GB2240114A - Film nucleation process for growing diamond film - Google Patents
Film nucleation process for growing diamond film Download PDFInfo
- Publication number
- GB2240114A GB2240114A GB9001166A GB9001166A GB2240114A GB 2240114 A GB2240114 A GB 2240114A GB 9001166 A GB9001166 A GB 9001166A GB 9001166 A GB9001166 A GB 9001166A GB 2240114 A GB2240114 A GB 2240114A
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- GB
- United Kingdom
- Prior art keywords
- diamond
- film
- substrate
- nucleation
- nucleated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/272—Diamond only using DC, AC or RF discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0236—Pretreatment of the material to be coated by cleaning or etching by etching with a reactive gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
A diamond film is provided on a substrate surface such as an infra-red element, e.g. a zinc sulphide window, for its surface protection, by a nucleation and growth process, in which a multiphase carbon film is deposited on the surface, etched with atomic hydrogen to remove preferentially non<diamond phases whereby to provide a surface nucleated with diamond nucleation centres, and a diamond film is grown on said nucleated surface. Layers of germanium, silicon or boron may be interspersed between the initially deposited carbon film and the diamond film. The carbon films may be deposited from methane or carbon monoxide.
Description
FILM NUCLEATION PROCESS
This invention relates to a process for surface nucleation and growth of surface films, and in particular to the growth of diamond films, e.g. for the surface protection of infra-red optical elements or for the construction of infra-red windows.
Conventional long wavelength infra-red optical elements are generally manufactured from zinc sulphide (ZnS). This material has acceptable optical properties, but suffers from the disadvantage that its surface is subject to abrasive damage. It has been proposed to provide such devices with a protective diamond or diamond like surface film to provide a high degree of abrasion resistance. However, current processes for the formation of such films suffer from poor nucleation, high substrate temperatures and low growth rates.
Nucleation is a particular problem generally involving severe mechanical damage to the substrate surface and further requiring carbide forming substrate materials to achieve nucleation densities sufficiently high for the provision of coating with small grains and a smooth surface. A proposed solution to this problem is described in US Patent No. 4,767,517. This document describes a process in which sputtering of a graphite target produces particles having a diamond structure.
The films produced by that technique provide abrasion resistance, but are not of sufficient optical quality for use with infra-red elements.
The object of the present invention is to minimise or to overcome the above disadvantages.
According to the invention there is provided a process for growing a diamond structure film on a substrate surface, The process including depositing a multiphase carbon film on the surface, selectively etching the film with atomic hydrogen to remove preferentially non-diamond phases whereby to provide a surface nucleated with diamond nucleation centres, and growing a diamond film on said nucleated surface.
We have found that atomic hydrogen, e.g. from a radio frequency hydrogen plasma, preferentially etches graphitic and other non-diamond phases from a multiphase or glassy carbon film to provide a surface having diamond-like nucleation centres from which a diamond or diamond-like film can then be grown. Preferably the plasma is a pulsed radio frequency plasma.
An embodiment of the invention will now be described with reference to the accompanying drawings in which:
Fig. 1 is a schematic diagram of a plasma deposition/etching apparatus; and
Figs. 2 to 4 illustrate successive stages in the deposition of a diamond coating on a substrate surface.
Referring to Fig. 1, the plasma deposition/etching apparatus includes a reactor chamber 11 having an inlet 110 whereby gases are supplied to the chamber, and an outlet 111 whereby the chamber may be evacuated via a vacuum pump 12. Typically the reactor chamber comprises an insulating, e.g. quartz tube 112 sealed by end plates 113. A throttle valve 13 controls the evacuation rate and thus controls the gas or vapour pressure within the chamber 11. Deposition and/or etching are effected with an electrically conductive hollow cathode structure 14 within which a substrate 15 is mounted. Typically the hollow cathode structure comprises a cup-like member 141 partially closed by an annular plate member 142. A grounded plate electrode 16 is mounted adjacent the cathode structure 14.Pulsed radio frequency energy is applied to the reactor chamber from a generator 17 via a coupling coil 18.
Advantageously the hollow cathode is water cooled to prevent excessive heating of the substrate 15. A plasma generated in the reactor chamber extends into the hollow cathode. Typically we employ an energy density of about 75 watts/cc to achieve substantially complete dissociation of the plasma. In some applications an impedance matching transformer (not shown) may be employed to couple the generator 17 to the reactor chamber 11.
In use, an electrical bias appears between the grounded plate electrode 16 and the cathode 14. The plasma is substantially fully dissociated by each generator pulse and comprises a mixture of electrons and ions. Electrons have a high mobility, and those near to the grounded electrode 16 migrate to that electrode.
The result of this charge migration is to provide the cathode 14 with a positive electrical bias, typically of 300 to 1000 volts. This electrical bias of the cathode provides negative ion bombardment of the substrate 15.
We have found that this results in an improvement of both deposition and etching.
Typically the vapour presence within the reactor is from about 200 torr to 50 torr (equivalent to 26.7 to 6667 neutrons/m2).
Referring now to Figs. 2 to 4, in a typical process a multiphase or glassy carbon film 21 (Fig. 2) is formed e.g. on a zinc sulphide substrate surface 22, by deposition from a pulsed radio frequency hydrocarbon plasma of a saturated hydrocarbon. Typically we employ methane for this purpose.
The multiphase carbon film is then exposed to a pulsed radio frequency hydrogen plasma whereby atomic hydrogen preferentially etches the non-diamond phases from the carbon film to leave areas of diamond nucleation 31 (Fig. 3). In some applications a small quantity of a halogen, e.g. bromine or iodine may be incorporated in the plasma to enhance the selectivity of the etching process.
The nucleated surface provides a diamond crystal seed layer or subsequent homo-epitaxial diamond growth to form a polycrystalline film 41 (Fig. 4). This may be effected by deposition from a pulsed radio frequency plasma of a saturated hydrocarbon such as methane, or of carbon monoxide. In order to minimise thermal expansion mismatch problems, the substrate temperature should not exceed 6000C during the growth process. Preferably the diamond growth should take place under conditions of high electron density and high negative ion concentration. Such conditions are provided by the hollow cathode technique described above.
We have also found that increased diamond growth rates are obtained by incorporation of a small quantity of water in the plasma. This is thought to increase the concentration of atomic hydrogen in the plasma.
In some applications, where thicker diamond films are required, the effects of columnar grain structure and grain growth may result in significant optical scattering loss in the film; This effect may be overcome by the use of a layer structure employing interspersed layers of germanium, silicon or boron.
Such interspersed layers provide a limitation of grain size during growth whilst maintaining a suitable growth surface.
Claims (9)
1. A process for growing a diamond structure film on a substrate surface, The process including depositing a multiphase carbon film on the surface, selectively etching the film with atomic hydrogen to remove preferentially non-diamond phases whereby to provide a surface nucleated with diamond nucleation centres, and growing a diamond film on said nucleated surface.
2. A process as claimed in claim 1, wherein the multiphase carbon film is deposited from a pulsed radio frequency plasma of a saturated hydrocarbon.
3. A process as claimed in claim 1 or 2, wherein said atomic hydrogen etching is performed in the presence of bromine, iodine or mixtures thereof.
4. A process as claimed in claim 1, 2 or 3, wherein a positive electrical bias is applied to the substrate whereby to effect negative ion bombardment of the substrate.
5. A process as claimed in claim 4, wherein said electrical bias is between 300 and 1000 volts.
6. A process as claimed in any one of claims 1 to 5, wherein the substrate is mounted within a hollow cathode structure.
7. A process as claimed in any one of claims 1 to 6, wherein said substrate comprises zinc sulphide.
8. A diamond film nucleation and growth process substantially as described herein with reference to the accompanying drawings.
9. An infra-red element provided with a diamond coating by a process as claimed in any one of claims 1 to 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9001166A GB2240114B (en) | 1990-01-18 | 1990-01-18 | Film nucleation process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9001166A GB2240114B (en) | 1990-01-18 | 1990-01-18 | Film nucleation process |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9001166D0 GB9001166D0 (en) | 1990-06-13 |
GB2240114A true GB2240114A (en) | 1991-07-24 |
GB2240114B GB2240114B (en) | 1993-03-24 |
Family
ID=10669519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9001166A Expired - Fee Related GB2240114B (en) | 1990-01-18 | 1990-01-18 | Film nucleation process |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2240114B (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2247692A (en) * | 1990-09-01 | 1992-03-11 | Atomic Energy Authority Uk | Preparing diamond-like carbon coatings involving a foundation layer; apparatus therefor |
WO1993005207A1 (en) * | 1991-09-03 | 1993-03-18 | Chang R P H | Method of nucleating diamond and article produced thereby |
WO1993013242A1 (en) * | 1991-12-20 | 1993-07-08 | North Carolina State University | Nucleation enhancement for chemical vapor deposition of diamond |
GB2263709A (en) * | 1992-01-28 | 1993-08-04 | Ngk Spark Plug Co | Method for producing silicon nitride based members coated with synthetic diamond |
EP0622473A1 (en) * | 1993-04-29 | 1994-11-02 | Norton Company | Method for making a diamond coated structure |
WO1994027323A1 (en) * | 1993-05-06 | 1994-11-24 | Kobe Steel Europe Limited | Preparation of nucleated silicon surfaces |
EP0854205A1 (en) * | 1997-01-16 | 1998-07-22 | Nissin Electric Company, Limited | Work surface treatment method and work surface treatment apparatus |
WO2000018981A1 (en) * | 1998-09-29 | 2000-04-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for diamond-coating surfaces |
US6253704B1 (en) * | 1995-10-13 | 2001-07-03 | Mattson Technology, Inc. | Apparatus and method for pulsed plasma processing of a semiconductor substrate |
US6794301B2 (en) | 1995-10-13 | 2004-09-21 | Mattson Technology, Inc. | Pulsed plasma processing of semiconductor substrates |
CN114934264A (en) * | 2022-05-27 | 2022-08-23 | 南方科技大学 | High-transmittance wear-resistant light-transmitting material and preparation method and application thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2109012A (en) * | 1981-10-21 | 1983-05-25 | Rca Corp | Novel and improved diamond like film and process for producing same |
GB2128637A (en) * | 1982-09-28 | 1984-05-02 | Technion Res & Dev Foundation | Depositing a carbon film on a substrate |
EP0183254A2 (en) * | 1984-11-29 | 1986-06-04 | Matsushita Electric Industrial Co., Ltd. | Plasma CVD apparatus and method for forming a diamond-like carbon film |
EP0238085A2 (en) * | 1986-03-20 | 1987-09-23 | The Perkin-Elmer Corporation | Improved diamond-like carbon films and process for production thereof |
EP0272418A2 (en) * | 1986-12-22 | 1988-06-29 | General Electric Company | Apparatus and process to condensate diamond |
US4756794A (en) * | 1987-08-31 | 1988-07-12 | The United States Of America As Represented By The Secretary Of The Navy | Atomic layer etching |
-
1990
- 1990-01-18 GB GB9001166A patent/GB2240114B/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2109012A (en) * | 1981-10-21 | 1983-05-25 | Rca Corp | Novel and improved diamond like film and process for producing same |
GB2128637A (en) * | 1982-09-28 | 1984-05-02 | Technion Res & Dev Foundation | Depositing a carbon film on a substrate |
EP0183254A2 (en) * | 1984-11-29 | 1986-06-04 | Matsushita Electric Industrial Co., Ltd. | Plasma CVD apparatus and method for forming a diamond-like carbon film |
EP0238085A2 (en) * | 1986-03-20 | 1987-09-23 | The Perkin-Elmer Corporation | Improved diamond-like carbon films and process for production thereof |
EP0272418A2 (en) * | 1986-12-22 | 1988-06-29 | General Electric Company | Apparatus and process to condensate diamond |
US4756794A (en) * | 1987-08-31 | 1988-07-12 | The United States Of America As Represented By The Secretary Of The Navy | Atomic layer etching |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2247692B (en) * | 1990-09-01 | 1995-01-18 | Atomic Energy Authority Uk | Diamond-like carbon coatings |
GB2247692A (en) * | 1990-09-01 | 1992-03-11 | Atomic Energy Authority Uk | Preparing diamond-like carbon coatings involving a foundation layer; apparatus therefor |
WO1993005207A1 (en) * | 1991-09-03 | 1993-03-18 | Chang R P H | Method of nucleating diamond and article produced thereby |
WO1993013242A1 (en) * | 1991-12-20 | 1993-07-08 | North Carolina State University | Nucleation enhancement for chemical vapor deposition of diamond |
US5626908A (en) * | 1992-01-28 | 1997-05-06 | Ngk Spark Plug Co., Ltd. | Method for producing silicon nitride based member coated with film of diamond |
GB2263709B (en) * | 1992-01-28 | 1994-09-28 | Ngk Spark Plug Co | Method for producing silicon nitride based members with synthetic diamond |
GB2263709A (en) * | 1992-01-28 | 1993-08-04 | Ngk Spark Plug Co | Method for producing silicon nitride based members coated with synthetic diamond |
EP0622473A1 (en) * | 1993-04-29 | 1994-11-02 | Norton Company | Method for making a diamond coated structure |
WO1994027323A1 (en) * | 1993-05-06 | 1994-11-24 | Kobe Steel Europe Limited | Preparation of nucleated silicon surfaces |
US6253704B1 (en) * | 1995-10-13 | 2001-07-03 | Mattson Technology, Inc. | Apparatus and method for pulsed plasma processing of a semiconductor substrate |
US6395641B2 (en) | 1995-10-13 | 2002-05-28 | Mattson Techonolgy, Inc. | Apparatus and method for pulsed plasma processing of a semiconductor substrate |
US6794301B2 (en) | 1995-10-13 | 2004-09-21 | Mattson Technology, Inc. | Pulsed plasma processing of semiconductor substrates |
EP0854205A1 (en) * | 1997-01-16 | 1998-07-22 | Nissin Electric Company, Limited | Work surface treatment method and work surface treatment apparatus |
US6165376A (en) * | 1997-01-16 | 2000-12-26 | Nissin Electric Co., Ltd. | Work surface treatment method and work surface treatment apparatus |
WO2000018981A1 (en) * | 1998-09-29 | 2000-04-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for diamond-coating surfaces |
CN114934264A (en) * | 2022-05-27 | 2022-08-23 | 南方科技大学 | High-transmittance wear-resistant light-transmitting material and preparation method and application thereof |
Also Published As
Publication number | Publication date |
---|---|
GB2240114B (en) | 1993-03-24 |
GB9001166D0 (en) | 1990-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20000118 |