at the time of incorporating into the printer, so that the same problem as described in connection with the prior art printing head of Figs. 10 and 11 is inevitable.
SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide a thermal printing head which requires a reduced number of components and has a reduced weight in comparison with the prior art thermal printing head.
Another object of the present invention is to provide a thermal printing head wherein a head circuit board can be positionally adjusted relative to a platen with ease but with high accuracy.
A further object of the present invention is to provide a thermal printing head wherein a line of heating dots can be uniformly held into intimate contact with a platen to improve the printing quality.
According to the present invention, there is provided a thermal printing head comprising: a support member; a head circuit board supported on the support member, the head circuit board carrying a line of heating dots and an array of drive elements for driving the heating dots, the head circuit board further carrying a terminal portion arranged locally in a limited length which is sufficiently smaller than that of the head circuit board; a connector board carrying a terminal portion corresponding to the terminal portion of the head circuit board, the connector board being sufficiently smaller in length than the head circuit board; and a presser member mounted on the support member for pressing the terminal portion of the connector board into intimate contact with the terminal portion of the head circuit board; wherein the presser member has a pressing portion which is sufficiently smaller in length than the head circuit board.
As opposed to the disclosure of U.S. Patent No.
4,963,886, not only the connector board but also the pressing portion of the presser member is rendered sufficiently shorter than the head circuit board according to the present invention. Thus, the pressing portion of the presser member need not be fixed to the support member near each end of the head circuit board, thereby reducing the number of required components and facilitating an assembling operation. Further, reduction in length of the pressing portion results in corresponding reduction in overall weight of the thermal printing head.
The presser member may further have a covering portion arranged to cover the array of drive elements for protection.
In this case, the covering portion need have a length not smaller than that of the drive element array.
Alternatively, the presser member may have no covering portion. Instead, the array of drive elements may be protected solely by being enclosed in an elongate protective body of hard resin. In this case, the presser member is arranged clear of the drive element array, and the entirety of the presser member is sufficiently smaller in length than the head circuit board. Such an arrangement contributes to further reduction in overall weight of the printing head.
Advantageously, the support member should be rendered elastically flexible. The elastic flexibility of the support member may be utilized to bring the heating dot line into intimate and uniform contact with a platen under the urging force of springs even if the flatness of the support member or head circuit board or the cylindricality of the platen is not strictly realized.
According to a preferred embodiment of the present invention, each end of the support member is integrally formed with a platen guide having a guiding cutout for removably receiving a corresponding shaft end of the platen. Such an integral construction is advantageous in that the platen guide need not be subsequently attached to the support member with attendant positional adjustment and screwing.
According to another preferred embodiment of the present invention, the support member is provided with at least one marking indication located adjacent to the platen guide, the marking indication being in the form of a marking bore for example. Alternatively, the platen guide itself may be provided with at least one marking indication which may be in the form of a marking slit. In either case, the marking indication can be advantageously used for positionally adjusting the head circuit board relative to the platen guide.
Other objects, features and advantages of the present invention will be fully understood from the following detailed description of the preferred embodiments given with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS In the accompanying drawings: Fig. 1 is an exploded perspective view showing a thermal printing head according to the present invention; Fig. 2 is a sectional view taken along lines II-II in Fig. 1 to show the same printing head in an assembled state; Fig. 3 is a sectional view taken along lines III-III in Fig. 1 to show the same printing head in an assembled state; Fig. 4 is a sectional view similar to Fig. 2 but showing the same printing head as incorporated in a printer; Fig. 5 is a perspective view illustrating how the printing head is assembled; Fig. 6 is an exploded perspective view showing another thermal printing head according to the present invention; Fig. 7 is a side view showing the printing head of Fig.
6 in an assembled state; Fig. 8 is an exploded perspective view showing a further thermal printing head according to the present invention; Fig. 9 is a side view showing the printing head of Fig.
8 in an assembled state; Fig. 10 is an exploded perspective view showing a prior art thermal printing head; and Fig. 11 is a sectional view taken along lines XI-XI in Fig. 10 to show the prior art printing head in an assembled state.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring first to Figs. 1 through 3 of the accompanying drawings, there is illustrated a line-type thermal printing head which mainly includes an elongate support member 1, an elongate head circuit board 2, a flexible connector circuit board 3, and a presser member 4. The details of these main parts are described below.
The head circuit board 2 includes an insulating substrate which is made for example of a ceramic material such as alumina. The upper or front surface of the head circuit board carries drive IC's 5 enclosed in an elongate protective body 6 which is made for example of a relatively soft resin such as silicone resin, and a resistor line 7 extending along one longitudinal side of the head circuit board adjacent thereto. The resistor line 7 is divisionally driven by the drive IC's 5 for providing a line of heating dots. The front surface of the head circuit board is further formed with comb-like connection terminal portion 8 adjacent to the other longitudinal side of the head circuit board.
Though not shown in Fig. 1, the front surface of the head circuit board 2 is further formed with a conductor circuit pattern generally in the same manner as disclosed in U.S. Patent No. 4,963,886. The unillustrated conductor pattern allows the comb-like connection terminal portion 8 to have a reduced number of terminals and to be locally arranged in a limited central portion of the head circuit board.
The support member 1, which serves also as a heat sink for the head circuit board 2, is formed by press working from a relatively thin metallic plate or sheet which is made for example of an iron-containing alloy such as steel. Each end of the support member is provided with a substantially upright platen guide 9 which is integral with the support member. The platen guide is formed with a guiding cutout 10 for receiving a corresponding shaft end 11a of a platen 11, as shown in Figs. 2 and 3.
As previously described in connection with the prior art, one of the thermal printing head and the platen 11 is mounted on a fixed part of the printer, whereas the other is mounted on a pivotal part of the printer. Thus, the platen 11 can be selectively brought into and out of operative position relative to the thermal printing head by pivoting the pivotal part of the printer. The platen guide 9 of the support member 1 serves to accurately locate the platen 11 relative to the thermal printing head when the platen is brought into its operative position. Specifically, in the operative position shown in Figs. 2 and 3, the platen 11 must come into contact with the head circuit board 2 (i.e. thermosensitive paper) along a contact line which accurately coincides with the resistor line 7 on the head circuit board.
The support member 1 is also formed with a pair of threaded bores 14 respectively at positions not concealed by the head circuit board 2. The support member is further formed with a pair of positioning bores 15 adjacent to the respective threaded bores 14. The function of these bores 14, 15 will be described later.
The flexible connector board 3 is made for example of a polyimide film and reinforced by a backing 16 which may be made of glass-fiber-reinforced epoxy resin. Since the comb-like connection terminal portion 8 of the head circuit board 2 is arranged in the limited central portion, the flexible board 3 together with the reinforcing backing 16 need only have a correspondingly reduced length. The backing 16 supports, on its underside, at least one connector 17 which may be adhesively bonded thereto.
The flexible connector board 3 has a front marginal portion projecting beyond the reinforcing backing 16. The underside -of this front marginal portion is formed with a comb-like connection terminal portion 18 in corresponding relation to the comb-like connection terminal portion 8 of the head circuit board. When assembled, the connection terminal portions 8, 18 of the head circuit board 2 and flexible connector board 3, respectively, are intimately overlapped, as described later.
The flexible connector board 3 together with the reinforcing backing 16 is provided with a pair of through-bores 14' corresponding to the threaded bores 14 of the support member 1. Further, the combined connector board and backing is provided with a pair of positioning bores 15' corresponding to the positioning bores 15 of the support member.
The presser member 4 has a pressing portion 19 and a covering portion 20. The pressing portion 19 substantially corresponds in length to the flexible connector board 3, and is overlapped thereon, as shown in Figs. 2 and 3. On the other hand, the covering portion 20 has a length substantially corresponding to that of the elongate protective body 6, and projects beyond the flexible board 3 to fully cover the elongate protective body 6.
The underside of the pressing portion 19 is provided with an elongate recess 21 adjacent the covering portion 20 for receiving an elastic rod 22 which lies over the front marginal portion of the flexible connector board 3. Thus, when assembled, the elastic rod 22 presses the comb-like terminal portion 18 of the flexible board 3 into intimate contact with the comb-like terminal portion 8 of the head circuit board 2 to insure electric conduction therebetween.
The pressing portion 19 of the presser member 4 is also formed with a pair of through-bores 14" corresponding to the respective threaded bores 14 of the support member 1. The pressing portion is further formed with a pair of positioning bores 15" corresponding to those of the support member.
Indicated at 23 are a pair of tightening screws inserted through the respective through-bores 14', 14" of the connector board 3 and pressing portion 19 into engagement with the threaded bores 14 of the support member 1.
The thermal printing head described above is assembled by using an assembling apparatus incorporating a pallet 24 which is formed with a pair of positioning pins 25 and a pair of reference marks 26, as shown in Fig. 5. The positioning pins 25 and the reference marks 26 have accurate relative positions for performing accurate positional adjustment.
Specifically, in the assembling operation, the support member 1 is placed on the pallet 24 with the positioning pins 25 inserted into the respective positioning bores 15 of the support member 1. As a result, the respective guiding cutouts 10 of the platen guides 9 are positioned accurately relative to the reference marks 26 on the pallet 24.
Then, the head circuit board 2 is placed on and positionally adjusted relative to the support member 1 by utilizing the resistor line 7 of the head circuit board 2 on one hand and the reference marks 26 of the pallet 24 on the other hand. As a result, the resistor line 7 is located accurately relative to the platen 11 which is subsequently received by the guiding cutouts 10 of the support member 1.
Preferably, the head circuit board 2 is adhesively bonded to the support member 1 only in the central portion thereof. Such an arrangement is advantageous in that the support member 1 and the head circuit board 2, though having different coefficients of linear thermal expansion, can expand substantially independently of each other upon temperature increase without resulting in longitudinal bending due to the so-called "bimetal phenomenon After the positional adjustment and adhesive bonding of the head circuit board 2 relative to the support member 1, the flexible connector board 3 is overlapped onto the head circuit board 2, and the presser member 4 together with the elastic rod 22 is overlapped onto the connector board 3.At this time, the positioning pins 25 on the pallet 24 are inserted into the respective positioning bores 15', 15" of the connector board 3 and presser member 4, thereby accurately positioning these parts 3, 4 relative to the head circuit board.
Finally, the tightening screws 23 are inserted through the through-bores 14', 14" of the connector board 3 and presser member 4 into screw engagement with the threaded bores 14 of the support member 1. As a result, the comb-like terminal portion 18 of the connector board 3 is brought into intimate contact with the comb-like terminal portion of the head circuit board 8.
When incorporated into the printer, the support member 1 is pressed toward the platen 11 by springs 27, as shown in Fig. 4. Thus, the resistor line 7 on the head circuit board 2 can be brought into intimate line contact with the platen 11.
The above-described embodiment enjoys the basic advantages disclosed in U.S. Patent No. 4,963,886 because the present invention is based on this U.S. patent. Particularly, the basic advantages include prevention of thermal bending which is obtainable from the fact that the comb-like terminal portion 8 of the head circuit board 2 is located only in the limited central portion thereof.
The embodiment shown in Figs. 1 to 3 also has the following additional advantages.
First, while the covering portion 20 of the presser member 4 generally corresponds in length to the head circuit board 2, the pressing portion 19 of the presser member is considerably shorter than the head circuit board. Thus, the weight of the presser member can be greatly reduced in comparison with U.S. Patent No. 4,963,886 wherein the entirety (including the pressing portion) of the presser member substantially corresponds in length to the head circuit board. More importantly, the shortened pressing portion 19 requires no fixing means near the respective ends of the covering portion 20. This makes a sharp contrast against U.S.
Patent No. 4,963,886 wherein the presser member is fixed by screws (additional to the central tightening bolts) near the respective ends of the covering portion.
Secondly, the platen guide 9 for the platen 11 is formed integrally with the support member 1. Thus, no separate platen guide need be attached to each end of the support member by screwing, and no positional adjustment is needed between the platen guide and the support member. The only necessity for accurate positioning of the platen 11 is the accurate mounting of the head circuit board 2 relative to the support member. Therefore, it is possible to reduce the total number of required components with resultant reduction of assembling cost.
In the third place, because the comb-like terminal portion 8 of the head circuit board 2 is arranged only in the limited central portion thereof for prevention of thermal bending, the support member 1 itself need not be rigid for prevention of thermal bending. Thus, the support member 1 may be rendered relatively thin to have a reduced section modulus i.e., rigidity), and made of an iron-containing alloy. For example, the support member 1 may be made from a steel sheet by press working. As a result, the overall weight and thickness of the thermal printing head can be greatly reduced, and the press working enables easy formation of the upright platen guides 9 by bending.
In the fourth place, because of the reduced thickness, the support member 1 can be rendered elastically flexible.
Such elastic flexibility of the support member 1 may be utilized to bring the resistor line 7 into intimate contact with the platen 11 under the pressing force of the springs 27 (Fig. 4) even if the cylindricality of the platen 11 or the flatness of the support member 1 or head circuit board 2 is not strict, consequently improving the printing quality. It should be appreciated that Fig. 3 shows the resistor line 7 as slightly spaced from the platen 11, whereas Fig. 4 illustrates the resistor line as held in intimate contact with the platen.
Figs. 6 and 7 show another thermal printing head according to the present invention. This printing head is similar to the foregoing embodiment but differs therefrom in several respects.
The printing head of Figs. 6 and 7 includes a support member 1' which is formed for example from a steel sheet by press working. The support member 1' is integrally formed, along the respective longitudinal edges, with downturned flanges la' for reinforcement. Indeed, the support member 1' need be reasonably flexible but reasonably rigid, and the height of each flange may be determined by various requirements (e.g. wall thickness of the support member). If the support member is too flexible, an increased number of springs (see Fig. 4) will be necessary to insure intimate contact between the head circuit board 7 and the platen (see Figs. 2-4) along the entire length of the printing head.
The support member 1' also has a pair of narrower end portions lb' which are mechanically reinforced by depressions 28. Each end portion lb' is formed with an upright platen guide 9' having a guiding cutout 10'. The support member is further provided with a pair of marking bores 29 located adjacent the respective platen guides 9' for use as reference marks in positionally adjusting the head circuit board 2 relative to the support member, as described hereinafter.
The diameter of each marking bore 29 may be optionally selected but preferably no more than lmm (e.g. about 0.5mum) to provide accurate positional adjustment. Obviously, the marking bore must be located offset toward one longitudinal edge of the support member 1 so that the marking bore will not be concealed by the head circuit board 2 attached to the support member.
The head circuit board 2 shown in Figs. 6 and 7 differs from that of the foregoing embodiment only in one respect.
Specifically, an array of drive IC's (not shown in Figs. 6 and 7 but shown in Fig. 1) are enclosed in an elongate protective body 6' which is made of hard resin instead of soft resin (e.g. silicone resin). A preferable example of hard resin is polyetheramide resin, but other hard resin may be acceptable.
Due to the use of hard resin, the protective resinous body 6' alone can fully protect the enclosed drive IC's against external shocks, thus making it unnecessary to provide additional protection.
The presser member 4' illustrated in Figs. 6 and 7 has no covering portion for the drive IC's because the hard protective body 6' alone can provide sufficient protection.
Thus, the presser member may be greatly reduced in weight, and the entirety of the presser member is used solely for pressing the flexible connector board 3 into intimate contact with the head circuit board 2.
According to the foregoing embodiment (see Fig. 5), the positional adjustment between the support member 1 and the head circuit board 2 is performed by utilizing the positioning pins 25 and reference marks 26 on the pallet 24. This manner of positional adjustment can be accurate only when the pins 25 are intimately fitted in the positioning bores 15 of the support member since otherwise the support member may deviate slightly relative to the reference marks 26. However, the diameter D1 of the pins 25 must be slightly smaller than the diameter D2 of the positioning bores 15 to enable their mutual fitting. Thus, the pins 25 and the positioning bores 15 must be machined with an extremely high precision to minimize the diametrical tolerance (D2-D1) for accurate positional adjustment. This strict requirement results in production cost increase.Further, the strict diametrical tolerance (namely close fit) between the pins 25 and the positioning bores 15 makes it difficult to quickly fit and separate them, thus leading to great slowdown in the production process.
According to the embodiment of Figs. 6 and 7, use is made of the marking bores 29 which are directly formed on the support member 1' in predetermined positonal relation to the platen guides 9 for positionally adjusting the head circuit board 2 relative to the support member. Specifically, the support member is placed on the pallet 24 (see Fig. 5) by inserting the positioning pins 25 into the positioning bores 15 of the support member, and the head circuit board 2 is positionally adjusted by referring to the resistor line 7 of the head circuit board on one hand and the marking bores 29 of the support member on the other hand.
Obviously, during the positional adjustment, the positioning pins 25 of the pallet 24 may be loosely fitted in the positioning bores 15 of the support member 1' because the positional relation between the marking bores 29 and the platen guides 9 is fixed regardless of movement of the support member 1' relative to the pallet 24. Thus, the positional adjustment becomes more reliable and accurate. The reference marks 26 of the pallet 24 are no longer used for positional adjustment, so that these marks may be omitted for simplification of the pallet.
It should be appreciated that the marking bores 29 may be formed simultaneously with press-formation of the support member 1' itself. Thus, the provision of these bores does not result in any cost increase. Further, since the function of the marking bores 29 is to provide reference points for positional adjustment, these bores may be replaced by any other marks such as marking projections and marking depressions.
Figs. 8 and 9 show a slight modification which differs from the embodiment of Figs. 6 and 7 only in one point.
Specifically, the support member 1' of the modified printing head is formed with a pair of marking slits 29' respectively located at the platen guides 9' near the guiding cutouts 10'.
As previously described, the positional adjustment between the support member 1' and the head circuit board 2 is necessary to bring the platen 11 (see Fig. 2) into intimate line contact with the resistor line 7 of the head circuit board. For this purpose, a central line L (Fig. 7) passing through the guiding cutout10' of each platen guide 9' must be made to coincide with the resistor line 7. Obviously, the reference or standard point should be located as close to the central line L as possible in order to increase the accuracy of positional adjustment.
According to the embodiment of Figs. 6 and 7, each marking bore 15 is disposed comparatively remote from the corresponding guiding cutout 9' transversely of the support member 2'. On the other hand, each marking slit 29' of Figs.
8 and 9 is located much closer to the corresponding guiding cutout 9', thereby serving as a better reference point for accurate positional adjustment.
Further, according to the arrangement of Figs. 8 and 9, even if each platen guide 9' is improperly bent, the positional relation between the guiding cutout 10' and the marking slit 29' is invariable because the marking slit is formed directly on the platen guide. Thus, the marking slit 29' always serves as an accurate reference point relative to the cutout central line L. According the embodiment of Figs.
6 and 7, the positional relation between the guiding cutout 10' and the marking bore 29 varies when the platen guide 9' is improperly bent, thus failing to provide an accurate reference point.
The width of the marking slit 29' may be optionally selected but preferably no more than lmm (e.g. 0.5mm). Of course, the marking slit may be replaced by any other indications which include a marking projection.
The present invention being thus described, it is obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to those skilled in the art are intended to be included within the scope of the following claims.

Claims (11)

1. A thermal printing head comprising: a support member; a head circuit board supported on the support member, the head circuit board carrying a line of heating dots and an array of drive elements for driving the heating dots, the head circuit board further carrying a terminal portion arranged locally in a limited length which is sufficiently smaller than that of the head circuit board; a connector board carrying a terminal portion corresponding to the terminal portion of the head circuit board, the connector board being sufficiently smaller in length than the head circuit board; and a presser member mounted on the support member for pressing the terminal portion of the connector board into intimate contact with the terminal portion of the head circuit board; wherein the presser member having a pressing portion which is sufficiently smaller in length than the head circuit board.
2. The thermal printing head according to claim 1, wherein the presser member further has a covering portion arranged to cover the array of drive elements for protection, the covering portion having a length not smaller than that of the drive element array.
3. The thermal printing head according to claim 1, wherein the array of drive elements is enclosed in an elongate protective body of hard resin, the presser member being arranged clear of the drive element array, the entirety of the presser member being sufficiently smaller in length than the head circuit board.
4. The thermal printing head according to claim 1, wherein the support member is elastically flexible.
5. The thermal printing head according to claim 4, wherein each end df the support member is integrally formed with a platen guide having a guiding cutout for removably receiving a corresponding shaft end of a platen.
6. The thermal printing head according to claim 1, wherein each end of the support member is provided with a platen guide having a guiding cutout for removably receiving a corresponding shaft end of a platen.
7. The thermal printing head according to claim 6, wherein the support member is provided with at least one marking indication located adjacent to the platen guide.
8. The thermal printing head according to claim 7, wherein the marking indication is a marking bore formed in the support member.
9. The thermal printing head according to claim 6, wherein the platen guide is provided with at least one marking indication.
10. The thermal printing head according to claim 9, wherein the marking indication is a marking slit formed at the platen guide.
11. A thermal printing head substantially as described herein with reference to Figures 1 to 9 of the accompanying drawings.
GB9119730A 1991-02-19 1991-09-16 Thermal printing head Expired - Fee Related GB2252939B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3024580A JP2834892B2 (en) 1991-02-19 1991-02-19 Scan head support plate
JP3995391A JP2959857B2 (en) 1991-03-06 1991-03-06 Scan head support plate

Publications (3)

Publication Number Publication Date
GB9119730D0 GB9119730D0 (en) 1991-10-30
GB2252939A true GB2252939A (en) 1992-08-26
GB2252939B GB2252939B (en) 1994-10-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB9119730A Expired - Fee Related GB2252939B (en) 1991-02-19 1991-09-16 Thermal printing head

Country Status (3)

Country Link
KR (1) KR960010516B1 (en)
FR (1) FR2672844B1 (en)
GB (1) GB2252939B (en)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
FR2680722A1 (en) * 1991-09-03 1993-03-05 Rohm Co Ltd THERMAL PRINTHEAD.

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Publication number Priority date Publication date Assignee Title
EP3566876B1 (en) * 2018-05-08 2020-08-26 APS Trading OOD Compact thermal printing mechanism

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US4259676A (en) * 1979-07-30 1981-03-31 Santek, Inc. Thermal print head
EP0115872A2 (en) * 1983-02-08 1984-08-15 Toppan Printing Co., Ltd. Thermal head
WO1987000353A1 (en) * 1985-06-27 1987-01-15 Ncr Corporation Thermal printer
EP0400615A1 (en) * 1989-06-01 1990-12-05 Asea Brown Boveri Ab Thermal print head

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US4259676A (en) * 1979-07-30 1981-03-31 Santek, Inc. Thermal print head
EP0115872A2 (en) * 1983-02-08 1984-08-15 Toppan Printing Co., Ltd. Thermal head
WO1987000353A1 (en) * 1985-06-27 1987-01-15 Ncr Corporation Thermal printer
EP0400615A1 (en) * 1989-06-01 1990-12-05 Asea Brown Boveri Ab Thermal print head

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Publication number Priority date Publication date Assignee Title
FR2680722A1 (en) * 1991-09-03 1993-03-05 Rohm Co Ltd THERMAL PRINTHEAD.

Also Published As

Publication number Publication date
KR920017438A (en) 1992-09-26
FR2672844B1 (en) 1993-05-21
GB9119730D0 (en) 1991-10-30
FR2672844A1 (en) 1992-08-21
KR960010516B1 (en) 1996-08-02
GB2252939B (en) 1994-10-05

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Effective date: 20020916